JP2015528756A5 - - Google Patents

Download PDF

Info

Publication number
JP2015528756A5
JP2015528756A5 JP2015520159A JP2015520159A JP2015528756A5 JP 2015528756 A5 JP2015528756 A5 JP 2015528756A5 JP 2015520159 A JP2015520159 A JP 2015520159A JP 2015520159 A JP2015520159 A JP 2015520159A JP 2015528756 A5 JP2015528756 A5 JP 2015528756A5
Authority
JP
Japan
Prior art keywords
article
epoxy resin
layer
polymer layer
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015520159A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015528756A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/029571 external-priority patent/WO2014003835A1/en
Publication of JP2015528756A publication Critical patent/JP2015528756A/ja
Publication of JP2015528756A5 publication Critical patent/JP2015528756A5/ja
Pending legal-status Critical Current

Links

JP2015520159A 2012-06-28 2013-03-07 熱伝導性基板物品 Pending JP2015528756A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261665524P 2012-06-28 2012-06-28
US61/665,524 2012-06-28
PCT/US2013/029571 WO2014003835A1 (en) 2012-06-28 2013-03-07 Thermally conductive substrate article

Publications (2)

Publication Number Publication Date
JP2015528756A JP2015528756A (ja) 2015-10-01
JP2015528756A5 true JP2015528756A5 (enExample) 2016-04-21

Family

ID=49783725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015520159A Pending JP2015528756A (ja) 2012-06-28 2013-03-07 熱伝導性基板物品

Country Status (6)

Country Link
US (1) US10568233B2 (enExample)
JP (1) JP2015528756A (enExample)
KR (1) KR20150036178A (enExample)
CN (1) CN104396356B (enExample)
TW (1) TWI579147B (enExample)
WO (1) WO2014003835A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150036178A (ko) 2012-06-28 2015-04-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열전도성 기재 물품
CN105636411B (zh) * 2015-12-30 2018-02-16 中国电子科技集团公司第二十六研究所 液冷用金属流道制作方法及液冷金属流道冷板
US10116018B2 (en) * 2016-01-07 2018-10-30 GM Global Technology Operations LLC Cure in place thermal interface material
TWI686309B (zh) * 2019-01-09 2020-03-01 可成科技股份有限公司 散熱結構及其製造方法
CN115011073A (zh) * 2022-07-07 2022-09-06 Oppo广东移动通信有限公司 纤维增强塑料及其制备方法、电子设备结构件和电子设备

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878316A (en) * 1970-07-08 1975-04-15 Gaylord L Groff Laminate comprising non-woven fibrous backing
CA1014838A (en) 1973-02-21 1977-08-02 Takahiro Nakayama Flexible metal-clad laminates and method for manufacturing the same
US3948811A (en) 1973-05-29 1976-04-06 Acheson Industries, Inc. Electrically conductive sheet composition
DE3688798T2 (de) 1985-01-23 1993-12-23 Toyo Boseki Mittels einer nichtgewobenen Stoffbahn aus Polyaramid verstärkte biegsame Folie und Verwendung derselben.
US4684678A (en) 1985-05-30 1987-08-04 Minnesota Mining And Manufacturing Company Epoxy resin curing agent, process, and composition
JP2575793B2 (ja) 1988-04-22 1997-01-29 東芝ケミカル株式会社 耐熱性銅張積層板
US4985297A (en) 1988-04-30 1991-01-15 Daikin Industries, Inc. Composite materials
US5024858A (en) * 1988-07-07 1991-06-18 E. I. Du Pont De Nemours And Company Metallized polymers and method
US4994316A (en) 1989-07-18 1991-02-19 The Dexter Corporation Circuit boards
DE4102473A1 (de) 1990-08-21 1992-02-27 Freudenberg Carl Fa Traeger fuer kupferfolien von flexiblen leiterplatten
JPH04250683A (ja) 1991-01-25 1992-09-07 Unitika Ltd 熱硬化性樹脂組成物並びにそれを用いたプレプリーグおよび銅張積層板
JPH09504568A (ja) 1993-11-03 1997-05-06 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド 導電性接着剤
JP2732822B2 (ja) 1995-12-28 1998-03-30 デュポン帝人アドバンスドペーパー株式会社 複合体シートおよびその製造方法
JPH11117184A (ja) * 1997-10-14 1999-04-27 Oji Paper Co Ltd 積層板用基材及びその製造方法ならびにプリプレグ及び積層板
US6294270B1 (en) * 1998-12-23 2001-09-25 3M Innovative Properties Company Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
JP3412585B2 (ja) 1999-11-25 2003-06-03 松下電工株式会社 プリント配線板及び多層プリント配線板の製造に用いられるプリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
US7348045B2 (en) 2002-09-05 2008-03-25 3M Innovative Properties Company Controlled depth etched dielectric film
US6403211B1 (en) 2000-07-18 2002-06-11 3M Innovative Properties Company Liquid crystal polymer for flexible circuits
JP2002060514A (ja) * 2000-08-17 2002-02-26 Mitsubishi Gas Chem Co Inc プリプレグの製造方法
GB0020630D0 (en) 2000-08-22 2000-10-11 Cytec Tech Corp Support structure or carrier for a curable composition
BR0113446A (pt) * 2000-08-22 2003-07-01 Cytec Tech Corp Elemento polimérico flexìvel, método para a preparação do mesmo, estrutura de suporte ou carregadora, processo para a preparação da mesma, composição curável, processo para a preparação da mesma, método para a preparação e cura de uma composição ou compósito curados, conjunto de partes, método para selecionar ou combinar uma matriz de resina, estrutura conformada complexa, material pré-impregnado ou pré-forma, ou compósito curado, ou corpo de resina
JP2002226718A (ja) 2001-02-02 2002-08-14 Unitika Ltd プリント基板用材料及びプリント基板
JP2002348768A (ja) * 2001-05-28 2002-12-04 Matsushita Electric Works Ltd 全芳香族繊維不織布、プリプレグ、積層板及び多層プリント配線板
US6611046B2 (en) 2001-06-05 2003-08-26 3M Innovative Properties Company Flexible polyimide circuits having predetermined via angles
JP4128341B2 (ja) 2001-07-16 2008-07-30 株式会社タイカ フレキシブル配線板用基板
US20030091777A1 (en) 2001-08-14 2003-05-15 Peter Jones Clean release tape for EMI shielding
US6929848B2 (en) 2001-08-30 2005-08-16 E.I. Du Pont De Nemours And Company Sheet material especially useful for circuit boards
JP2003206360A (ja) 2002-01-16 2003-07-22 Sumitomo Bakelite Co Ltd プリプレグ及びそれを用いたプリント配線板
JP2003213019A (ja) 2002-01-24 2003-07-30 Sumitomo Bakelite Co Ltd プリプレグ及びそれを用いたプリント配線板
JP2004002653A (ja) 2002-04-22 2004-01-08 Shin Kobe Electric Mach Co Ltd プリント基板用プリプレグ及びその製造法とプリント基板
US6919504B2 (en) 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
JP2004241647A (ja) * 2003-02-06 2004-08-26 Shin Kobe Electric Mach Co Ltd プリント配線板用長尺積層体及びその製造法
KR100528925B1 (ko) 2003-09-09 2005-11-15 삼성에스디아이 주식회사 방열시트 및 이를 구비한 플라즈마 디스플레이 장치
JP2006200066A (ja) * 2005-01-20 2006-08-03 Teijin Techno Products Ltd 芳香族ポリアミド繊維紙及びそれを用いたプリプレグ
US7524388B2 (en) 2005-05-10 2009-04-28 World Properties, Inc. Composites, method of manufacture thereof, and articles formed therefrom
JP4708134B2 (ja) 2005-09-14 2011-06-22 日東電工株式会社 通音膜、通音膜付き電子部品及びその電子部品を実装した回路基板の製造方法
KR100835658B1 (ko) 2006-09-05 2008-06-09 최재철 전자파 흡수체 및 그 시공방법
RU2467420C2 (ru) 2006-09-11 2012-11-20 3М Инновейтив Пропертиз Компани Уплотненные проводящие материалы и изготовленные из них изделия
CN101522795A (zh) 2006-09-29 2009-09-02 日本瑞翁株式会社 固化性树脂组合物、复合体、成形体、层压体及多层电路基板
CN101415295A (zh) * 2007-10-19 2009-04-22 晟茂（青岛）先进材料有限公司 一种石墨基新型电子电路板及其制作工艺
US20090142567A1 (en) * 2007-12-03 2009-06-04 E.I. Du Pont De Nemours And Company Thermally conductive aramid-based dielectric substrates for printed circuit boards and integrated circuit chip packaging
US9012021B2 (en) 2008-03-26 2015-04-21 Xerox Corporation Composition of matter for composite plastic contact elements featuring controlled conduction pathways, and related manufacturing processes
JP4645726B2 (ja) 2008-05-19 2011-03-09 パナソニック電工株式会社 積層板、プリプレグ、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
WO2009142192A1 (ja) 2008-05-19 2009-11-26 パナソニック電工株式会社 積層板、金属箔張積層板、回路基板及びｌｅｄ搭載用回路基板
SG175763A1 (en) * 2009-05-01 2011-12-29 3M Innovative Properties Co Passive electrical article
US9061478B2 (en) 2011-05-18 2015-06-23 3M Innovative Properties Company Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom
KR20140091456A (ko) 2011-10-25 2014-07-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 부직 접착 테이프 및 그로부터의 물품
US20130118773A1 (en) 2011-11-11 2013-05-16 3M Innovative Properties Company Z-axis conductive article and method of making the same
KR20150036178A (ko) 2012-06-28 2015-04-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열전도성 기재 물품

Similar Documents

Publication Publication Date Title
JP2013188229A5 (enExample)
EP3064545A4 (en) NETWORKED RUBBER, TIRE ELEMENTS, VIBRATION ELEMENTS, BELT ELEMENTS AND RUBBER COMPOSITION
JP2015515063A5 (enExample)
ZA201505854B (en) Triangulene oligomers and polymers and their use as hole conducting material
EP2966106A4 (en) EPOXY RESIN COMPOSITION, HARDENED PRODUCT, HEAT EXTRACTION MATERIAL AND ELECTRONIC COMPONENT
ZA201507814B (en) Storage device with three-dimensional protrusions on the outer surface
EP3079155A4 (en) Composite material having improved electrical conductivity and molded part containing same
BR112015022743A2 (pt) tecido não tecido, material compósito laminado e artigo absorvente.
EP3022344A4 (en) Fiber-reinforced plastic material and electronic device including the same
EP3078707A4 (en) Composite material with improved mechanical properties and molded article containing same
EP2977424A4 (en) ANTISTATIC AGENT, ANTISTATIC COMPOSITION, ANTISTATIC RESIN COMPOSITION, AND FORM BODY
EP2695914A4 (en) HEAT-LEADING POLYMER COMPOSITE AND ARTICLES THEREWITH
EP2921524A4 (en) POLYAMIDE RESIN COMPOSITION AND FORM ARTICLES THEREWITH
EP2966102A4 (en) PHOTOCHROME HARDENABLE COMPOSITION, HARDENED PRODUCT THEREOF AND LAMINATE WITH THE HARDENED PRODUCT
EP2980174A4 (en) TEMPERATURE-SENSITIVE THERMOSETTING ADHESIVE FILM, MAGNETIC FILM LAMINATED CIRCUIT SUBSTRATE, AND POSITION DETECTING DEVICE
TWI560169B (en) Piezoelectric material, piezoelectric element, and electronic equipment
EP2969910A4 (en) MICROTRAGM MATERIALS WITH MATERIAL PROPERTY VARIATIONS IN THE LEVEL
WO2015075471A3 (en) Ultrasound transducer and method of manufacturing
PL2978779T3 (pl) Kompozycja tworząca warstwę izolacyjną i jej zastosowanie
EP2982718A4 (en) FORM BODY WITH A LAYER WITH A HEAT-RESISTANT RESIN
EP3056547A4 (en) CONDUCTIVE MATERIAL AND CONVERTER THEREFORE
PL2898041T3 (pl) Materiał termochromowy, kształtki zawierające ten materiał i ich zastosowanie
JP2015528756A5 (enExample)
BR112016011687A2 (pt) Materiais e artigos moldáveis por injeção termoplásticos e dispersáveis em água
EP2963655A4 (en) ELECTRICALLY CONDUCTIVE MICROPARTICLES, ANISOTROPIC ELECTRICALLY CONDUCTIVE MATERIAL AND ELECTRICALLY CONDUCTIVE CONNECTION STRUCTURE