JP2016059927A - 半田鏝 - Google Patents
半田鏝 Download PDFInfo
- Publication number
- JP2016059927A JP2016059927A JP2014187670A JP2014187670A JP2016059927A JP 2016059927 A JP2016059927 A JP 2016059927A JP 2014187670 A JP2014187670 A JP 2014187670A JP 2014187670 A JP2014187670 A JP 2014187670A JP 2016059927 A JP2016059927 A JP 2016059927A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- tip
- guide tube
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 87
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052742 iron Inorganic materials 0.000 title claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 129
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 28
- 230000007246 mechanism Effects 0.000 description 14
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000009736 wetting Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014187670A JP2016059927A (ja) | 2014-09-16 | 2014-09-16 | 半田鏝 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014187670A JP2016059927A (ja) | 2014-09-16 | 2014-09-16 | 半田鏝 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016059927A true JP2016059927A (ja) | 2016-04-25 |
| JP2016059927A5 JP2016059927A5 (enExample) | 2017-10-26 |
Family
ID=55796803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014187670A Pending JP2016059927A (ja) | 2014-09-16 | 2014-09-16 | 半田鏝 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2016059927A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016153017A1 (ja) * | 2015-03-26 | 2016-09-29 | 株式会社アンド | 半田処理装置 |
| WO2018025787A1 (ja) * | 2016-07-30 | 2018-02-08 | 株式会社パラット | 半田付け装置および半田付け方法 |
| JP2018186147A (ja) * | 2017-04-25 | 2018-11-22 | 株式会社パラット | 半田付け製品製造方法、半田付け製品、半田付け方法、および半田付け装置 |
| JP2020136341A (ja) * | 2019-02-14 | 2020-08-31 | 三菱電機株式会社 | はんだ付け装置および電子部品の製造方法 |
| CN112512226A (zh) * | 2020-11-06 | 2021-03-16 | 杭州杉芽科技有限公司 | 一种避免溢流的电子产品定量贴片装置 |
| CN115041861A (zh) * | 2022-04-24 | 2022-09-13 | 宁波亿利邦铝业有限公司 | 具有高耐腐蚀性能的可焊锡铝带及其制备工艺、设备 |
| CN115592337A (zh) * | 2022-12-14 | 2023-01-13 | 深圳市科美达自动化设备有限公司（Cn） | 转子焊压敏治具 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121460U (ja) * | 1984-01-17 | 1985-08-16 | 関西日本電気株式会社 | ハンダコテ |
| JP2010272605A (ja) * | 2009-05-20 | 2010-12-02 | Mitsuo Ebisawa | リード線等の微小半田付けによる電子機器製造方法とそのための半田鏝 |
-
2014
- 2014-09-16 JP JP2014187670A patent/JP2016059927A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121460U (ja) * | 1984-01-17 | 1985-08-16 | 関西日本電気株式会社 | ハンダコテ |
| JP2010272605A (ja) * | 2009-05-20 | 2010-12-02 | Mitsuo Ebisawa | リード線等の微小半田付けによる電子機器製造方法とそのための半田鏝 |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016153017A1 (ja) * | 2015-03-26 | 2016-09-29 | 株式会社アンド | 半田処理装置 |
| JP6004029B1 (ja) * | 2015-03-26 | 2016-10-05 | 株式会社アンド | 半田処理装置 |
| US11207743B2 (en) | 2015-03-26 | 2021-12-28 | And Co., Ltd. | Solder processing device |
| WO2018025787A1 (ja) * | 2016-07-30 | 2018-02-08 | 株式会社パラット | 半田付け装置および半田付け方法 |
| JP2018186147A (ja) * | 2017-04-25 | 2018-11-22 | 株式会社パラット | 半田付け製品製造方法、半田付け製品、半田付け方法、および半田付け装置 |
| JP2020136341A (ja) * | 2019-02-14 | 2020-08-31 | 三菱電機株式会社 | はんだ付け装置および電子部品の製造方法 |
| JP7005542B2 (ja) | 2019-02-14 | 2022-01-21 | 三菱電機株式会社 | はんだ付け装置および電子部品の製造方法 |
| CN112512226A (zh) * | 2020-11-06 | 2021-03-16 | 杭州杉芽科技有限公司 | 一种避免溢流的电子产品定量贴片装置 |
| CN115041861A (zh) * | 2022-04-24 | 2022-09-13 | 宁波亿利邦铝业有限公司 | 具有高耐腐蚀性能的可焊锡铝带及其制备工艺、设备 |
| CN115041861B (zh) * | 2022-04-24 | 2023-12-08 | 宁波亿利邦铝业有限公司 | 具有高耐腐蚀性能的可焊锡铝带及其制备工艺、设备 |
| CN115592337A (zh) * | 2022-12-14 | 2023-01-13 | 深圳市科美达自动化设备有限公司（Cn） | 转子焊压敏治具 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016059927A (ja) | 半田鏝 | |
| JP6366561B2 (ja) | 半田付け装置、および半田付け方法 | |
| JP6128609B2 (ja) | 半田処理装置 | |
| JP5312584B2 (ja) | 噴流半田付け装置および半田付け方法 | |
| CN107405712B (zh) | 焊料处理装置 | |
| JP6831666B2 (ja) | 半田付けシステム、半田付け製品製造方法、半田付け方法、及び半田 | |
| JP6512659B2 (ja) | 半田処理装置 | |
| JP6406687B2 (ja) | 半田付け装置 | |
| JP6406693B2 (ja) | 半田処理装置 | |
| JP6259341B2 (ja) | 接合装置 | |
| JP2015112619A (ja) | 半田付け装置および方法 | |
| JP2017185530A (ja) | 半田処理装置 | |
| JP2015221449A (ja) | クリーニング装置及び半田付けシステム | |
| JP6792858B2 (ja) | 半田処理装置 | |
| JP3118600U (ja) | 微細ランプと導線の溶接装置 | |
| JP2017152627A (ja) | 半田処理装置 | |
| JP2016100383A (ja) | 半田処理装置 | |
| US11198188B2 (en) | Soldering device for soldering with laser beam and robot apparatus provided with soldering device | |
| TW201503985A (zh) | 用於在基板上分配和分佈無助熔劑焊料的裝置 | |
| JP2017121642A (ja) | 半田処理装置 | |
| JP6566394B2 (ja) | 半田処理装置 | |
| JP6818973B2 (ja) | 半田処理装置 | |
| JP2016215220A (ja) | 半田処理装置 | |
| KR20190099791A (ko) | 자동 이송형 납땜장치 | |
| JP2017039155A (ja) | リフローはんだ付け装置および加熱部材 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170912 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170912 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180706 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180807 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181004 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190312 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20191112 |