JP2016154224A5 - - Google Patents
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- JP2016154224A5 JP2016154224A5 JP2016013176A JP2016013176A JP2016154224A5 JP 2016154224 A5 JP2016154224 A5 JP 2016154224A5 JP 2016013176 A JP2016013176 A JP 2016013176A JP 2016013176 A JP2016013176 A JP 2016013176A JP 2016154224 A5 JP2016154224 A5 JP 2016154224A5
- Authority
- JP
- Japan
- Prior art keywords
- consumable part
- chamber
- void
- trigger feature
- trigger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 33
- 239000011800 void material Substances 0.000 claims description 31
- 238000007689 inspection Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004590 computer program Methods 0.000 claims description 4
- 238000002604 ultrasonography Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000001429 visible spectrum Methods 0.000 claims description 2
- 230000001960 triggered effect Effects 0.000 claims 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021001266A JP7326359B2 (ja) | 2015-01-28 | 2021-01-07 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562109016P | 2015-01-28 | 2015-01-28 | |
| US62/109,016 | 2015-01-28 | ||
| US14/961,756 US10041868B2 (en) | 2015-01-28 | 2015-12-07 | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
| US14/961,756 | 2015-12-07 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021001266A Division JP7326359B2 (ja) | 2015-01-28 | 2021-01-07 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016154224A JP2016154224A (ja) | 2016-08-25 |
| JP2016154224A5 true JP2016154224A5 (https=) | 2019-03-07 |
| JP6822767B2 JP6822767B2 (ja) | 2021-01-27 |
Family
ID=55272240
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016013176A Active JP6822767B2 (ja) | 2015-01-28 | 2016-01-27 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
| JP2021001266A Active JP7326359B2 (ja) | 2015-01-28 | 2021-01-07 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021001266A Active JP7326359B2 (ja) | 2015-01-28 | 2021-01-07 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10041868B2 (https=) |
| EP (1) | EP3051572A1 (https=) |
| JP (2) | JP6822767B2 (https=) |
| KR (1) | KR102619257B1 (https=) |
| CN (2) | CN110349827B (https=) |
| SG (1) | SG10201600630PA (https=) |
| TW (1) | TWI723004B (https=) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10041868B2 (en) * | 2015-01-28 | 2018-08-07 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
| KR102424818B1 (ko) * | 2015-05-27 | 2022-07-25 | 도쿄엘렉트론가부시키가이샤 | 플라즈마 처리 장치 및 포커스 링 |
| US10177018B2 (en) | 2016-08-11 | 2019-01-08 | Applied Materials, Inc. | Process kit erosion and service life prediction |
| US20180061696A1 (en) * | 2016-08-23 | 2018-03-01 | Applied Materials, Inc. | Edge ring or process kit for semiconductor process module |
| US10655224B2 (en) * | 2016-12-20 | 2020-05-19 | Lam Research Corporation | Conical wafer centering and holding device for semiconductor processing |
| JP2018107264A (ja) * | 2016-12-26 | 2018-07-05 | 東京エレクトロン株式会社 | 消耗判定方法及びプラズマ処理装置 |
| KR102658105B1 (ko) * | 2017-05-31 | 2024-04-16 | 램 리써치 코포레이션 | 튜닝가능/교체가능한 에지 커플링 링에 대한 검출 시스템 |
| CN107578975B (zh) * | 2017-08-17 | 2020-06-19 | 北京北方华创微电子装备有限公司 | 反应腔室及半导体加工设备 |
| US10937637B2 (en) | 2017-08-31 | 2021-03-02 | Applied Materials, Inc. | Determining susceptor service life in a plasma processing chamber |
| US10895539B2 (en) * | 2017-10-20 | 2021-01-19 | Lam Research Corporation | In-situ chamber clean end point detection systems and methods using computer vision systems |
| US11067515B2 (en) * | 2017-11-28 | 2021-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for inspecting a wafer process chamber |
| CN120221492A (zh) * | 2017-12-05 | 2025-06-27 | 朗姆研究公司 | 用于边缘环损耗补偿的系统和方法 |
| TWI780093B (zh) * | 2017-12-15 | 2022-10-11 | 美商蘭姆研究公司 | 用於電漿腔室的環結構及系統 |
| DE102018107135A1 (de) * | 2018-03-26 | 2019-09-26 | Aixtron Se | Mit einer individuellen Kennung versehenes Bauteil einer CVD-Vorrichtung sowie Verfahren zur Übermittlung von Informationen |
| CN111954922B (zh) * | 2018-04-09 | 2025-05-02 | 朗姆研究公司 | 使用有机硅前体修饰晶片表面的疏水性 |
| JP7138474B2 (ja) * | 2018-05-15 | 2022-09-16 | 東京エレクトロン株式会社 | 部品の修復方法及び基板処理システム |
| US10651097B2 (en) * | 2018-08-30 | 2020-05-12 | Lam Research Corporation | Using identifiers to map edge ring part numbers onto slot numbers |
| JP7211896B2 (ja) * | 2018-11-30 | 2023-01-24 | 東京エレクトロン株式会社 | プラズマ処理装置、算出方法および算出プログラム |
| WO2020180656A1 (en) * | 2019-03-06 | 2020-09-10 | Lam Research Corporation | Measurement system to measure a thickness of an adjustable edge ring for a substrate processing system |
| US11279032B2 (en) | 2019-04-11 | 2022-03-22 | Applied Materials, Inc. | Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots |
| US12009236B2 (en) * | 2019-04-22 | 2024-06-11 | Applied Materials, Inc. | Sensors and system for in-situ edge ring erosion monitor |
| US12165905B2 (en) | 2019-05-20 | 2024-12-10 | Applied Materials, Inc. | Process kit enclosure system |
| US10964584B2 (en) | 2019-05-20 | 2021-03-30 | Applied Materials, Inc. | Process kit ring adaptor |
| US11913777B2 (en) * | 2019-06-11 | 2024-02-27 | Applied Materials, Inc. | Detector for process kit ring wear |
| US11626305B2 (en) | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| KR102689653B1 (ko) * | 2019-06-26 | 2024-07-31 | 삼성전자주식회사 | 센서 모듈 및 이를 구비하는 식각 장치 |
| US11211269B2 (en) | 2019-07-19 | 2021-12-28 | Applied Materials, Inc. | Multi-object capable loadlock system |
| JP7615119B2 (ja) * | 2019-07-29 | 2025-01-16 | ラム リサーチ コーポレーション | 基板処理システムの自律的な制御及び検査のためのハードウェア・ソフトウェア統合型コンピュータビジョンシステム |
| JP2021040076A (ja) * | 2019-09-04 | 2021-03-11 | 東京エレクトロン株式会社 | 環状部材、基板処理装置及び基板処理装置の制御方法 |
| JP7603668B2 (ja) * | 2019-09-25 | 2024-12-20 | ラム リサーチ コーポレーション | 光干渉法および反射率測定法を使用した半導体機器の自律プロセス制御および最適化のためのシステムおよび方法 |
| US12215966B2 (en) * | 2019-12-06 | 2025-02-04 | Applied Materials, Inc. | Methods and systems of optical inspection of electronic device manufacturing machines |
| US11370114B2 (en) | 2019-12-09 | 2022-06-28 | Applied Materials, Inc. | Autoteach enclosure system |
| JP7401284B2 (ja) * | 2019-12-12 | 2023-12-19 | 東京エレクトロン株式会社 | 基板処理装置 |
| US12354895B2 (en) * | 2019-12-19 | 2025-07-08 | Lam Research Corporation | Encapsulated RFID in consumable chamber parts |
| KR102822822B1 (ko) * | 2020-02-25 | 2025-06-19 | 에스케이하이닉스 주식회사 | 에지링 모니터링 장치, 에지링 관리 시스템 및 방법 |
| US12486120B2 (en) | 2020-03-23 | 2025-12-02 | Applied Materials, Inc. | Substrate processing system carrier |
| US12027397B2 (en) | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
| US11924972B2 (en) | 2020-06-02 | 2024-03-05 | Applied Materials, Inc. | Diagnostic disc with a high vacuum and temperature tolerant power source |
| USD980176S1 (en) | 2020-06-02 | 2023-03-07 | Applied Materials, Inc. | Substrate processing system carrier |
| US11589474B2 (en) * | 2020-06-02 | 2023-02-21 | Applied Materials, Inc. | Diagnostic disc with a high vacuum and temperature tolerant power source |
| USD954769S1 (en) | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
| JP7507639B2 (ja) * | 2020-09-02 | 2024-06-28 | 東京エレクトロン株式会社 | 基板処理システム及び状態監視方法 |
| US11284018B1 (en) | 2020-09-15 | 2022-03-22 | Applied Materials, Inc. | Smart camera substrate |
| CN112525745B (zh) * | 2020-11-03 | 2022-07-12 | 北京科技大学 | 中间包内衬耐材冲刷侵蚀的物理模拟试验装置及使用方法 |
| US12159795B2 (en) | 2021-03-08 | 2024-12-03 | Applied Materials, Inc. | Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall |
| CN117795638A (zh) * | 2021-05-24 | 2024-03-29 | 朗姆研究公司 | 多区段等离子体约束环结构 |
| CN115527825B (zh) * | 2021-06-25 | 2026-03-17 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理设备、检测装置及其运行方法 |
| KR102632552B1 (ko) | 2021-07-23 | 2024-02-02 | 한국표준과학연구원 | 플라즈마 진단기능 및 유전체 두께 측정기능을 갖는 센서, 이를 구비하는 공정장치 및 공정시스템 |
| WO2023023444A1 (en) * | 2021-08-17 | 2023-02-23 | Tokyo Electron Limited | Optical sensors for measuring properties of consumable parts in a semiconductor plasma processing chamber |
| KR102669203B1 (ko) * | 2021-11-16 | 2024-05-24 | 주식회사 에스피에스글로벌 | 반도체 제조용 웨이퍼 오리엔터-가스제거 챔버 테스트 시스템 및 그의 테스트 방법 |
| US20250290818A1 (en) * | 2022-05-19 | 2025-09-18 | Lam Research Corporation | Replacement signaling seal |
| JP7305076B1 (ja) * | 2022-09-01 | 2023-07-07 | 三菱電機株式会社 | データ収集分析システム、測定データ収集ユニット、および、データ収集分析方法 |
| US12528207B2 (en) | 2022-12-12 | 2026-01-20 | Applied Materials, Inc. | Carrier with rotation prevention feature |
| WO2025127100A1 (ja) * | 2023-12-15 | 2025-06-19 | 東京エレクトロン株式会社 | 情報処理方法、コンピュータプログラム、情報処理装置及び基板処理システム |
| KR102884864B1 (ko) * | 2025-02-21 | 2025-11-12 | (주)청명 | 비전 부품 검사 장비 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4545882A (en) * | 1983-09-02 | 1985-10-08 | Shatterproof Glass Corporation | Method and apparatus for detecting sputtering target depletion |
| CH669609A5 (https=) | 1986-12-23 | 1989-03-31 | Balzers Hochvakuum | |
| JP4184638B2 (ja) * | 2001-08-31 | 2008-11-19 | 株式会社東芝 | 半導体製造装置の寿命診断方法 |
| US6894769B2 (en) | 2002-12-31 | 2005-05-17 | Tokyo Electron Limited | Monitoring erosion of system components by optical emission |
| US7001482B2 (en) * | 2003-11-12 | 2006-02-21 | Tokyo Electron Limited | Method and apparatus for improved focus ring |
| US7110110B2 (en) * | 2003-12-29 | 2006-09-19 | Tokyo Electron Limited | Sensing component used to monitor material buildup and material erosion of consumables by optical emission |
| US7233878B2 (en) | 2004-01-30 | 2007-06-19 | Tokyo Electron Limited | Method and system for monitoring component consumption |
| US7350476B2 (en) * | 2004-12-22 | 2008-04-01 | Tokyo Electron Limited | Method and apparatus to determine consumable part condition |
| JP2006196716A (ja) * | 2005-01-14 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 半導体製造装置および半導体装置の製造方法 |
| JP4409459B2 (ja) * | 2005-02-17 | 2010-02-03 | 東京エレクトロン株式会社 | プラズマ処理装置およびその部品と部品の寿命検出方法 |
| US7891536B2 (en) * | 2005-09-26 | 2011-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD target with end of service life detection capability |
| US8317160B2 (en) * | 2007-10-12 | 2012-11-27 | Safeworks, Llc | Restraint device for traction sheaves |
| TWM346890U (en) * | 2008-08-19 | 2008-12-11 | Bor Ger Co Ltd | Mini portable memory device |
| JP5595795B2 (ja) * | 2009-06-12 | 2014-09-24 | 東京エレクトロン株式会社 | プラズマ処理装置用の消耗部品の再利用方法 |
| US9744582B2 (en) * | 2014-04-30 | 2017-08-29 | Fca Us Llc | Wear tolerance indicator for stamping dies |
| US10041868B2 (en) * | 2015-01-28 | 2018-08-07 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
-
2015
- 2015-12-07 US US14/961,756 patent/US10041868B2/en active Active
-
2016
- 2016-01-26 EP EP16152692.6A patent/EP3051572A1/en not_active Withdrawn
- 2016-01-27 SG SG10201600630PA patent/SG10201600630PA/en unknown
- 2016-01-27 KR KR1020160010051A patent/KR102619257B1/ko active Active
- 2016-01-27 TW TW105102423A patent/TWI723004B/zh active
- 2016-01-27 JP JP2016013176A patent/JP6822767B2/ja active Active
- 2016-01-28 CN CN201910445940.4A patent/CN110349827B/zh active Active
- 2016-01-28 CN CN201610060456.6A patent/CN105823781B/zh active Active
-
2018
- 2018-08-07 US US16/057,602 patent/US10697874B2/en active Active
-
2021
- 2021-01-07 JP JP2021001266A patent/JP7326359B2/ja active Active
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