JP2016076705A - Ledデバイスにmems製造を組み込んだ実装方法およびアセンブリ - Google Patents
Ledデバイスにmems製造を組み込んだ実装方法およびアセンブリ Download PDFInfo
- Publication number
- JP2016076705A JP2016076705A JP2015198874A JP2015198874A JP2016076705A JP 2016076705 A JP2016076705 A JP 2016076705A JP 2015198874 A JP2015198874 A JP 2015198874A JP 2015198874 A JP2015198874 A JP 2015198874A JP 2016076705 A JP2016076705 A JP 2016076705A
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- Prior art keywords
- substrate
- led chips
- led
- metal wiring
- led chip
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Abstract
Description
断片化工程の後、第1のテープ45が除去され得る。その後、第2のテープ55は、LEDウェハ18の他方の面47に接着された後、第1のテープ45が除去される。
本実施形態では、リング56は、第2のテープ55を支持するキャリアの一部である。上述のように、第2のテープ55上にしっかりと留まる構造を維持し、続く製造工程において、第2のテープ55を特定の位置で拘束するために、リング56が使用されることができる。パターン化フォトレジスト層25は、溶媒又は酸によるウェット・ストリッピング(stripping)あるいはプラズマガス・ストリッピングによって、除去される。
LEDウェハ18に接続される金属層(Ti/Cu)10,15は、選択的にエッチングされる。したがって、銅金属層29の一部は、接触電極35に接着されたたエッチングされてにないチタン層10とともに、ばねの一部、又は伸縮可能な金属配線30の一部として、及び接触電極35として、残る。
銅をエッチングすることなく、チタンをエッチングできるエッチング液を用いたウェットエッチングによって、チタン金属層10を選択的にエッチングした後、(選択エッチング後の、元の銅金属層の左上部分の残りから、)複数のLEDチップ5を接続する、複数の伸縮可能な金属配線30のパターンが、形成される。その中で、伸縮可能な金属配線30は、隣接するLEDチップ5を互いに夫々接続される。
図2〜図6の示す本実施形態で行われている製造工程は、MEMSの製造工程とみなすことができる。
伸縮可能な金属配線30は、は、拡張/拡大状態又は縮小/短縮状態のいずれかで導電性ワイヤとして機能することができる。
伸縮可能な金属配線30の伸縮物性によって、接続されたLEDチップの一対の距離を変化させ、増加することができるので、伸縮可能な金属配線30が短すぎたり絡まったりすることについて心配する必要がなく、LEDチップ5の配置及び実装の柔軟性に対応することを可能にするようになる。
そして、接触電極125に電気的に接続する伸縮可能な金属配線120がテンプレート基板105上に残るように、選択的なエッチングが実行される。
即ち、接触電極125の下にある金属シード層100bの一部が残っている一方、伸縮可能な金属配線の下に配置された金属シード層100aの一部が選択なエッチングによって除去される。
COG構造は、支持体として、ガラス基板又は透明基板を含み、COB構造は支持体としてPCB基板を含んでいる。
伸縮可能な金属配線170は、基板の上方に位置するLEDチップ5のボンディングパッド20の上方に位置する接触電極35を形成するのと同様に、バネ形状を有するショートワイヤの形態であってもよい。
チタン金属層の選択的なエッチングの後、複数のLEDチップ5を接続する複数の伸縮可能な金属配線170のパターンが銅金属層から形成され、そこでは、隣接するLEDチップ5が、伸縮可能な金属配線170によって、夫々互いに接続している。伸縮可能な金属配線170の下に位置する金属層は、選択的エッチングによって、実質的に除去される。
銅を含む金属材料117は、開口部119に充填されることで、複数の接触電極125が形成される。複数の伸縮可能な金属配線120は、透明基板300を覆う所定のパターンを形成する。各伸縮可能な金属配線120は、隣接する接触電極125の一対の両端に夫々接続されている。
伸縮可能な金属配線120の下に位置する金属シード層100は、選択的なエッチングによって、実質的に除去される。
次いで、加熱、UV光の照射、又は有機溶媒の利用等の方法によって、第1のテープ130及び第1のテープ130上に形成されるLEDチップ5は、透明基板300と接続される。ここで、ボンディング端子310と伸縮可能な金属配線120は、必要に応じて第1のテープ130へ取り付けることができる。
一方、図34及び図35の工程で形成されるボンディング端子310と、伸縮可能な金属配線120とは互いに電気的に接続される。
リソグラフィ及び金属化技術を使用することで、ボンディング端子310からLEDチップ5のボンディングパッド20の1つまでに電気的な接続が行われる。
一方、一方、図34及び図35の工程で形成されるボンディング端子310と、伸縮可能な金属配線120とは互いに電気的に接続される。
伸縮可能な金属配線から所定距離離れていてもよく、或いは伸縮可能な金属配線に近接して/隣接していてもよい。上記実施形態で使用されるテープは、一方向以上の方向に、膨張及び拡張することができる。図示された実施形態の全てにおいて、伸縮可能な金属配線は、吊り下げられて(浮かんで)いることができる。上記実施形態において、テープは、接着層(不図示)によって被覆された薄膜層(不図示)で作製されている。接着剤層は、アクリル系組成物で製作されている。薄膜層は、PVC組成物で製作されている。また、伸縮可能な金属配線は、ニッケル(Ni)、銀(Ag)、または金(Au)などの他の金属で作製してもよい。
本発明の実施形態での伸縮可能な金属配線の幅は、70um未満、例えば、5um、10um、27um、57um又は62umなどと、することができる。伸縮可能な金属配線の長さは、例えば、収縮時では255um、伸長時に、1200umとすることができる。一方、伸縮可能な金属配線の収縮したときの長さは、Aとして定量化することができ、伸縮可能な金属配線の延長したときの長さは、4.0A〜3.5Aとして推定できる。
伸縮可能な金属配線の曲率半径(R)と厚さ(t)との比<t/2R>は、伸縮可能な金属配線の材料の降伏ひずみを超えることはできない。
なお、本実施形態およびその利点は、前述の説明から理解されると考えられている。また、実施形態の精神および範囲から逸脱またはその材料の利点のすべてを犠牲にすることなく、様々な変更がされ得ることが明らかであろう。
Claims (15)
- 複数のLEDチップと、
所定のパターンを形成する複数の伸縮可能な金属配線と、
複数の電極と、
金属シード層と、を有し、
前記金属シード層は前記複数の電極に接続されており、
前記伸縮可能な金属配線の1つが前記複数の電極のうちの2つへ接続され、
前記2つの電極は、前記複数のLEDチップの2つに、夫々接続されており、
前記伸縮可能な金属配線の1つが前記複数のLEDチップとの電気的接続を維持しながら、1つの軸に沿った、ある距離に伸長することが可能である、
発光デバイスアセンブリ。 - 前記複数のLEDチップに接着されたテープをさらに有しており、
前記複数のLEDチップは、互いに一つ以上の事前に決められた距離で配置され、前記複数のLEDチップの間の距離が予め設定された幅になるまで広がるように、前記テープが引き延ばされる、
請求項1に記載の発光デバイスアセンブリ。 - 前記伸縮可能な金属配線の厚さは0ミクロン〜100ミクロンの間である、
請求項1に記載の発光デバイスアセンブリ。 - 当該発光デバイスアセンブリは、基板をさらに有しており、
前記基板は複数の基板片を含んでおり、
前記各基板片は、少なくとも1つのLEDチップを保持し、
前記基板片上にある、隣接するLEDチップ間の距離が増加することが可能であるように、隣接する基板片の間の距離が、拡張可能である、
請求項1に記載の発光デバイスアセンブリ。 - 当該発光デバイスアセンブリは、基板をさらに有しており、
前記基板は、拡張テーブル、チップオンガラス(COG)型又はチップオンボード(COB)型の最終基板、複数のスクライブ基板片、及び複数の透明基板片、を構成するグループから選択され、
前記複数のLEDチップは前記基板に実装され、
隣接するLEDチップが実装される間の距離が予め設定された幅まで大きくすることが可能であるように、隣接するLEDチップとの間の距離は伸長可能である、
請求項1に記載の発光デバイスアセンブリ。 - 収縮状態における前記伸縮可能な金属配線は、バネ構造を有している、
請求項1に記載の発光デバイスアセンブリ。 - 複数のLEDチップを備えるLEDウェハ上にチタン層及び銅層を形成する工程と、
フォトレジスト層を形成して、パターニングする工程と、
パターン化された前記フォトレジスト層の中に銅材料を充填することによって、複数の伸縮可能な金属配線と、複数の接触電極とを形成する工程と、
前記伸縮可能な金属配線に隣接するフォトレジスト層の一方の側に第1のテープを接着する工程と、
前記LEDチップに隣接する前記LEDウェハの第1の表面上に複数のスクライブ線を形成する工程と、
前記第1のテープが前記LEDチップに接着したまま、前記スクライブ線に沿ってLEDウェハを断片化する工程と、
前記LEDウェハの第2の表面に第2のテープを接着する工程と、
前記第1のテープ及び前記フォトレジスト層を除去する工程と、
前記チタン層及び前記銅層を選択的にエッチングすることによって、前記LEDチップに接続される前記複数の伸縮可能な金属配線のパターンを形成する工程と、
拡張テーブルを提供する工程と、
前記複数の接触電極を前記拡張テーブルへ取り付ける工程と、
加熱により、前記第2のテープを取り除く工程と、を有する、
複数のLEDチップを電気的に接続する一体化製造方法。 - 第1の基板上に、チタン金属シード層及びフォトレジスト層を夫々形成する工程と、
マスクとして機能するように前記フォトレジスト層をエッチングすることで、複数の開口部を生成する工程と、
前記開口部を銅材料で充填することで、複数の伸縮可能な金属配線及び複数の接触電極を形成する工程であって、伸縮可能な金属配線は前記第1の基板を覆う所定のパターンを形成し、各伸縮金属配線は、隣接する接触電極の対と、伸縮可能な金属配線の両端で接続される、工程と、
前記フォトレジスト層を除去する工程と、
前記接触電極と、前記接触電極の下にあるチタン金属シード層の一部とに接続される、
前記伸縮可能な金属配線が、それぞれ第1の基板上に残るように、前記チタン金属シード層を選択的にエッチングする工程と、
前記複数のLEDチップに第1のテープを接着する工程であって、前記各LEDチップは一対の接触パッドを備え、一対の接触パッドは、一対の電極に対応して位置合わせされる工程と、
前記一対の接触電極へ前記一対の接触パッドを夫々接着する工程と、
前記LEDチップから前記第1のテープを取り除くことで、中間LEDチップアセンブリを形成する工程と、を有する、
複数のLEDチップを電気的に接続する一体化製造方法。 - 最終基板上に、前記中間LEDチップアセンブリを実装する工程と、
前記中間LEDチップセンブリから前記第1の基板を除去する工程と、をさらに有する、
請求項8に記載の一体化製造方法。 - 前記第1の基板はテンプレート基板であり、
前記最終基板はガラス基板又はPCB板である、
請求項9に記載の一体化製造方法。 - 前記第1の基板を、切断して断片化することにより基板片する工程をさらに有し、
前記LEDチップは前記伸縮可能な金属配線によって接続され、
前記LEDチップは垂直方向に移動可能であり、水平方向に拡張可能であるので、中間LEDチップアセンブリをフレキシブル基板へ実装することが可能になる、
請求項8に記載の一体化製造方法。 - 前記第1の基板は透明基板である、
請求項11に記載の一体化製造方法。 - 透明基板上にチタン金属シード層を形成する工程と、
前記チタン金属シード層上にフォトレジスト層を形成して、エッチングする工程と、
複数の伸縮可能な金属配線及び複数のボンディング端子を形成するために、前記フォトレジスト層の開口部に銅材料を充填する工程であって、
伸縮可能な金属配線の夫々は、前記透明基板を覆う所定のパターンを形成する工程であって、で前記伸縮可能な金属配線の各々は、伸縮可能な金属配線の両端に隣接するボンディング端子対に接続されている、
前記フォトレジスト層を除去する工程と、
前記ボンディング端子に接続された前記伸縮可能な金属配線が前記透明基板上に残るように、前記チタン金属シード層の実質的な部分を除去するために選択的にエッチングする工程と、
前記LEDチップの各々が一対のボンディングパッドを有している、複数のLEDチップの一方の側に、第1のテープを接着する工程と、
前記透明基板を、個々の基板片に切断して断片化する工程と、
前記透明基板の各部分は1つのLEDチップを保持しているおり、前記伸縮可能な金属配線で複数のLEDチップ間が接続される工程と、を有する、
複数のLEDチップを電気的に接続する、一体化製造方法。 - 複数のボンディング端子の1つから複数のボンディングパッドの1つまで、ワイヤボンディングを用いた電気的接続を形成する工程と、をさらに有し、
一の前記ボンディング端子は、他の前記ボンディング端子と、1つの伸縮可能な金属配線を介して接続される、
請求項13に記載の一体化製造方法。 - 複数のボンディング端子の1つから複数のボンディングパッドの1つまで、リソグラフィおよび金属化を使用して、電気的接続を形成する工程と、をさらに有し、
一の前記ボンディング端子は、他の前記ボンディング端子と、1つの伸縮可能な金属配線を介して接続される、
請求項13に記載の一体化製造方法。
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US10403804B2 (en) | 2019-09-03 |
EP3007226B1 (en) | 2018-12-05 |
US10026882B2 (en) | 2018-07-17 |
KR102153145B1 (ko) | 2020-09-08 |
CN105489598B (zh) | 2020-02-11 |
EP3007226A1 (en) | 2016-04-13 |
US20160099393A1 (en) | 2016-04-07 |
KR20160041767A (ko) | 2016-04-18 |
US20180301609A1 (en) | 2018-10-18 |
JP6764640B2 (ja) | 2020-10-07 |
TW201616690A (zh) | 2016-05-01 |
TWI697135B (zh) | 2020-06-21 |
CN105489598A (zh) | 2016-04-13 |
EP3471141B1 (en) | 2021-07-21 |
EP3471141A1 (en) | 2019-04-17 |
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