JP2015506588A - サセプタ - Google Patents
サセプタ Download PDFInfo
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- JP2015506588A JP2015506588A JP2014552123A JP2014552123A JP2015506588A JP 2015506588 A JP2015506588 A JP 2015506588A JP 2014552123 A JP2014552123 A JP 2014552123A JP 2014552123 A JP2014552123 A JP 2014552123A JP 2015506588 A JP2015506588 A JP 2015506588A
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- Prior art keywords
- susceptor
- holes
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- Prior art date
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- 238000000034 method Methods 0.000 claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 36
- 230000008569 process Effects 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 87
- 239000007789 gas Substances 0.000 description 34
- 125000001475 halogen functional group Chemical group 0.000 description 10
- 230000008646 thermal stress Effects 0.000 description 10
- 239000010410 layer Substances 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008642 heat stress Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (20)
- 第1領域に提供される複数の第1形態の孔と、
第2領域に提供される複数の第2形態の孔と、を含み、
前記第1形態の孔は第1パターンに形成され、
前記第2形態の孔は第2パターンに形成され、
前記第1及び第2パターンは互いに異なり、
前記第1及び第2領域は工程が行われる半導体素子の少なくとも一部分と対応する位置でオーバーラップされるサセプタ。 - 前記第1及び第2形態の孔は同じ平面上で整列される請求項1に記載のサセプタ。
- 第1パターンに形成された第1形態の孔と第2パターンに形成された第2形態の孔は互いに異なる大きさに形成される請求項1に記載のサセプタ。
- 第1パターンに形成された第1形態の孔と第2パターンに形成された第2形態の孔は互いに異なるように離隔される請求項1に記載のサセプタ。
- 前記第1領域は前記サセプタの中心から第1距離を有し、前記第2領域は前記サセプタの中心から第2距離を有し、前記第1距離は前記第2距離と異なる請求項1に記載のサセプタ。
- 前記第1距離は前記第2距離より大きい請求項5に記載のサセプタ。
- 前記第1パターンは前記第2パターンと異なる請求項1に記載のサセプタ。
- 前記第1及び第2パターンは円形パターンである請求項1に記載のサセプタ。
- 前記第1及び第2形態の孔の上部に位置する第1表面、前記第1又は第2形態の孔を少なくとも一つ含む第2表面を含み、前記第2表面は第1平面に置かれ、前記第2表面は前記第1平面とは異なる第2平面に置かれる請求項1に記載のサセプタ。
- 前記第1及び第2表面の間に位置する第3表面を含み、前記第3表面は前記第1及び第2表面とは異なる方向を有する請求項9に記載のサセプタ。
- 前記第3表面の少なくとも一部分は前記工程が行われる半導体素子の前記少なくとも一部分と隣接するように位置する請求項10に記載のサセプタ。
- 前記第3表面は前記第1又は第2表面のうち少なくともいずれか一つに対して傾斜する請求項10に記載のサセプタ。
- 前記第3表面は前記第1又は第2表面のうち少なくともいずれか一つに対して垂直に形成される請求項10に記載のサセプタ。
- 前記第3表面は少なくとも一つの段を含む請求項10に記載のサセプタ。
- リフトピンが収容される少なくとも一つ以上の第3形態の孔を更に含む請求項1に記載のサセプタ。
- 前記半導体素子のうち前記一部分はウェハである請求項1に記載のサセプタ。
- 半導体素子の少なくとも一部分を製造する方法であって、
サセプタを含む工程装置を提供するステップと、
前記サセプタの上部にウェハを配置するステップと、
前記ウェハとサセプタを含む前記工程装置にガスを注入するステップと、を含み、
前記サセプタは第1領域に配置された複数個の第1形態の孔と第2領域に配置された複数個の第2形態の孔を含み、
前記第1形態の孔は第1パターンに提供され、
前記第2形態の孔は第2パターンに提供され、
前記第1パターンは前記第2パターンとは異なり、前記第1及び第2領域は前記半導体素子の前記少なくとも一部分と対応する位置でオーバーラップされるサセプタ製造方法。 - 前記半導体素子の前記少なくとも一部分はウェハを含む請求項17に記載のサセプタ製造方法。
- 前記ガスは排出ガス又は洗浄ガスである請求項17に記載のサセプタ製造方法。
- 前記第1及び第2形態の孔は同じ平面上に位置し、前記第1パターンに形成された第1形態の孔と前記第2パターンに形成された第2形態の孔は互いに異なる大きさ又は互いに異なる間隔を有し、又は大きさと間隔の両方とも異なる請求項17に記載のサセプタ製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0004219 | 2012-01-13 | ||
KR1020120004219A KR101339591B1 (ko) | 2012-01-13 | 2012-01-13 | 서셉터 |
PCT/KR2013/000123 WO2013105766A1 (en) | 2012-01-13 | 2013-01-08 | Susceptor |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2015506588A true JP2015506588A (ja) | 2015-03-02 |
Family
ID=48779091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014552123A Pending JP2015506588A (ja) | 2012-01-13 | 2013-01-08 | サセプタ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130180446A1 (ja) |
EP (1) | EP2803080A4 (ja) |
JP (1) | JP2015506588A (ja) |
KR (1) | KR101339591B1 (ja) |
TW (1) | TW201332055A (ja) |
WO (1) | WO2013105766A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016184734A (ja) * | 2015-03-25 | 2016-10-20 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | エピタキシャル成長装置用のチャンバ構成要素 |
JP2021057372A (ja) * | 2019-09-27 | 2021-04-08 | 株式会社Screenホールディングス | 基板処理装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102014928B1 (ko) * | 2018-01-18 | 2019-08-27 | 에스케이실트론 주식회사 | 서셉터 및 이를 포함하는 기상 증착 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003197532A (ja) * | 2001-12-21 | 2003-07-11 | Sumitomo Mitsubishi Silicon Corp | エピタキシャル成長方法及びエピタキシャル成長用サセプター |
JP2003532612A (ja) * | 2000-11-29 | 2003-11-05 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | オートドーピングおよび後面ハローがないエピタキシャルシリコンウエハ |
JP2008105914A (ja) * | 2006-10-27 | 2008-05-08 | Shin Etsu Handotai Co Ltd | エピタキシャルシリコンウエーハの製造方法及びエピタキシャルシリコンウエーハ |
US20100107974A1 (en) * | 2008-11-06 | 2010-05-06 | Asm America, Inc. | Substrate holder with varying density |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003046966A1 (fr) * | 2001-11-30 | 2003-06-05 | Shin-Etsu Handotai Co., Ltd. | Suscepteur, dispositif de croissance de phase gazeuse, dispositif et procede de fabrication de plaquette epitaxiale, et plaquette epitaxiale |
US20050000449A1 (en) * | 2001-12-21 | 2005-01-06 | Masayuki Ishibashi | Susceptor for epitaxial growth and epitaxial growth method |
JP5156446B2 (ja) * | 2008-03-21 | 2013-03-06 | 株式会社Sumco | 気相成長装置用サセプタ |
KR20100127681A (ko) * | 2009-05-26 | 2010-12-06 | 주식회사 실트론 | 에피택셜 웨이퍼 제조 장치의 서셉터 |
JP2010278196A (ja) | 2009-05-28 | 2010-12-09 | Renesas Electronics Corp | 基板保持治具 |
KR20110087440A (ko) * | 2010-01-26 | 2011-08-03 | 주식회사 엘지실트론 | 반도체 제조용 서셉터 및 이를 포함하는 반도체 제조 장치 |
-
2012
- 2012-01-13 KR KR1020120004219A patent/KR101339591B1/ko active IP Right Grant
-
2013
- 2013-01-08 JP JP2014552123A patent/JP2015506588A/ja active Pending
- 2013-01-08 WO PCT/KR2013/000123 patent/WO2013105766A1/en active Application Filing
- 2013-01-08 TW TW102100542A patent/TW201332055A/zh unknown
- 2013-01-08 EP EP13735567.3A patent/EP2803080A4/en not_active Withdrawn
- 2013-01-14 US US13/740,779 patent/US20130180446A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003532612A (ja) * | 2000-11-29 | 2003-11-05 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | オートドーピングおよび後面ハローがないエピタキシャルシリコンウエハ |
JP2003197532A (ja) * | 2001-12-21 | 2003-07-11 | Sumitomo Mitsubishi Silicon Corp | エピタキシャル成長方法及びエピタキシャル成長用サセプター |
JP2005515630A (ja) * | 2001-12-21 | 2005-05-26 | 三菱住友シリコン株式会社 | エピタキシャル成長用サセプタおよびエピタキシャル成長方法 |
JP2008277795A (ja) * | 2001-12-21 | 2008-11-13 | Sumco Corp | エピタキシャル成長用サセプタ |
JP2008105914A (ja) * | 2006-10-27 | 2008-05-08 | Shin Etsu Handotai Co Ltd | エピタキシャルシリコンウエーハの製造方法及びエピタキシャルシリコンウエーハ |
US20100107974A1 (en) * | 2008-11-06 | 2010-05-06 | Asm America, Inc. | Substrate holder with varying density |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016184734A (ja) * | 2015-03-25 | 2016-10-20 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | エピタキシャル成長装置用のチャンバ構成要素 |
JP2021057372A (ja) * | 2019-09-27 | 2021-04-08 | 株式会社Screenホールディングス | 基板処理装置 |
JP7325283B2 (ja) | 2019-09-27 | 2023-08-14 | 株式会社Screenホールディングス | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101339591B1 (ko) | 2013-12-10 |
WO2013105766A1 (en) | 2013-07-18 |
KR20130083565A (ko) | 2013-07-23 |
TW201332055A (zh) | 2013-08-01 |
EP2803080A1 (en) | 2014-11-19 |
US20130180446A1 (en) | 2013-07-18 |
EP2803080A4 (en) | 2015-08-12 |
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