JP2015533195A5 - - Google Patents

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Publication number
JP2015533195A5
JP2015533195A5 JP2015535693A JP2015535693A JP2015533195A5 JP 2015533195 A5 JP2015533195 A5 JP 2015533195A5 JP 2015535693 A JP2015535693 A JP 2015535693A JP 2015535693 A JP2015535693 A JP 2015535693A JP 2015533195 A5 JP2015533195 A5 JP 2015533195A5
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JP
Japan
Prior art keywords
module
substrate
processing tool
substrate processing
indexed inline
Prior art date
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Application number
JP2015535693A
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English (en)
Japanese (ja)
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JP6285446B2 (ja
JP2015533195A (ja
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Priority claimed from US14/034,921 external-priority patent/US9406538B2/en
Publication of JP2015533195A publication Critical patent/JP2015533195A/ja
Publication of JP2015533195A5 publication Critical patent/JP2015533195A5/ja
Application granted granted Critical
Publication of JP6285446B2 publication Critical patent/JP6285446B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015535693A 2012-10-09 2013-09-24 割り送り式インライン基板処理ツール Expired - Fee Related JP6285446B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261711493P 2012-10-09 2012-10-09
US61/711,493 2012-10-09
US14/034,921 US9406538B2 (en) 2012-10-09 2013-09-24 Indexed inline substrate processing tool
US14/034,921 2013-09-24
PCT/US2013/061404 WO2014058612A1 (en) 2012-10-09 2013-09-24 Indexed inline substrate processing tool

Publications (3)

Publication Number Publication Date
JP2015533195A JP2015533195A (ja) 2015-11-19
JP2015533195A5 true JP2015533195A5 (https=) 2016-11-10
JP6285446B2 JP6285446B2 (ja) 2018-02-28

Family

ID=50432986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015535693A Expired - Fee Related JP6285446B2 (ja) 2012-10-09 2013-09-24 割り送り式インライン基板処理ツール

Country Status (6)

Country Link
US (1) US9406538B2 (https=)
JP (1) JP6285446B2 (https=)
KR (1) KR101782874B1 (https=)
CN (1) CN104704624B (https=)
TW (1) TWI592513B (https=)
WO (1) WO2014058612A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106716649A (zh) * 2014-09-19 2017-05-24 应用材料公司 平行板式串联基板处理工具
DE112018007706T5 (de) * 2018-06-08 2021-02-18 Toshiba Mitsubishi-Electric Industrial Systems Corporation Filmausbildungsvorrichtung
CN113874544B (zh) * 2019-05-24 2025-06-27 应用材料公司 用于热处理的设备、基板处理系统、用于在基板处理期间支撑基板的载体、和用于感应加热在基板处理系统中的载体的方法
KR20260011433A (ko) * 2024-07-16 2026-01-23 (주)에스티아이 기판 공정 시스템 및 이를 이용한 기판 공정 방법

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