JP2015222759A - 電力半導体装置 - Google Patents
電力半導体装置 Download PDFInfo
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Abstract
Description
(実施の形態1)
まず本実施の形態の電力半導体装置の構成について図1〜図3を用いて説明する。図1〜図3を参照して、本実施の形態の電力半導体装置100は、配線基板1と、半導体素子2と、上部配線部材3とを有している。
本実施の形態においては半導体素子2と接合される上部配線部材3が、コア配線部材3aと、その外側の表面上に形成される導通配線部材3bとを有している。コア配線部材3aは導通配線部材3bよりも、半導体素子2との線膨張率の差が小さい。このため、上部配線部材3の熱膨張による変形量が半導体素子2の熱膨張による変形量に近くなり、上部配線部材3が半導体素子2の変形に追随しやすくなる。したがって使用時に半導体素子2が加熱しても上部配線部材3が半導体素子2と接合する上部接合材5などにおいてひずみなどの変形を起こす可能性を低減することができる。
アルミニウム≧はんだ>銅>シリコンカーバイド>シリコン>インバー
の関係が成り立つものとする。
実施の形態1より、上部配線部材3はコア配線部材3aを有することにより、上部配線部材3全体の線膨張率の平均値が、半導体素子2と配線基板1との双方の線膨張率に近づくことが好ましいといえる。そこで本実施の形態においては、上部配線部材3全体の線膨張率の平均値は、半導体素子2の線膨張率よりも大きく、配線基板1の全体の線膨張率の平均値よりも小さくなっていることが好ましい。実施の形態1に示すようにコア配線部材3aとしてインバーを、導通配線部材3bとして高純度の銅を用いることにより、上部配線部材3全体の線膨張率の平均値を半導体素子2の線膨張率よりも大きく、配線基板1の全体の線膨張率の平均値よりも小さくすることができる。
図6および図7を参照して、本実施の形態の電力半導体装置200においては、配線基板1の構成が実施の形態1と異なっている。具体的には、配線基板1は、金属配線基板1aと、絶縁配線基板1bと、金属配線基板1aとがこの順に積層された3層構造となっている。配線基板1は実施の形態1のような2層構造であってもよいが、本実施の形態のような3層構造であってもよい。
上記のように配線基板1に線膨張率の小さい絶縁配線基板1bなどを含めることにより、配線基板1全体の線膨張率が小さくなる。これにより、多くの場合、配線基板1と半導体素子2との線膨張率の差が小さくなるため、配線基板1と半導体素子2とを接合する下部接合材4の信頼性が向上する。
図8〜図11を参照して、本実施の形態の電力半導体装置300においては、接合パッド10の寸法において、実施の形態1と異なっている。具体的には、特に図8および図11の左右方向、すなわち上部配線部材3の延在する方向に交差する幅方向に関する接合パッド10の寸法は、当該幅方向に関する上部配線部材3の寸法以上である。つまり接合パッド10は、上部配線部材3と平面視において重なり、かつ上部配線部材3の延在方向に交差する幅方向に関して上部配線部材3からはみ出ているか、あるいは上部配線部材3の幅方向に関する外縁と重なる外縁を有するように上部配線部材3とほぼ等しい幅を有している。なお上部接合材5が上部配線部材3と特に幅方向において重なるように形成されているため、接合パッド10の上記幅方向の寸法は、当該幅方向に関する上部接合材5の寸法以上である。
本実施の形態においては接合パッド10が、特に幅方向に関して、上部配線部材3および上部接合材5以上の寸法を有している(逆に言えば上部配線部材3および上部接合材5が接合パッド10以下の幅方向寸法を有している)。これにより、上部接合材5の半導体素子2側(下側)に発生するひずみを小さくし、上部接合材5のクラックの発生などを抑制することができる。
今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
Claims (11)
- 配線基板と、
前記配線基板の上に、互いに間隔をあけて複数配置された半導体素子と、
前記複数の半導体素子の上に配置され、前記複数の半導体素子のそれぞれと接合される上部配線部材とを備え、
前記上部配線部材は、コア配線部材と、前記コア配線部材の外側の表面上に形成される導通配線部材とを含み、
前記複数の半導体素子と前記上部配線部材とは接合材により互いに接合され、
前記コア配線部材の線膨張率は前記導通配線部材の線膨張率よりも小さく、
前記コア配線部材と前記半導体素子との線膨張率の差は前記導通配線部材と前記半導体素子との線膨張率の差よりも小さく、
前記導通配線部材と前記接合材との線膨張率の差は前記コア配線部材と前記接合材との線膨張率の差よりも小さく、
前記コア配線部材は、前記導通配線部材よりも、降伏応力または0.2%耐力の少なくともいずれかが大きい、電力半導体装置。 - 前記接合材の線膨張率は前記導通配線部材の線膨張率よりも大きい、請求項1に記載の電力半導体装置。
- 前記コア配線部材は、前記導通配線部材よりもヤング率が大きい、請求項1または請求項2に記載の電力半導体装置。
- 前記コア配線部材と前記配線基板との線膨張率の差は前記導通配線部材と前記配線基板との線膨張率の差よりも小さい、請求項1〜請求項3のいずれか1項に記載の電力半導体装置。
- 前記導通配線部材は前記コア配線部材の一方および他方の主表面を覆うように形成され、
前記コア配線部材の一方の主表面上に形成される前記導通配線部材と前記コア配線部材の他方の主表面上に形成される前記導通配線部材との厚みが等しい、請求項1〜請求項4のいずれか1項に記載の電力半導体装置。 - 前記配線基板の線膨張率の平均値はアルミニウムの線膨張率よりも小さく、前記上部配線部材の線膨張率の平均値と前記配線基板の線膨張率の平均値との差が3×10-6以下である、請求項1〜請求項5のいずれか1項に記載の電力半導体装置。
- 前記配線基板は、絶縁配線基板と、前記絶縁配線基板の一方および他方の主表面を覆うように形成される金属配線基板とを含み、
前記絶縁配線基板の一方の主表面上に形成される前記金属配線基板と前記絶縁配線基板の他方の主表面上に形成される前記金属配線基板との厚みが等しい、請求項1〜請求項6のいずれか1項に記載の電力半導体装置。 - 前記半導体素子と前記接合材との間に、前記上部配線部材と平面視において重なるように配置された接合パッドをさらに備え、
前記上部配線部材の延在する方向に交差する幅方向に関する前記接合パッドの寸法は、前記幅方向に関する前記上部配線部材の寸法以上である、請求項1〜請求項7のいずれか1項に記載の電力半導体装置。 - 前記コア配線部材はインバー、前記導通配線部材は高純度の銅により形成される、請求項1〜請求項8のいずれか1項に記載の電力半導体装置。
- 前記複数の半導体素子のそれぞれは、シリコンカーバイドまたは窒化ガリウムからなる、請求項1〜請求項9のいずれか1項に記載の電力半導体装置。
- 前記上部配線部材の線膨張率の平均値は前記半導体素子の線膨張率よりも大きく、前記配線基板の線膨張率の平均値よりも小さい、請求項1〜請求項10のいずれか1項に記載の電力半導体装置。
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