JP2016135912A5 - - Google Patents
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- Publication number
- JP2016135912A5 JP2016135912A5 JP2015225338A JP2015225338A JP2016135912A5 JP 2016135912 A5 JP2016135912 A5 JP 2016135912A5 JP 2015225338 A JP2015225338 A JP 2015225338A JP 2015225338 A JP2015225338 A JP 2015225338A JP 2016135912 A5 JP2016135912 A5 JP 2016135912A5
- Authority
- JP
- Japan
- Prior art keywords
- sealing element
- substrate
- moment arm
- electrical contact
- body portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 65
- 238000007789 sealing Methods 0.000 claims description 62
- 229920001971 elastomer Polymers 0.000 claims description 22
- 239000000806 elastomer Substances 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 14
- 238000009713 electroplating Methods 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 230000008602 contraction Effects 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462085171P | 2014-11-26 | 2014-11-26 | |
| US62/085,171 | 2014-11-26 | ||
| US14/685,526 US9988734B2 (en) | 2011-08-15 | 2015-04-13 | Lipseals and contact elements for semiconductor electroplating apparatuses |
| US14/685,526 | 2015-04-13 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016135912A JP2016135912A (ja) | 2016-07-28 |
| JP2016135912A5 true JP2016135912A5 (enExample) | 2018-12-27 |
| JP6745103B2 JP6745103B2 (ja) | 2020-08-26 |
Family
ID=56040086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015225338A Active JP6745103B2 (ja) | 2014-11-26 | 2015-11-18 | 半導体電気メッキ装置用のリップシールおよび接触要素 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6745103B2 (enExample) |
| KR (3) | KR102453908B1 (enExample) |
| CN (2) | CN105624754B (enExample) |
| TW (2) | TWI681082B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180251907A1 (en) * | 2017-03-01 | 2018-09-06 | Lam Research Corporation | Wide lipseal for electroplating |
| US10612151B2 (en) * | 2018-02-28 | 2020-04-07 | Lam Research Corporation | Flow assisted dynamic seal for high-convection, continuous-rotation plating |
| JP6963524B2 (ja) * | 2018-03-20 | 2021-11-10 | キオクシア株式会社 | 電解メッキ装置 |
| JP7471778B2 (ja) * | 2019-03-29 | 2024-04-22 | 株式会社日本マイクロニクス | プローブカード |
| JP7264780B2 (ja) | 2019-09-10 | 2023-04-25 | 株式会社荏原製作所 | 基板ホルダ及びそれを備えた基板めっき装置、並びに電気接点 |
| JP2022550449A (ja) * | 2019-10-04 | 2022-12-01 | ラム リサーチ コーポレーション | リップシールプレートアウトを防止するためのウエハ遮蔽 |
| KR20220107012A (ko) | 2019-11-27 | 2022-08-01 | 램 리써치 코포레이션 | 쓰루-레지스트 (through-resist) 도금을 위한 에지 제거 |
| JP7242516B2 (ja) * | 2019-12-13 | 2023-03-20 | 株式会社荏原製作所 | 基板ホルダ |
| WO2021221872A1 (en) | 2020-04-30 | 2021-11-04 | Lam Research Corporation | Lipseal edge exclusion engineering to maintain material integrity at wafer edge |
| CN114645311A (zh) * | 2020-12-18 | 2022-06-21 | 盛美半导体设备(上海)股份有限公司 | 基板保持装置的杯形夹盘及基板保持装置 |
| US20250075364A1 (en) * | 2021-10-18 | 2025-03-06 | Ebara Corporation | Method of plating and apparatus for plating |
| CN113846363B (zh) * | 2021-10-27 | 2022-09-23 | 上海戴丰科技有限公司 | 一种晶圆电镀挂具 |
| CN114351223A (zh) * | 2022-01-18 | 2022-04-15 | 沈阳超夷微电子设备有限公司 | 一种晶圆夹持装置及方法 |
| JP7264545B1 (ja) | 2022-02-22 | 2023-04-25 | 有限会社クズハラゴム | 部分メッキ治具 |
| CN114561682A (zh) * | 2022-03-18 | 2022-05-31 | 厦门大学 | 电镀夹具以及可垂直挂镀和水平旋转电镀的流水线 |
| CN120866914A (zh) * | 2024-04-30 | 2025-10-31 | 盛美半导体设备(上海)股份有限公司 | 晶圆保持装置的夹盘及晶圆保持装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6610190B2 (en) * | 2000-11-03 | 2003-08-26 | Nutool, Inc. | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate |
| US7033465B1 (en) * | 2001-11-30 | 2006-04-25 | Novellus Systems, Inc. | Clamshell apparatus with crystal shielding and in-situ rinse-dry |
| US6755946B1 (en) * | 2001-11-30 | 2004-06-29 | Novellus Systems, Inc. | Clamshell apparatus with dynamic uniformity control |
| US6550484B1 (en) * | 2001-12-07 | 2003-04-22 | Novellus Systems, Inc. | Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing |
| JP3940648B2 (ja) * | 2002-08-07 | 2007-07-04 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | ウェハーのめっき装置 |
| US7087144B2 (en) * | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
| US7005379B2 (en) * | 2004-04-08 | 2006-02-28 | Micron Technology, Inc. | Semiconductor processing methods for forming electrical contacts |
| US7985325B2 (en) * | 2007-10-30 | 2011-07-26 | Novellus Systems, Inc. | Closed contact electroplating cup assembly |
| JP5237924B2 (ja) * | 2008-12-10 | 2013-07-17 | ノベルス・システムズ・インコーポレーテッド | ベースプレート、及び電気メッキ装置 |
| US9512538B2 (en) * | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
| US9228270B2 (en) * | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
| US9309603B2 (en) * | 2011-09-14 | 2016-04-12 | Applied Materials, Inc | Component cleaning in a metal plating apparatus |
-
2015
- 2015-11-18 JP JP2015225338A patent/JP6745103B2/ja active Active
- 2015-11-19 KR KR1020150162613A patent/KR102453908B1/ko active Active
- 2015-11-25 TW TW104139051A patent/TWI681082B/zh active
- 2015-11-25 TW TW108143043A patent/TWI702311B/zh active
- 2015-11-26 CN CN201510837221.9A patent/CN105624754B/zh active Active
- 2015-11-26 CN CN201810986262.8A patent/CN109137029B/zh active Active
-
2022
- 2022-10-06 KR KR1020220127998A patent/KR102641458B1/ko active Active
-
2024
- 2024-02-22 KR KR1020240025954A patent/KR102861606B1/ko active Active
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