JP2016055497A - 保護被膜の被覆方法 - Google Patents
保護被膜の被覆方法 Download PDFInfo
- Publication number
- JP2016055497A JP2016055497A JP2014182918A JP2014182918A JP2016055497A JP 2016055497 A JP2016055497 A JP 2016055497A JP 2014182918 A JP2014182918 A JP 2014182918A JP 2014182918 A JP2014182918 A JP 2014182918A JP 2016055497 A JP2016055497 A JP 2016055497A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- resin sheet
- resin
- protective film
- protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000007888 film coating Substances 0.000 title abstract description 5
- 238000009501 film coating Methods 0.000 title abstract description 5
- 229920005989 resin Polymers 0.000 claims abstract description 154
- 239000011347 resin Substances 0.000 claims abstract description 154
- 238000000576 coating method Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 13
- 230000004048 modification Effects 0.000 description 17
- 238000012986 modification Methods 0.000 description 17
- 239000007788 liquid Substances 0.000 description 14
- 239000011253 protective coating Substances 0.000 description 14
- 210000000078 claw Anatomy 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000004528 spin coating Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Abstract
Description
10 樹脂シート
Claims (1)
- 樹脂によって板状のウエーハの表面に保護被膜を形成する保護被膜の被覆方法であって、
フィルム状の樹脂シートで該表面の全面を覆う樹脂シート載置工程と、
該樹脂シート載置工程で該表面の全面を覆った該樹脂シートを該表面に密着させ該樹脂シートを貼着する貼着工程と、
該貼着工程を経た該樹脂シートを硬化させる硬化工程と、からなる保護被膜の被覆方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014182918A JP6411142B2 (ja) | 2014-09-09 | 2014-09-09 | 保護被膜の被覆方法 |
TW104124945A TWI663045B (zh) | 2014-09-09 | 2015-07-31 | 保護被膜的被覆方法 |
KR1020150124864A KR102330573B1 (ko) | 2014-09-09 | 2015-09-03 | 보호 피막의 피복 방법 |
CN201510561179.2A CN105405753B (zh) | 2014-09-09 | 2015-09-06 | 保护覆盖膜的覆盖方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014182918A JP6411142B2 (ja) | 2014-09-09 | 2014-09-09 | 保護被膜の被覆方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016055497A true JP2016055497A (ja) | 2016-04-21 |
JP6411142B2 JP6411142B2 (ja) | 2018-10-24 |
Family
ID=55471163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014182918A Active JP6411142B2 (ja) | 2014-09-09 | 2014-09-09 | 保護被膜の被覆方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6411142B2 (ja) |
KR (1) | KR102330573B1 (ja) |
CN (1) | CN105405753B (ja) |
TW (1) | TWI663045B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102563929B1 (ko) * | 2018-03-09 | 2023-08-04 | 삼성전자주식회사 | 반도체 다이들의 개별화 방법 및 반도체 패키지의 제조 방법 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06115013A (ja) * | 1992-10-01 | 1994-04-26 | Sekisui Chem Co Ltd | 表面保護フィルムおよびその使用方法 |
JPH10183080A (ja) * | 1996-10-21 | 1998-07-07 | Gengen Kagaku Kogyo Kk | 複合フィルム及び表面被覆体の製造方法 |
JP2004188475A (ja) * | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
JP2009155625A (ja) * | 2007-12-07 | 2009-07-16 | Denki Kagaku Kogyo Kk | 保護膜、積層フィルム及びそれを用いた加工方法 |
JP2011224642A (ja) * | 2010-04-22 | 2011-11-10 | Disco Corp | 保護材およびアブレーション加工方法 |
JP2013021209A (ja) * | 2011-07-13 | 2013-01-31 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2013021210A (ja) * | 2011-07-13 | 2013-01-31 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4666583B2 (ja) * | 2005-01-18 | 2011-04-06 | 株式会社ディスコ | 保護被膜の被覆方法 |
JP2008006379A (ja) | 2006-06-29 | 2008-01-17 | Disco Abrasive Syst Ltd | 保護被膜の被覆方法 |
JP5918926B2 (ja) * | 2010-10-13 | 2016-05-18 | リンテック株式会社 | 保護膜形成用フィルムおよび半導体チップの製造方法 |
JP6101460B2 (ja) | 2012-09-18 | 2017-03-22 | 株式会社ディスコ | ウェーハの加工方法 |
-
2014
- 2014-09-09 JP JP2014182918A patent/JP6411142B2/ja active Active
-
2015
- 2015-07-31 TW TW104124945A patent/TWI663045B/zh active
- 2015-09-03 KR KR1020150124864A patent/KR102330573B1/ko active IP Right Grant
- 2015-09-06 CN CN201510561179.2A patent/CN105405753B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06115013A (ja) * | 1992-10-01 | 1994-04-26 | Sekisui Chem Co Ltd | 表面保護フィルムおよびその使用方法 |
JPH10183080A (ja) * | 1996-10-21 | 1998-07-07 | Gengen Kagaku Kogyo Kk | 複合フィルム及び表面被覆体の製造方法 |
JP2004188475A (ja) * | 2002-12-13 | 2004-07-08 | Disco Abrasive Syst Ltd | レーザー加工方法 |
JP2009155625A (ja) * | 2007-12-07 | 2009-07-16 | Denki Kagaku Kogyo Kk | 保護膜、積層フィルム及びそれを用いた加工方法 |
JP2011224642A (ja) * | 2010-04-22 | 2011-11-10 | Disco Corp | 保護材およびアブレーション加工方法 |
JP2013021209A (ja) * | 2011-07-13 | 2013-01-31 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2013021210A (ja) * | 2011-07-13 | 2013-01-31 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6411142B2 (ja) | 2018-10-24 |
CN105405753A (zh) | 2016-03-16 |
TWI663045B (zh) | 2019-06-21 |
CN105405753B (zh) | 2020-09-18 |
KR20160030363A (ko) | 2016-03-17 |
TW201627132A (zh) | 2016-08-01 |
KR102330573B1 (ko) | 2021-11-25 |
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