JP5435904B2 - 致命傷の検出方法 - Google Patents
致命傷の検出方法 Download PDFInfo
- Publication number
- JP5435904B2 JP5435904B2 JP2008181373A JP2008181373A JP5435904B2 JP 5435904 B2 JP5435904 B2 JP 5435904B2 JP 2008181373 A JP2008181373 A JP 2008181373A JP 2008181373 A JP2008181373 A JP 2008181373A JP 5435904 B2 JP5435904 B2 JP 5435904B2
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- JP
- Japan
- Prior art keywords
- inspection
- luminance
- fatal
- polishing
- flaw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 206010052428 Wound Diseases 0.000 title claims description 58
- 208000027418 Wounds and injury Diseases 0.000 title claims description 58
- 238000007689 inspection Methods 0.000 claims description 187
- 238000000034 method Methods 0.000 claims description 33
- 238000001514 detection method Methods 0.000 claims description 15
- 239000006185 dispersion Substances 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 7
- 235000019557 luminance Nutrition 0.000 description 156
- 238000005498 polishing Methods 0.000 description 74
- 238000009826 distribution Methods 0.000 description 50
- 238000012545 processing Methods 0.000 description 9
- 238000000605 extraction Methods 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005299 abrasion Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000994 depressogenic effect Effects 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Description
2・・・検査対象物
21・・・研磨傷
22・・・致命傷
3・・・画像取得手段
4・・・検査領域抽出手段
51・・・第一の輝度情報抽出手段
52・・・第一の検査方向検出手段
53・・・第一の画像処理手段
61・・・第二の輝度情報抽出手段
62・・・第二の検査方向検出手段
63・・・第二の画像処理手段
7・・・検査手段
8・・・記憶手段
α・・・研磨傷の方向
β・・・致命傷の方向
D1・・・第一の検査方向
D2・・・第二の検査方向
P1・・・取得画像
SQ・・・微小検査領域
Claims (2)
- プリント基板の表面から画像を取得するステップと、
当該取得されたプリント基板の画像から分割された微小検査領域の画像を抽出するステップと、
当該抽出された微小検査領域において、第一の検査方向に並ぶ画素の輝度値合計を取得し、当該取得された輝度情報を前記第一の検査方向と直交する方向に並べた輝度値合計の分散値を求めるステップと、
前記第一の検査方向を変化させて、前記求められた分散値の中で最も大きい検査方向を検出するステップと、
当該検出された検出方向の画素の輝度を修正するステップと、
当該修正された輝度の画素を有する微小検査領域から致命傷を検出するステップと、
を備えたことを特徴とする致命傷の検出方法。 - 請求項1における致命傷の検出方法において、
新たな微小検査領域を検査する場合、隣接する微小検査領域で求められた第一の検査方向を用いるようにした致命傷の検出方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008181373A JP5435904B2 (ja) | 2008-07-11 | 2008-07-11 | 致命傷の検出方法 |
KR1020117002037A KR20110040866A (ko) | 2008-07-11 | 2009-06-30 | 치명상의 검출 방법 |
PCT/JP2009/061958 WO2010004914A1 (ja) | 2008-07-11 | 2009-06-30 | 致命傷の検出方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008181373A JP5435904B2 (ja) | 2008-07-11 | 2008-07-11 | 致命傷の検出方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010019730A JP2010019730A (ja) | 2010-01-28 |
JP5435904B2 true JP5435904B2 (ja) | 2014-03-05 |
Family
ID=41507030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008181373A Active JP5435904B2 (ja) | 2008-07-11 | 2008-07-11 | 致命傷の検出方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5435904B2 (ja) |
KR (1) | KR20110040866A (ja) |
WO (1) | WO2010004914A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102597753B (zh) * | 2009-11-18 | 2014-12-10 | 本田技研工业株式会社 | 表面检查装置以及表面检查方法 |
JP5823794B2 (ja) * | 2011-09-26 | 2015-11-25 | 株式会社総合車両製作所 | 金属板の外観評価方法 |
JP5597176B2 (ja) * | 2011-10-11 | 2014-10-01 | 株式会社フジクラ | プリント配線板の製造方法 |
JP6351408B2 (ja) * | 2014-07-08 | 2018-07-04 | アズビル株式会社 | 画像検査装置および画像検査方法 |
CN114833648B (zh) * | 2022-04-24 | 2023-11-28 | 启东市申力高压油泵厂 | 液压泵轴承磨削工艺中的表面损伤识别及磨削控制方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0682104B2 (ja) * | 1988-09-19 | 1994-10-19 | 松下電工株式会社 | 印刷回路板の外観検査方法 |
JPH0814847B2 (ja) * | 1988-11-15 | 1996-02-14 | 松下電工株式会社 | パターン検査方法 |
JPH10282013A (ja) * | 1997-04-10 | 1998-10-23 | Mitsubishi Rayon Co Ltd | ディスク表面の欠陥検査及び研磨方向認識装置、並びにこれらの使用方法 |
JP3594847B2 (ja) * | 1999-08-30 | 2004-12-02 | 日本板硝子株式会社 | 画像処理方法及び画像処理装置並びに外観検査装置 |
JP2008046109A (ja) * | 2006-07-20 | 2008-02-28 | Toshiba Corp | 基板の欠陥検査装置及び基板の製造方法 |
-
2008
- 2008-07-11 JP JP2008181373A patent/JP5435904B2/ja active Active
-
2009
- 2009-06-30 WO PCT/JP2009/061958 patent/WO2010004914A1/ja active Application Filing
- 2009-06-30 KR KR1020117002037A patent/KR20110040866A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
JP2010019730A (ja) | 2010-01-28 |
WO2010004914A1 (ja) | 2010-01-14 |
KR20110040866A (ko) | 2011-04-20 |
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