JP2016154224A5 - - Google Patents
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- JP2016154224A5 JP2016154224A5 JP2016013176A JP2016013176A JP2016154224A5 JP 2016154224 A5 JP2016154224 A5 JP 2016154224A5 JP 2016013176 A JP2016013176 A JP 2016013176A JP 2016013176 A JP2016013176 A JP 2016013176A JP 2016154224 A5 JP2016154224 A5 JP 2016154224A5
- Authority
- JP
- Japan
- Prior art keywords
- consumable part
- chamber
- void
- trigger feature
- trigger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 33
- 239000011800 void material Substances 0.000 claims description 31
- 238000007689 inspection Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000004590 computer program Methods 0.000 claims description 4
- 238000002604 ultrasonography Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000001429 visible spectrum Methods 0.000 claims description 2
- 230000001960 triggered effect Effects 0.000 claims 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021001266A JP7326359B2 (ja) | 2015-01-28 | 2021-01-07 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562109016P | 2015-01-28 | 2015-01-28 | |
| US62/109,016 | 2015-01-28 | ||
| US14/961,756 US10041868B2 (en) | 2015-01-28 | 2015-12-07 | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
| US14/961,756 | 2015-12-07 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021001266A Division JP7326359B2 (ja) | 2015-01-28 | 2021-01-07 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016154224A JP2016154224A (ja) | 2016-08-25 |
| JP2016154224A5 true JP2016154224A5 (https=) | 2019-03-07 |
| JP6822767B2 JP6822767B2 (ja) | 2021-01-27 |
Family
ID=55272240
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016013176A Active JP6822767B2 (ja) | 2015-01-28 | 2016-01-27 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
| JP2021001266A Active JP7326359B2 (ja) | 2015-01-28 | 2021-01-07 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021001266A Active JP7326359B2 (ja) | 2015-01-28 | 2021-01-07 | 半導体製造チャンバ内の消耗部品の余寿命の推定 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US10041868B2 (https=) |
| EP (1) | EP3051572A1 (https=) |
| JP (2) | JP6822767B2 (https=) |
| KR (1) | KR102619257B1 (https=) |
| CN (2) | CN105823781B (https=) |
| SG (1) | SG10201600630PA (https=) |
| TW (1) | TWI723004B (https=) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10041868B2 (en) * | 2015-01-28 | 2018-08-07 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
| US10755902B2 (en) * | 2015-05-27 | 2020-08-25 | Tokyo Electron Limited | Plasma processing apparatus and focus ring |
| US10177018B2 (en) | 2016-08-11 | 2019-01-08 | Applied Materials, Inc. | Process kit erosion and service life prediction |
| US20180061696A1 (en) * | 2016-08-23 | 2018-03-01 | Applied Materials, Inc. | Edge ring or process kit for semiconductor process module |
| US10655224B2 (en) * | 2016-12-20 | 2020-05-19 | Lam Research Corporation | Conical wafer centering and holding device for semiconductor processing |
| JP2018107264A (ja) * | 2016-12-26 | 2018-07-05 | 東京エレクトロン株式会社 | 消耗判定方法及びプラズマ処理装置 |
| WO2018222430A2 (en) * | 2017-05-31 | 2018-12-06 | Lam Research Corporation | Detection system for tunable/replaceable edge coupling ring |
| CN107578975B (zh) * | 2017-08-17 | 2020-06-19 | 北京北方华创微电子装备有限公司 | 反应腔室及半导体加工设备 |
| US10937637B2 (en) * | 2017-08-31 | 2021-03-02 | Applied Materials, Inc. | Determining susceptor service life in a plasma processing chamber |
| US10895539B2 (en) * | 2017-10-20 | 2021-01-19 | Lam Research Corporation | In-situ chamber clean end point detection systems and methods using computer vision systems |
| US11067515B2 (en) * | 2017-11-28 | 2021-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for inspecting a wafer process chamber |
| US11538713B2 (en) | 2017-12-05 | 2022-12-27 | Lam Research Corporation | System and method for edge ring wear compensation |
| TWI780093B (zh) * | 2017-12-15 | 2022-10-11 | 美商蘭姆研究公司 | 用於電漿腔室的環結構及系統 |
| DE102018107135A1 (de) * | 2018-03-26 | 2019-09-26 | Aixtron Se | Mit einer individuellen Kennung versehenes Bauteil einer CVD-Vorrichtung sowie Verfahren zur Übermittlung von Informationen |
| CN111954922B (zh) * | 2018-04-09 | 2025-05-02 | 朗姆研究公司 | 使用有机硅前体修饰晶片表面的疏水性 |
| JP7138474B2 (ja) * | 2018-05-15 | 2022-09-16 | 東京エレクトロン株式会社 | 部品の修復方法及び基板処理システム |
| US10651097B2 (en) * | 2018-08-30 | 2020-05-12 | Lam Research Corporation | Using identifiers to map edge ring part numbers onto slot numbers |
| JP7211896B2 (ja) * | 2018-11-30 | 2023-01-24 | 東京エレクトロン株式会社 | プラズマ処理装置、算出方法および算出プログラム |
| KR102904924B1 (ko) * | 2019-03-06 | 2025-12-26 | 램 리써치 코포레이션 | 기판 프로세싱 시스템을 위한 조정가능한 에지 링의 두께를 측정하기 위한 측정 시스템 |
| US11279032B2 (en) | 2019-04-11 | 2022-03-22 | Applied Materials, Inc. | Apparatus, systems, and methods for improved joint coordinate teaching accuracy of robots |
| US12009236B2 (en) * | 2019-04-22 | 2024-06-11 | Applied Materials, Inc. | Sensors and system for in-situ edge ring erosion monitor |
| US12165905B2 (en) | 2019-05-20 | 2024-12-10 | Applied Materials, Inc. | Process kit enclosure system |
| US10964584B2 (en) | 2019-05-20 | 2021-03-30 | Applied Materials, Inc. | Process kit ring adaptor |
| US11913777B2 (en) * | 2019-06-11 | 2024-02-27 | Applied Materials, Inc. | Detector for process kit ring wear |
| US11626305B2 (en) | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| KR102689653B1 (ko) * | 2019-06-26 | 2024-07-31 | 삼성전자주식회사 | 센서 모듈 및 이를 구비하는 식각 장치 |
| US11211269B2 (en) | 2019-07-19 | 2021-12-28 | Applied Materials, Inc. | Multi-object capable loadlock system |
| CN114450780A (zh) * | 2019-07-29 | 2022-05-06 | 朗姆研究公司 | 用于衬底处理系统的自动化控制及检测的集成式硬件-软件计算机视觉系统 |
| JP2021040076A (ja) * | 2019-09-04 | 2021-03-11 | 東京エレクトロン株式会社 | 環状部材、基板処理装置及び基板処理装置の制御方法 |
| US12424470B2 (en) | 2019-09-25 | 2025-09-23 | Lam Research Corporation | Systems and methods for autonomous process control and optimization of semiconductor equipment using light interferometry and reflectometry |
| US12215966B2 (en) * | 2019-12-06 | 2025-02-04 | Applied Materials, Inc. | Methods and systems of optical inspection of electronic device manufacturing machines |
| US11370114B2 (en) | 2019-12-09 | 2022-06-28 | Applied Materials, Inc. | Autoteach enclosure system |
| JP7401284B2 (ja) * | 2019-12-12 | 2023-12-19 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP7657802B2 (ja) * | 2019-12-19 | 2025-04-07 | ラム リサーチ コーポレーション | 消耗チャンバ部品におけるカプセル化ｒｆｉｄ |
| KR102822822B1 (ko) * | 2020-02-25 | 2025-06-19 | 에스케이하이닉스 주식회사 | 에지링 모니터링 장치, 에지링 관리 시스템 및 방법 |
| US12027397B2 (en) | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
| US12486120B2 (en) | 2020-03-23 | 2025-12-02 | Applied Materials, Inc. | Substrate processing system carrier |
| US11589474B2 (en) | 2020-06-02 | 2023-02-21 | Applied Materials, Inc. | Diagnostic disc with a high vacuum and temperature tolerant power source |
| USD980176S1 (en) | 2020-06-02 | 2023-03-07 | Applied Materials, Inc. | Substrate processing system carrier |
| US11924972B2 (en) | 2020-06-02 | 2024-03-05 | Applied Materials, Inc. | Diagnostic disc with a high vacuum and temperature tolerant power source |
| USD954769S1 (en) | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
| JP7507639B2 (ja) * | 2020-09-02 | 2024-06-28 | 東京エレクトロン株式会社 | 基板処理システム及び状態監視方法 |
| US11284018B1 (en) | 2020-09-15 | 2022-03-22 | Applied Materials, Inc. | Smart camera substrate |
| CN112525745B (zh) * | 2020-11-03 | 2022-07-12 | 北京科技大学 | 中间包内衬耐材冲刷侵蚀的物理模拟试验装置及使用方法 |
| US12159795B2 (en) | 2021-03-08 | 2024-12-03 | Applied Materials, Inc. | Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall |
| CN115527825B (zh) * | 2021-06-25 | 2026-03-17 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理设备、检测装置及其运行方法 |
| KR102632552B1 (ko) | 2021-07-23 | 2024-02-02 | 한국표준과학연구원 | 플라즈마 진단기능 및 유전체 두께 측정기능을 갖는 센서, 이를 구비하는 공정장치 및 공정시스템 |
| KR102911513B1 (ko) * | 2021-08-17 | 2026-01-12 | 도쿄엘렉트론가부시키가이샤 | 반도체 플라즈마 공정 챔버 내의 소모성 부품의 특성을 측정하기 위한 광센서 |
| KR102669203B1 (ko) * | 2021-11-16 | 2024-05-24 | 주식회사 에스피에스글로벌 | 반도체 제조용 웨이퍼 오리엔터-가스제거 챔버 테스트 시스템 및 그의 테스트 방법 |
| JP2025520036A (ja) * | 2022-05-19 | 2025-07-01 | ラム リサーチ コーポレーション | 交換信号伝達シール |
| WO2024047835A1 (ja) * | 2022-09-01 | 2024-03-07 | 三菱電機株式会社 | データ収集分析システム、測定データ収集ユニット、および、データ収集分析方法 |
| US12528207B2 (en) | 2022-12-12 | 2026-01-20 | Applied Materials, Inc. | Carrier with rotation prevention feature |
| WO2025127100A1 (ja) * | 2023-12-15 | 2025-06-19 | 東京エレクトロン株式会社 | 情報処理方法、コンピュータプログラム、情報処理装置及び基板処理システム |
| KR102884864B1 (ko) * | 2025-02-21 | 2025-11-12 | (주)청명 | 비전 부품 검사 장비 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4545882A (en) * | 1983-09-02 | 1985-10-08 | Shatterproof Glass Corporation | Method and apparatus for detecting sputtering target depletion |
| CH669609A5 (https=) | 1986-12-23 | 1989-03-31 | Balzers Hochvakuum | |
| JP4184638B2 (ja) * | 2001-08-31 | 2008-11-19 | 株式会社東芝 | 半導体製造装置の寿命診断方法 |
| US6894769B2 (en) | 2002-12-31 | 2005-05-17 | Tokyo Electron Limited | Monitoring erosion of system components by optical emission |
| US7001482B2 (en) * | 2003-11-12 | 2006-02-21 | Tokyo Electron Limited | Method and apparatus for improved focus ring |
| US7110110B2 (en) * | 2003-12-29 | 2006-09-19 | Tokyo Electron Limited | Sensing component used to monitor material buildup and material erosion of consumables by optical emission |
| US7233878B2 (en) * | 2004-01-30 | 2007-06-19 | Tokyo Electron Limited | Method and system for monitoring component consumption |
| US7350476B2 (en) * | 2004-12-22 | 2008-04-01 | Tokyo Electron Limited | Method and apparatus to determine consumable part condition |
| JP2006196716A (ja) * | 2005-01-14 | 2006-07-27 | Matsushita Electric Ind Co Ltd | 半導体製造装置および半導体装置の製造方法 |
| JP4409459B2 (ja) * | 2005-02-17 | 2010-02-03 | 東京エレクトロン株式会社 | プラズマ処理装置およびその部品と部品の寿命検出方法 |
| US7891536B2 (en) * | 2005-09-26 | 2011-02-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD target with end of service life detection capability |
| US8317160B2 (en) * | 2007-10-12 | 2012-11-27 | Safeworks, Llc | Restraint device for traction sheaves |
| TWM346890U (en) * | 2008-08-19 | 2008-12-11 | Bor Ger Co Ltd | Mini portable memory device |
| JP5595795B2 (ja) * | 2009-06-12 | 2014-09-24 | 東京エレクトロン株式会社 | プラズマ処理装置用の消耗部品の再利用方法 |
| US9744582B2 (en) * | 2014-04-30 | 2017-08-29 | Fca Us Llc | Wear tolerance indicator for stamping dies |
| US10041868B2 (en) * | 2015-01-28 | 2018-08-07 | Lam Research Corporation | Estimation of lifetime remaining for a consumable-part in a semiconductor manufacturing chamber |
-
2015
- 2015-12-07 US US14/961,756 patent/US10041868B2/en active Active
-
2016
- 2016-01-26 EP EP16152692.6A patent/EP3051572A1/en not_active Withdrawn
- 2016-01-27 JP JP2016013176A patent/JP6822767B2/ja active Active
- 2016-01-27 KR KR1020160010051A patent/KR102619257B1/ko active Active
- 2016-01-27 TW TW105102423A patent/TWI723004B/zh active
- 2016-01-27 SG SG10201600630PA patent/SG10201600630PA/en unknown
- 2016-01-28 CN CN201610060456.6A patent/CN105823781B/zh active Active
- 2016-01-28 CN CN201910445940.4A patent/CN110349827B/zh active Active
-
2018
- 2018-08-07 US US16/057,602 patent/US10697874B2/en active Active
-
2021
- 2021-01-07 JP JP2021001266A patent/JP7326359B2/ja active Active
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