JP2016146398A5 - - Google Patents

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Publication number
JP2016146398A5
JP2016146398A5 JP2015022257A JP2015022257A JP2016146398A5 JP 2016146398 A5 JP2016146398 A5 JP 2016146398A5 JP 2015022257 A JP2015022257 A JP 2015022257A JP 2015022257 A JP2015022257 A JP 2015022257A JP 2016146398 A5 JP2016146398 A5 JP 2016146398A5
Authority
JP
Japan
Prior art keywords
semiconductor chip
base plate
power module
solder
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015022257A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016146398A (ja
JP6276721B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2015022257A external-priority patent/JP6276721B2/ja
Priority to JP2015022257A priority Critical patent/JP6276721B2/ja
Priority to PCT/JP2015/084685 priority patent/WO2016125390A1/ja
Priority to CN201580071664.XA priority patent/CN107112319B/zh
Priority to US15/541,861 priority patent/US9960147B2/en
Priority to DE112015005593.2T priority patent/DE112015005593B4/de
Publication of JP2016146398A publication Critical patent/JP2016146398A/ja
Publication of JP2016146398A5 publication Critical patent/JP2016146398A5/ja
Publication of JP6276721B2 publication Critical patent/JP6276721B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015022257A 2015-02-06 2015-02-06 パワーモジュール Active JP6276721B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015022257A JP6276721B2 (ja) 2015-02-06 2015-02-06 パワーモジュール
DE112015005593.2T DE112015005593B4 (de) 2015-02-06 2015-12-10 Leistungsmodul
CN201580071664.XA CN107112319B (zh) 2015-02-06 2015-12-10 功率模块
US15/541,861 US9960147B2 (en) 2015-02-06 2015-12-10 Power module
PCT/JP2015/084685 WO2016125390A1 (ja) 2015-02-06 2015-12-10 パワーモジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015022257A JP6276721B2 (ja) 2015-02-06 2015-02-06 パワーモジュール

Publications (3)

Publication Number Publication Date
JP2016146398A JP2016146398A (ja) 2016-08-12
JP2016146398A5 true JP2016146398A5 (enExample) 2017-02-09
JP6276721B2 JP6276721B2 (ja) 2018-02-07

Family

ID=56563747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015022257A Active JP6276721B2 (ja) 2015-02-06 2015-02-06 パワーモジュール

Country Status (5)

Country Link
US (1) US9960147B2 (enExample)
JP (1) JP6276721B2 (enExample)
CN (1) CN107112319B (enExample)
DE (1) DE112015005593B4 (enExample)
WO (1) WO2016125390A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020240866A1 (ja) * 2019-05-31 2020-12-03 Ｊｘ金属株式会社 半導体デバイス
CN112151565B (zh) * 2019-06-27 2023-01-24 成都辰显光电有限公司 微发光二极管显示面板的制造方法
CN111524883B (zh) 2020-04-29 2022-09-20 业成科技（成都）有限公司 膜内电子组件及其制备方法
JP7356402B2 (ja) * 2020-05-18 2023-10-04 日立Astemo株式会社 パワーモジュール

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935803A (en) 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices
DE19750073A1 (de) 1997-11-12 1999-05-20 Bosch Gmbh Robert Schaltungsträgerplatte
US6427901B2 (en) 1999-06-30 2002-08-06 Lucent Technologies Inc. System and method for forming stable solder bonds
JP2002176128A (ja) * 2000-12-06 2002-06-21 Toyota Motor Corp マルチチップモジュールの冷却構造
JP2003100983A (ja) 2001-09-21 2003-04-04 Kyocera Corp セラミック回路基板
DE10332695A1 (de) 2003-07-18 2005-02-03 Robert Bosch Gmbh Anordnung zur Befestigung eines Bauelements
JP4302607B2 (ja) 2004-01-30 2009-07-29 株式会社デンソー 半導体装置
DE102006058695B4 (de) 2006-12-13 2009-06-25 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit stumpf gelötetem Anschlusselement
WO2009025320A1 (ja) * 2007-08-23 2009-02-26 Daishinku Corporation 電子部品用パッケージ、電子部品用パッケージのベース、および電子部品用パッケージと回路基板との接合構造
EP2720263A4 (en) 2011-06-09 2015-04-22 Mitsubishi Electric Corp SEMICONDUCTOR COMPONENT
JP2013069825A (ja) * 2011-09-22 2013-04-18 Hitachi Automotive Systems Ltd 両面冷却型半導体パワーモジュール
DE102011086687A1 (de) 2011-11-21 2013-05-23 Robert Bosch Gmbh Verfahren zum Kontaktieren eines Halbleiters und Kontaktanordnung für einen Halbleiter
JP6150375B2 (ja) * 2012-12-06 2017-06-21 ルネサスエレクトロニクス株式会社 半導体装置
JP6112077B2 (ja) * 2014-07-03 2017-04-12 トヨタ自動車株式会社 半導体装置
TWI595810B (zh) * 2015-05-22 2017-08-11 欣興電子股份有限公司 封裝結構及其製作方法

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