JP2016127237A5 - - Google Patents
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- Publication number
- JP2016127237A5 JP2016127237A5 JP2015002361A JP2015002361A JP2016127237A5 JP 2016127237 A5 JP2016127237 A5 JP 2016127237A5 JP 2015002361 A JP2015002361 A JP 2015002361A JP 2015002361 A JP2015002361 A JP 2015002361A JP 2016127237 A5 JP2016127237 A5 JP 2016127237A5
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- JP
- Japan
- Prior art keywords
- cross
- sectional area
- wind
- substrate
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 238000001816 cooling Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015002361A JP6455154B2 (ja) | 2015-01-08 | 2015-01-08 | 車両用電子機器 |
| US15/539,538 US10256170B2 (en) | 2015-01-08 | 2015-12-21 | Electronic device for vehicle |
| PCT/JP2015/006337 WO2016110914A1 (ja) | 2015-01-08 | 2015-12-21 | 車両用電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015002361A JP6455154B2 (ja) | 2015-01-08 | 2015-01-08 | 車両用電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016127237A JP2016127237A (ja) | 2016-07-11 |
| JP2016127237A5 true JP2016127237A5 (cg-RX-API-DMAC7.html) | 2017-04-13 |
| JP6455154B2 JP6455154B2 (ja) | 2019-01-23 |
Family
ID=56355643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015002361A Expired - Fee Related JP6455154B2 (ja) | 2015-01-08 | 2015-01-08 | 車両用電子機器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10256170B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6455154B2 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2016110914A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205594253U (zh) * | 2016-02-02 | 2016-09-21 | 京东方科技集团股份有限公司 | 显示装置 |
| CN108773269B (zh) * | 2018-06-10 | 2023-06-23 | 重庆三三电器股份有限公司 | 一种智能tft仪表 |
| CN108790824A (zh) * | 2018-06-25 | 2018-11-13 | 苏州奥通汽车用品有限公司 | 汽车副驾驶仪表 |
| CN109121362B (zh) * | 2018-07-30 | 2020-04-21 | 台州市皓仔邦工业设计有限公司 | 一种新能源汽车低压控制盒的散热装置 |
| WO2020154896A1 (en) | 2019-01-29 | 2020-08-06 | Yangtze Memory Technologies Co., Ltd. | Intelligent customizable wet processing system |
| WO2020174934A1 (ja) * | 2019-02-27 | 2020-09-03 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
| KR102846565B1 (ko) | 2020-05-15 | 2025-08-18 | 삼성전자주식회사 | 거대 다중 입출력을 지원하는 무선 통신 시스템에서 유저 검출 기법 및 채널 추정 방법 및 장치 |
| KR102733274B1 (ko) * | 2022-12-06 | 2024-11-25 | 현대모비스 주식회사 | 디스플레이 표시형 제어기기 |
| CN116469310A (zh) * | 2023-03-16 | 2023-07-21 | 凯盛科技股份有限公司蚌埠华益分公司 | 窄边框车载显示屏玻璃盖板 |
| WO2026074900A1 (ja) * | 2024-10-01 | 2026-04-09 | 株式会社アイシン | 車載電子制御装置 |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09230795A (ja) | 1996-02-27 | 1997-09-05 | Canon Inc | 画像形成装置 |
| JPH11121666A (ja) * | 1997-10-20 | 1999-04-30 | Fujitsu Ltd | マルチチップモジュールの冷却装置 |
| US6532152B1 (en) * | 1998-11-16 | 2003-03-11 | Intermec Ip Corp. | Ruggedized hand held computer |
| US7576990B2 (en) * | 2000-01-06 | 2009-08-18 | Super Talent Electronics, Inc. | Thin hard drive with 2-piece-casing and ground pin standoff to reduce ESD damage to stacked PCBA's |
| US7331502B2 (en) * | 2001-03-19 | 2008-02-19 | Sumitomo Bakelite Company, Ltd. | Method of manufacturing electronic part and electronic part obtained by the method |
| JP2004233791A (ja) * | 2003-01-31 | 2004-08-19 | Toshiba Corp | 電子機器および電子機器に用いる冷却ユニット |
| JP2004356145A (ja) * | 2003-05-27 | 2004-12-16 | Fujikura Ltd | 部品実装フレキシブル回路基板 |
| US7180745B2 (en) * | 2003-10-10 | 2007-02-20 | Delphi Technologies, Inc. | Flip chip heat sink package and method |
| US7102888B2 (en) * | 2004-04-20 | 2006-09-05 | Visteon Global Technologies, Inc. | Electronically integrated vehicle structure |
| US7522421B2 (en) * | 2004-09-03 | 2009-04-21 | Entorian Technologies, Lp | Split core circuit module |
| US20090008792A1 (en) * | 2004-11-19 | 2009-01-08 | Industrial Technology Research Institute | Three-dimensional chip-stack package and active component on a substrate |
| US20060250780A1 (en) * | 2005-05-06 | 2006-11-09 | Staktek Group L.P. | System component interposer |
| JP2007094648A (ja) * | 2005-09-28 | 2007-04-12 | Toshiba Corp | 電子機器 |
| JP2007103437A (ja) * | 2005-09-30 | 2007-04-19 | Toshiba Corp | 部品固定方法および部品固定装置、並びに部品固定装置を備えたプリント回路板および電子機器 |
| US7826229B2 (en) * | 2006-10-27 | 2010-11-02 | Hewlett-Packard Development Company, L.P. | Component retention with distributed compression |
| JP4909712B2 (ja) * | 2006-11-13 | 2012-04-04 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP2008145795A (ja) * | 2006-12-12 | 2008-06-26 | Hitachi Ltd | 画像表示装置 |
| US7532480B1 (en) * | 2006-12-14 | 2009-05-12 | Nvidia Corporation | Power delivery for electronic assemblies |
| JP4365867B2 (ja) | 2007-01-11 | 2009-11-18 | 三菱電機株式会社 | 表示装置 |
| US7714433B2 (en) * | 2007-03-09 | 2010-05-11 | Intel Corporation | Piezoelectric cooling of a semiconductor package |
| JP4474431B2 (ja) * | 2007-03-26 | 2010-06-02 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 半導体パッケージおよび該製造方法 |
| TWI470762B (zh) * | 2007-07-27 | 2015-01-21 | 尼康股份有限公司 | Laminated semiconductor device |
| JP5504557B2 (ja) * | 2007-09-21 | 2014-05-28 | セイコーエプソン株式会社 | 電気光学装置及び電気光学装置用実装ケース、並びに電子機器 |
| US20090168374A1 (en) * | 2008-01-02 | 2009-07-02 | Clayton James E | Thin multi-chip flex module |
| JP2009176147A (ja) | 2008-01-25 | 2009-08-06 | Nec Corp | 電子機器および電子機器のメモリアクセス許可判別方法 |
| US20120212904A1 (en) * | 2008-02-12 | 2012-08-23 | Robert Fleming | Flexible circuits and substrates comprising voltage switchable dielectric material |
| US8013440B2 (en) * | 2008-03-28 | 2011-09-06 | Conexant Systems, Inc. | Enhanced thermal dissipation ball grid array package |
| JP5235769B2 (ja) * | 2009-04-27 | 2013-07-10 | 株式会社ジャパンディスプレイイースト | 液晶表示装置 |
| JP2011029312A (ja) * | 2009-07-23 | 2011-02-10 | Pioneer Electronic Corp | 電子機器の放熱構造 |
| EP2325733B1 (en) * | 2009-11-02 | 2013-06-12 | SMK Corporation | Holding structure for a touch panel |
| JP2011119395A (ja) * | 2009-12-02 | 2011-06-16 | Fujitsu Telecom Networks Ltd | 電子部品の冷却構造 |
| KR20110085481A (ko) * | 2010-01-20 | 2011-07-27 | 삼성전자주식회사 | 적층 반도체 패키지 |
| US8363418B2 (en) * | 2011-04-18 | 2013-01-29 | Morgan/Weiss Technologies Inc. | Above motherboard interposer with peripheral circuits |
| US20130001647A1 (en) * | 2011-06-28 | 2013-01-03 | Adler Steven J | Integration of vertical bjt or hbt into soi technology |
| JP5849214B2 (ja) * | 2011-07-11 | 2016-01-27 | パナソニックIpマネジメント株式会社 | 電子機器 |
| KR101918261B1 (ko) * | 2011-11-28 | 2018-11-14 | 삼성전자주식회사 | 모바일 장치용 반도체 패키지 |
| KR101838736B1 (ko) * | 2011-12-20 | 2018-03-15 | 삼성전자 주식회사 | 테이프 배선 기판 및 이를 포함하는 칩 온 필름 패키지 |
| JP2013187998A (ja) * | 2012-03-07 | 2013-09-19 | Nissan Motor Co Ltd | 電力変換装置 |
| US9301429B2 (en) * | 2012-09-25 | 2016-03-29 | Apple Inc. | Thermal blocker for mobile device skin hot spot management |
| US9125299B2 (en) * | 2012-12-06 | 2015-09-01 | Apple Inc. | Cooling for electronic components |
| JP2014123678A (ja) * | 2012-12-21 | 2014-07-03 | Casio Comput Co Ltd | 電気機器 |
| JP5987732B2 (ja) | 2013-03-04 | 2016-09-07 | 株式会社デンソー | 車両用電子機器 |
| JP2014212240A (ja) | 2013-04-19 | 2014-11-13 | 株式会社デンソー | 車両用電子機器 |
| JP6036513B2 (ja) | 2013-04-19 | 2016-11-30 | 株式会社デンソー | 車両用電子機器 |
| JP6396707B2 (ja) * | 2014-07-22 | 2018-09-26 | クラリオン株式会社 | 静電サージ防止構造 |
| JP6327111B2 (ja) * | 2014-10-23 | 2018-05-23 | 株式会社デンソー | 車両用ディスプレイユニット、ディスプレイ制御ユニット |
-
2015
- 2015-01-08 JP JP2015002361A patent/JP6455154B2/ja not_active Expired - Fee Related
- 2015-12-21 WO PCT/JP2015/006337 patent/WO2016110914A1/ja not_active Ceased
- 2015-12-21 US US15/539,538 patent/US10256170B2/en not_active Expired - Fee Related
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