JP2016048691A5 - - Google Patents
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- Publication number
- JP2016048691A5 JP2016048691A5 JP2015222624A JP2015222624A JP2016048691A5 JP 2016048691 A5 JP2016048691 A5 JP 2016048691A5 JP 2015222624 A JP2015222624 A JP 2015222624A JP 2015222624 A JP2015222624 A JP 2015222624A JP 2016048691 A5 JP2016048691 A5 JP 2016048691A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- connection
- temperature
- electrode
- solder particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015222624A JP2016048691A (ja) | 2014-03-07 | 2015-11-13 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014045437 | 2014-03-07 | ||
| JP2014045437 | 2014-03-07 | ||
| JP2015222624A JP2016048691A (ja) | 2014-03-07 | 2015-11-13 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015512828A Division JP5851071B1 (ja) | 2014-03-07 | 2015-02-25 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016048691A JP2016048691A (ja) | 2016-04-07 |
| JP2016048691A5 true JP2016048691A5 (https=) | 2017-11-02 |
Family
ID=54055152
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015512828A Active JP5851071B1 (ja) | 2014-03-07 | 2015-02-25 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
| JP2015222624A Pending JP2016048691A (ja) | 2014-03-07 | 2015-11-13 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015512828A Active JP5851071B1 (ja) | 2014-03-07 | 2015-02-25 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP5851071B1 (https=) |
| KR (1) | KR102393302B1 (https=) |
| CN (1) | CN105684096B (https=) |
| TW (1) | TWI671382B (https=) |
| WO (1) | WO2015133343A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017033934A1 (ja) * | 2015-08-24 | 2017-03-02 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
| JP6600234B2 (ja) * | 2015-11-16 | 2019-10-30 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
| JP2017092424A (ja) * | 2015-11-17 | 2017-05-25 | 積水化学工業株式会社 | 接続構造体の製造方法 |
| KR102745675B1 (ko) * | 2017-12-22 | 2024-12-23 | 세키스이가가쿠 고교가부시키가이샤 | 땜납 입자, 도전 재료, 땜납 입자의 보관 방법, 도전 재료의 보관 방법, 도전 재료의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법 |
| JP7210840B2 (ja) * | 2018-08-06 | 2023-01-24 | 株式会社レゾナック | 伸縮性樹脂形成用熱硬化性組成物、伸縮性樹脂、及び半導体装置 |
| CN117995822B (zh) * | 2024-04-03 | 2024-08-23 | 上海聚跃检测技术有限公司 | 一种芯片失效分析散热测试结构和方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001047660A1 (en) * | 1999-12-27 | 2001-07-05 | Sumitomo Bakelite Company, Ltd. | Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
| KR100615870B1 (ko) * | 2000-10-02 | 2006-08-25 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 기능성 합금 입자 |
| JP3930690B2 (ja) * | 2001-03-13 | 2007-06-13 | 昭和電工株式会社 | ハンダペースト用フラックス |
| JP2004223559A (ja) * | 2003-01-22 | 2004-08-12 | Asahi Kasei Corp | 電極接続用金属粉体組成物、及び、電極の接続方法 |
| JP2004234900A (ja) * | 2003-01-28 | 2004-08-19 | Asahi Kasei Corp | 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート |
| JP4248944B2 (ja) * | 2003-06-10 | 2009-04-02 | 旭化成エレクトロニクス株式会社 | 導電性ペースト、回路パターンの形成方法、突起電極の形成方法 |
| JP2005194306A (ja) * | 2003-12-26 | 2005-07-21 | Togo Seisakusho Corp | 通電接着剤とそれを用いた窓用板状部材 |
| US20090020733A1 (en) * | 2005-01-25 | 2009-01-22 | Fujikura Kasei Co., Ltd. | Conductive paste |
| WO2008001740A1 (en) * | 2006-06-30 | 2008-01-03 | Asahi Kasei Emd Corporation | Conductive filler |
| JP4662483B2 (ja) * | 2006-07-18 | 2011-03-30 | 旭化成イーマテリアルズ株式会社 | 導電性フィラー、及び中温はんだ材料 |
| CN101501154B (zh) * | 2006-08-25 | 2013-05-15 | 住友电木株式会社 | 粘合带、接合体和半导体封装件 |
| KR20090129478A (ko) * | 2007-03-19 | 2009-12-16 | 나믹스 가부시끼가이샤 | 이방성 도전 페이스트 |
| JP2009278054A (ja) * | 2008-05-19 | 2009-11-26 | Sumitomo Bakelite Co Ltd | 端子間の接続方法、導電性粒子の凝集方法及びそれを用いた半導体装置の製造方法 |
| US8420722B2 (en) * | 2008-07-10 | 2013-04-16 | Electronics And Telecommunications Research Institute | Composition and methods of forming solder bump and flip chip using the same |
| KR20130077816A (ko) * | 2010-04-22 | 2013-07-09 | 세키스이가가쿠 고교가부시키가이샤 | 이방성 도전 재료 및 접속 구조체 |
| KR101829475B1 (ko) * | 2010-06-09 | 2018-02-14 | 데쿠세리아루즈 가부시키가이샤 | 광반사성 이방성 도전 페이스트 및 발광 장치 |
| US8070043B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
| JP2012169263A (ja) * | 2011-01-24 | 2012-09-06 | Sekisui Chem Co Ltd | 異方性導電材料、接続構造体の製造方法及び接続構造体 |
| CN103843469B (zh) * | 2011-09-30 | 2017-05-03 | 株式会社村田制作所 | 电子装置、接合材料以及电子装置的制造方法 |
| JP5613220B2 (ja) * | 2011-12-20 | 2014-10-22 | 積水化学工業株式会社 | 電子部品接続材料及び接続構造体 |
| CN103443868B (zh) * | 2012-03-26 | 2014-11-19 | 积水化学工业株式会社 | 导电材料及连接结构体 |
| JP6114627B2 (ja) * | 2012-05-18 | 2017-04-12 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
| JP2014005347A (ja) * | 2012-06-22 | 2014-01-16 | Sekisui Chem Co Ltd | 接着剤組成物及び半導体チップ実装体の製造方法 |
-
2015
- 2015-02-25 KR KR1020167006636A patent/KR102393302B1/ko active Active
- 2015-02-25 WO PCT/JP2015/055343 patent/WO2015133343A1/ja not_active Ceased
- 2015-02-25 CN CN201580002410.2A patent/CN105684096B/zh active Active
- 2015-02-25 JP JP2015512828A patent/JP5851071B1/ja active Active
- 2015-03-06 TW TW104107325A patent/TWI671382B/zh active
- 2015-11-13 JP JP2015222624A patent/JP2016048691A/ja active Pending
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