JP2015504568A5 - - Google Patents

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Publication number
JP2015504568A5
JP2015504568A5 JP2014533992A JP2014533992A JP2015504568A5 JP 2015504568 A5 JP2015504568 A5 JP 2015504568A5 JP 2014533992 A JP2014533992 A JP 2014533992A JP 2014533992 A JP2014533992 A JP 2014533992A JP 2015504568 A5 JP2015504568 A5 JP 2015504568A5
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JP
Japan
Prior art keywords
etched
copper
silicon
aqueous
etching
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Pending
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JP2014533992A
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English (en)
Japanese (ja)
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JP2015504568A (ja
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Priority claimed from GBGB1117279.8A external-priority patent/GB201117279D0/en
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Publication of JP2015504568A publication Critical patent/JP2015504568A/ja
Publication of JP2015504568A5 publication Critical patent/JP2015504568A5/ja
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JP2014533992A 2011-10-06 2012-10-05 エッチングされたシリコン構造、エッチングされたシリコン構造を形成する方法及びそれらの使用 Pending JP2015504568A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1117279.8 2011-10-06
GBGB1117279.8A GB201117279D0 (en) 2011-10-06 2011-10-06 Etched silicon structures, method of forming etched silicon structures and uses thereof
PCT/GB2012/052483 WO2013050785A1 (en) 2011-10-06 2012-10-05 Etched silicon structures, method of forming etched silicon structures and uses thereof

Publications (2)

Publication Number Publication Date
JP2015504568A JP2015504568A (ja) 2015-02-12
JP2015504568A5 true JP2015504568A5 (cg-RX-API-DMAC7.html) 2015-11-26

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JP2014533992A Pending JP2015504568A (ja) 2011-10-06 2012-10-05 エッチングされたシリコン構造、エッチングされたシリコン構造を形成する方法及びそれらの使用

Country Status (7)

Country Link
US (1) US20140248539A1 (cg-RX-API-DMAC7.html)
EP (1) EP2764563B1 (cg-RX-API-DMAC7.html)
JP (1) JP2015504568A (cg-RX-API-DMAC7.html)
KR (1) KR20140083006A (cg-RX-API-DMAC7.html)
CN (1) CN103988342A (cg-RX-API-DMAC7.html)
GB (2) GB201117279D0 (cg-RX-API-DMAC7.html)
WO (1) WO2013050785A1 (cg-RX-API-DMAC7.html)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201122315D0 (en) * 2011-12-23 2012-02-01 Nexeon Ltd Etched silicon structures, method of forming etched silicon structures and uses thereof
CN108949772A (zh) * 2012-04-02 2018-12-07 现代泰克斯公司 用于产生与人类疾病相关的生物制剂和蛋白质的修饰多核苷酸
EP2834260A4 (en) * 2012-04-02 2016-08-10 Moderna Therapeutics Inc MODIFIED POLYNUCLEOTIDES FOR THE PREPARATION OF MEMBRANE PROTEINS
WO2014193124A1 (ko) 2013-05-30 2014-12-04 주식회사 엘지화학 다공성 실리콘계 음극 활물질, 이의 제조 방법, 및 이를 포함하는 리튬 이차전지
WO2015023760A1 (en) * 2013-08-14 2015-02-19 Board Of Regents, The University Of Texas System Methods of fabricating silicon nanowires and devices containing silicon nanowires
CN105682769A (zh) 2013-10-30 2016-06-15 惠普发展公司,有限责任合伙企业 岛蚀刻的过滤通道
WO2015065395A1 (en) * 2013-10-30 2015-05-07 Hewlett-Packard Development Company, L.P. Nonparallel island etching
KR101753946B1 (ko) 2013-12-03 2017-07-04 주식회사 엘지화학 다공성 실리콘계 음극 활물질, 이의 제조방법 및 이를 포함하는 리튬 이차전지
CN104803342B (zh) * 2014-01-23 2016-08-17 清华大学 碗状金属纳米结构的制备方法
JP6121959B2 (ja) 2014-09-11 2017-04-26 株式会社東芝 エッチング方法、物品及び半導体装置の製造方法、並びにエッチング液
KR101677023B1 (ko) * 2014-10-17 2016-11-17 한양대학교 에리카산학협력단 실리콘 표면 에칭방법 및 시드층 형성방법
DE102015212202A1 (de) * 2015-06-30 2017-01-05 Robert Bosch Gmbh Siliciummonolith-Graphit-Anode für eine Lithium-Zelle
KR101801789B1 (ko) 2015-11-05 2017-11-28 한국과학기술연구원 다공성 탄소 재료 및 이의 제조 방법
KR101859811B1 (ko) * 2016-03-07 2018-06-28 한국과학기술원 금속 나노입자와 금속 초박막이 코팅된 전도성 단결정 실리콘 입자, 이를 포함하는 고용량 이차전지용 음극활물질 및 그 제조방법
US11289700B2 (en) 2016-06-28 2022-03-29 The Research Foundation For The State University Of New York KVOPO4 cathode for sodium ion batteries
CN108075164A (zh) * 2016-11-09 2018-05-25 林逸樵 二次电池及其制作方法
CN108232204A (zh) * 2016-12-10 2018-06-29 中国科学院大连化学物理研究所 一种硅基有序化电极及其制备方法和应用
CN108604617B (zh) * 2016-12-27 2022-06-28 中国建材国际工程集团有限公司 用次氯酸钙活化CdTe薄膜太阳能电池的CdTe层的方法
JP7134778B2 (ja) * 2018-08-09 2022-09-12 株式会社東芝 処理システム
CN109597250B (zh) * 2018-12-26 2021-06-01 Tcl华星光电技术有限公司 蓝相液晶面板的制作方法及其立体电极的制作方法
CN110803706B (zh) * 2019-12-04 2023-03-28 宝鸡文理学院 一种快速高效脱除介孔氧化硅材料模板剂的方法
WO2021167434A1 (ko) * 2020-02-20 2021-08-26 한양대학교 에리카산학협력단 금속 음극 전극, 이를 포함하는 이차 전지, 및 그 제조 방법
CN115136390A (zh) 2020-02-20 2022-09-30 汉阳大学校Erica产学协力团 复合纤维、包含其的固体电解质及包含其的金属空气电池
US20230343941A1 (en) * 2020-09-25 2023-10-26 Tohoku University Lithium-ion secondary battery negative electrode mixture and lithium-ion secondary battery
US12315736B2 (en) * 2022-09-14 2025-05-27 Applied Materials, Inc. Methods of highly selective silicon oxide removal
WO2024249394A1 (en) * 2023-05-27 2024-12-05 University Of Louisville Research Foundation, Inc. Materials and methods for high energy density silicon lithium ion batteries
KR102861629B1 (ko) * 2024-06-03 2025-09-17 한화모멘텀 주식회사 음극재 및 이의 제조방법, 이를 포함하는 리튬이온 이차전지
CN119419233B (zh) * 2024-10-09 2025-12-19 浙江锂威能源科技有限公司 一种金属镀层包覆硅基材料及二次电池

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436259A (en) * 1966-05-12 1969-04-01 Ibm Method for plating and polishing a silicon planar surface
JP3186621B2 (ja) * 1996-12-24 2001-07-11 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6399177B1 (en) 1999-06-03 2002-06-04 The Penn State Research Foundation Deposited thin film void-column network materials
US6790785B1 (en) * 2000-09-15 2004-09-14 The Board Of Trustees Of The University Of Illinois Metal-assisted chemical etch porous silicon formation method
GB2395059B (en) 2002-11-05 2005-03-16 Imp College Innovations Ltd Structured silicon anode
US7244513B2 (en) * 2003-02-21 2007-07-17 Nano-Proprietary, Inc. Stain-etched silicon powder
FR2853562B1 (fr) * 2003-04-14 2006-08-11 Centre Nat Rech Scient Procede de fabrication de granules semiconducteurs
TW200620451A (en) * 2004-11-09 2006-06-16 Univ Osaka Method for forming hole in crystal substrate, and crystal substrate having hole formed by the method
DE102005041877A1 (de) * 2005-09-02 2007-03-08 Koynov, Svetoslav, Dr. Verfahren zur Herstellung siliziumhaltiger Oberflächen und optoelektronische Bauelemente
GB0601318D0 (en) * 2006-01-23 2006-03-01 Imp Innovations Ltd Method of etching a silicon-based material
WO2008044683A1 (en) * 2006-10-10 2008-04-17 Panasonic Corporation Negative electrode for nonaqueous electrolyte secondary battery
JP2008171802A (ja) * 2006-12-13 2008-07-24 Matsushita Electric Ind Co Ltd 非水電解質二次電池用負極とその製造方法およびそれを用いた非水電解質二次電池
FR2914925B1 (fr) 2007-04-13 2009-06-05 Altis Semiconductor Snc Solution utilisee dans la fabrication d'un materiau semi-conducteur poreux et procede de fabrication dudit materiau
GB0709165D0 (en) * 2007-05-11 2007-06-20 Nexeon Ltd A silicon anode for a rechargeable battery
GB0713898D0 (en) 2007-07-17 2007-08-29 Nexeon Ltd A method of fabricating structured particles composed of silcon or a silicon-based material and their use in lithium rechargeable batteries
US8815104B2 (en) * 2008-03-21 2014-08-26 Alliance For Sustainable Energy, Llc Copper-assisted, anti-reflection etching of silicon surfaces
US8486843B2 (en) * 2008-09-04 2013-07-16 The Board Of Trustrees Of The University Of Illinois Method of forming nanoscale three-dimensional patterns in a porous material
GB2464158B (en) * 2008-10-10 2011-04-20 Nexeon Ltd A method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries
EP2226374B1 (en) * 2009-03-06 2012-05-16 S.O.I. TEC Silicon Etching composition, in particular for silicon materials, method for characterizing defects of such materials and process of treating such surfaces with etching composition
US8278191B2 (en) * 2009-03-31 2012-10-02 Georgia Tech Research Corporation Methods and systems for metal-assisted chemical etching of substrates
KR101103841B1 (ko) * 2009-05-27 2012-01-06 한국과학기술연구원 금속이온 이용 무전해 에칭법에 의한 다발구조의 실리콘 나노로드 제조방법 및 이를 함유하는 리튬이차전지용 음극 활물질
GB0922063D0 (en) 2009-12-17 2010-02-03 Intrinsiq Materials Global Ltd Porous silicon
TWI472477B (zh) 2010-03-02 2015-02-11 國立臺灣大學 矽奈米結構與其製造方法及應用
GB201005979D0 (en) * 2010-04-09 2010-05-26 Nexeon Ltd A method of fabricating structured particles composed of silicon or a silicon-based material and their use in lithium rechargeable batteries

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