JP6745103B2 - 半導体電気メッキ装置用のリップシールおよび接触要素 - Google Patents

半導体電気メッキ装置用のリップシールおよび接触要素 Download PDF

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Publication number
JP6745103B2
JP6745103B2 JP2015225338A JP2015225338A JP6745103B2 JP 6745103 B2 JP6745103 B2 JP 6745103B2 JP 2015225338 A JP2015225338 A JP 2015225338A JP 2015225338 A JP2015225338 A JP 2015225338A JP 6745103 B2 JP6745103 B2 JP 6745103B2
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JP
Japan
Prior art keywords
substrate
sealing element
contact
elastomeric sealing
elastomeric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015225338A
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English (en)
Japanese (ja)
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JP2016135912A (ja
JP2016135912A5 (enExample
Inventor
ジンビン・フェン
ロバート・マーシャル・ストーウェル
シャンティナス・ゴンガディ
アシュウィン・ラメッシュ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novellus Systems Inc
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Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/685,526 external-priority patent/US9988734B2/en
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Publication of JP2016135912A publication Critical patent/JP2016135912A/ja
Publication of JP2016135912A5 publication Critical patent/JP2016135912A5/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP2015225338A 2014-11-26 2015-11-18 半導体電気メッキ装置用のリップシールおよび接触要素 Active JP6745103B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462085171P 2014-11-26 2014-11-26
US62/085,171 2014-11-26
US14/685,526 US9988734B2 (en) 2011-08-15 2015-04-13 Lipseals and contact elements for semiconductor electroplating apparatuses
US14/685,526 2015-04-13

Publications (3)

Publication Number Publication Date
JP2016135912A JP2016135912A (ja) 2016-07-28
JP2016135912A5 JP2016135912A5 (enExample) 2018-12-27
JP6745103B2 true JP6745103B2 (ja) 2020-08-26

Family

ID=56040086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015225338A Active JP6745103B2 (ja) 2014-11-26 2015-11-18 半導体電気メッキ装置用のリップシールおよび接触要素

Country Status (4)

Country Link
JP (1) JP6745103B2 (enExample)
KR (3) KR102453908B1 (enExample)
CN (2) CN105624754B (enExample)
TW (2) TWI681082B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180251907A1 (en) * 2017-03-01 2018-09-06 Lam Research Corporation Wide lipseal for electroplating
US10612151B2 (en) * 2018-02-28 2020-04-07 Lam Research Corporation Flow assisted dynamic seal for high-convection, continuous-rotation plating
JP6963524B2 (ja) * 2018-03-20 2021-11-10 キオクシア株式会社 電解メッキ装置
JP7471778B2 (ja) * 2019-03-29 2024-04-22 株式会社日本マイクロニクス プローブカード
JP7264780B2 (ja) 2019-09-10 2023-04-25 株式会社荏原製作所 基板ホルダ及びそれを備えた基板めっき装置、並びに電気接点
JP2022550449A (ja) * 2019-10-04 2022-12-01 ラム リサーチ コーポレーション リップシールプレートアウトを防止するためのウエハ遮蔽
KR20220107012A (ko) 2019-11-27 2022-08-01 램 리써치 코포레이션 쓰루-레지스트 (through-resist) 도금을 위한 에지 제거
JP7242516B2 (ja) * 2019-12-13 2023-03-20 株式会社荏原製作所 基板ホルダ
WO2021221872A1 (en) 2020-04-30 2021-11-04 Lam Research Corporation Lipseal edge exclusion engineering to maintain material integrity at wafer edge
CN114645311A (zh) * 2020-12-18 2022-06-21 盛美半导体设备(上海)股份有限公司 基板保持装置的杯形夹盘及基板保持装置
US20250075364A1 (en) * 2021-10-18 2025-03-06 Ebara Corporation Method of plating and apparatus for plating
CN113846363B (zh) * 2021-10-27 2022-09-23 上海戴丰科技有限公司 一种晶圆电镀挂具
CN114351223A (zh) * 2022-01-18 2022-04-15 沈阳超夷微电子设备有限公司 一种晶圆夹持装置及方法
JP7264545B1 (ja) 2022-02-22 2023-04-25 有限会社クズハラゴム 部分メッキ治具
CN114561682A (zh) * 2022-03-18 2022-05-31 厦门大学 电镀夹具以及可垂直挂镀和水平旋转电镀的流水线
CN120866914A (zh) * 2024-04-30 2025-10-31 盛美半导体设备(上海)股份有限公司 晶圆保持装置的夹盘及晶圆保持装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6610190B2 (en) * 2000-11-03 2003-08-26 Nutool, Inc. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
US7033465B1 (en) * 2001-11-30 2006-04-25 Novellus Systems, Inc. Clamshell apparatus with crystal shielding and in-situ rinse-dry
US6755946B1 (en) * 2001-11-30 2004-06-29 Novellus Systems, Inc. Clamshell apparatus with dynamic uniformity control
US6550484B1 (en) * 2001-12-07 2003-04-22 Novellus Systems, Inc. Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing
JP3940648B2 (ja) * 2002-08-07 2007-07-04 日本エレクトロプレイテイング・エンジニヤース株式会社 ウェハーのめっき装置
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7005379B2 (en) * 2004-04-08 2006-02-28 Micron Technology, Inc. Semiconductor processing methods for forming electrical contacts
US7985325B2 (en) * 2007-10-30 2011-07-26 Novellus Systems, Inc. Closed contact electroplating cup assembly
JP5237924B2 (ja) * 2008-12-10 2013-07-17 ノベルス・システムズ・インコーポレーテッド ベースプレート、及び電気メッキ装置
US9512538B2 (en) * 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom
US9228270B2 (en) * 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
US9309603B2 (en) * 2011-09-14 2016-04-12 Applied Materials, Inc Component cleaning in a metal plating apparatus

Also Published As

Publication number Publication date
KR102641458B1 (ko) 2024-02-28
TW202010881A (zh) 2020-03-16
JP2016135912A (ja) 2016-07-28
CN105624754A (zh) 2016-06-01
CN105624754B (zh) 2019-06-11
CN109137029B (zh) 2021-01-01
TW201629275A (zh) 2016-08-16
TWI681082B (zh) 2020-01-01
KR20220141268A (ko) 2022-10-19
KR20240029754A (ko) 2024-03-06
KR102861606B1 (ko) 2025-09-19
KR102453908B1 (ko) 2022-10-11
KR20160063252A (ko) 2016-06-03
CN109137029A (zh) 2019-01-04
TWI702311B (zh) 2020-08-21

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KR102082606B1 (ko) 반도체 전기도금 장비를 위한 립씰 및 접촉 요소
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