JP2016192568A5 - - Google Patents

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Publication number
JP2016192568A5
JP2016192568A5 JP2016128797A JP2016128797A JP2016192568A5 JP 2016192568 A5 JP2016192568 A5 JP 2016192568A5 JP 2016128797 A JP2016128797 A JP 2016128797A JP 2016128797 A JP2016128797 A JP 2016128797A JP 2016192568 A5 JP2016192568 A5 JP 2016192568A5
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JP
Japan
Prior art keywords
wiring
electronic component
layer
insulating layer
substrate according
Prior art date
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JP2016128797A
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English (en)
Japanese (ja)
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JP6325605B2 (ja
JP2016192568A (ja
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Priority claimed from KR1020130103276A external-priority patent/KR101514539B1/ko
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Publication of JP2016192568A publication Critical patent/JP2016192568A/ja
Publication of JP2016192568A5 publication Critical patent/JP2016192568A5/ja
Application granted granted Critical
Publication of JP6325605B2 publication Critical patent/JP6325605B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016128797A 2013-08-29 2016-06-29 電子部品内蔵基板 Expired - Fee Related JP6325605B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130103276A KR101514539B1 (ko) 2013-08-29 2013-08-29 전자부품 내장기판
KR10-2013-0103276 2013-08-29

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2014043573A Division JP6023107B2 (ja) 2013-08-29 2014-03-06 電子部品内蔵基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2016192568A JP2016192568A (ja) 2016-11-10
JP2016192568A5 true JP2016192568A5 (cg-RX-API-DMAC10.html) 2017-03-30
JP6325605B2 JP6325605B2 (ja) 2018-05-16

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014043573A Expired - Fee Related JP6023107B2 (ja) 2013-08-29 2014-03-06 電子部品内蔵基板及びその製造方法
JP2016128797A Expired - Fee Related JP6325605B2 (ja) 2013-08-29 2016-06-29 電子部品内蔵基板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2014043573A Expired - Fee Related JP6023107B2 (ja) 2013-08-29 2014-03-06 電子部品内蔵基板及びその製造方法

Country Status (3)

Country Link
US (1) US9516740B2 (cg-RX-API-DMAC10.html)
JP (2) JP6023107B2 (cg-RX-API-DMAC10.html)
KR (1) KR101514539B1 (cg-RX-API-DMAC10.html)

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KR102164793B1 (ko) * 2018-08-16 2020-10-14 삼성전자주식회사 수동부품 내장기판
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CN109300882A (zh) * 2018-09-20 2019-02-01 蔡亲佳 堆叠嵌入式封装结构及其制作方法
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KR102776264B1 (ko) * 2019-12-19 2025-03-07 삼성전기주식회사 전자부품 내장기판
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KR102576178B1 (ko) * 2021-07-14 2023-09-07 주식회사 티에스이 테스트 소켓, 그 테스트 소켓을 포함하는 테스트 장치, 및 그 테스트 소켓 제조방법
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