JP2015221401A - 塗布処理装置 - Google Patents
塗布処理装置 Download PDFInfo
- Publication number
- JP2015221401A JP2015221401A JP2014106078A JP2014106078A JP2015221401A JP 2015221401 A JP2015221401 A JP 2015221401A JP 2014106078 A JP2014106078 A JP 2014106078A JP 2014106078 A JP2014106078 A JP 2014106078A JP 2015221401 A JP2015221401 A JP 2015221401A
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- JP
- Japan
- Prior art keywords
- coating
- substrate
- wafer
- nozzle
- discharge port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000576 coating method Methods 0.000 title claims abstract description 254
- 239000011248 coating agent Substances 0.000 title claims abstract description 242
- 239000007788 liquid Substances 0.000 claims abstract description 112
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000007246 mechanism Effects 0.000 claims abstract description 46
- 238000012545 processing Methods 0.000 claims description 46
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 6
- 230000003028 elevating effect Effects 0.000 description 6
- 238000004528 spin coating Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
10 載置台
20 移動機構
21 ウェハ保持部
22 駆動部
30 塗布ノズル
31 本体部
32 吐出口
32a 第1端部
32b 第2端部
33 貯留室
34 流路
35 供給管
36 塗布液供給源
37 供給機器群
40 昇降機構
41 固定部
42 駆動部
100 制御部
C 塗布液
W ウェハ
Wa 一端部
Wb 他端部
Claims (4)
- 基板に塗布液を塗布する塗布処理装置であって、
スリット状の吐出口から基板に塗布液を吐出する塗布ノズルと、
前記吐出口の長手方向の直交方向に基板と前記塗布ノズルを相対的に移動させる移動機構と、
前記塗布ノズルと前記移動機構を制御する制御部と、を有し、
前記制御部は、
前記吐出口の基板側の第1端部が基板周縁の一端部に位置した際に、前記吐出口から塗布液を露出させつつ、前記移動機構によって基板と前記塗布ノズルを相対的に移動させる開始工程と、
その後、前記吐出口から吐出された塗布液を基板に接液させながら、前記移動機構によって基板と前記塗布ノズルを水平方向に相対的に移動させることで基板に塗布液を塗布する塗布工程と、
その後、前記吐出口において前記第1端部と反対側の第2端部が基板周縁の他端部に位置した際に、前記吐出口から塗布液を露出させつつ、前記移動機構によって基板と前記塗布ノズルを相対的に移動させる終了工程と、
を実行するように前記塗布ノズルと前記移動機構を制御することを特徴とする、塗布処理装置。 - 前記制御部は、
前記開始工程において、少なくとも前記第1端部が前記基板周縁の一端部に位置してから、前記第2端部が前記基板周縁の一端部に位置するまでの間、第1速度で基板と前記塗布ノズルを相対的に移動させ、
前記塗布工程において、前記第1速度より速い第2速度で基板と前記塗布ノズルを相対的に移動させるように、前記移動機構を制御することを特徴とする、請求項1に記載の塗布処理装置。 - 前記制御部は、前記終了工程において、前記塗布工程における基板と前記塗布ノズルの相対的な移動速度と同じ速度で、基板と前記塗布ノズルを相対的に移動させるように、前記移動機構を制御することを特徴とする、請求項1又は2に記載の塗布処理装置。
- 前記塗布ノズルは、毛細管現象によって前記吐出口から塗布液を引き出して基板に供給することを特徴とする、請求項1〜3のいずれか一項に記載の塗布処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014106078A JP6272138B2 (ja) | 2014-05-22 | 2014-05-22 | 塗布処理装置 |
KR1020150062912A KR102316266B1 (ko) | 2014-05-22 | 2015-05-06 | 도포 처리 장치 |
US14/715,721 US10112210B2 (en) | 2014-05-22 | 2015-05-19 | Coating processing apparatus for coating liquid on substrate moving in a horizontal direction with slit-shaped ejecting port moving in a vertical direction |
TW104115973A TWI622432B (zh) | 2014-05-22 | 2015-05-20 | 塗布處理裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014106078A JP6272138B2 (ja) | 2014-05-22 | 2014-05-22 | 塗布処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015221401A true JP2015221401A (ja) | 2015-12-10 |
JP6272138B2 JP6272138B2 (ja) | 2018-01-31 |
Family
ID=54555375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014106078A Active JP6272138B2 (ja) | 2014-05-22 | 2014-05-22 | 塗布処理装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10112210B2 (ja) |
JP (1) | JP6272138B2 (ja) |
KR (1) | KR102316266B1 (ja) |
TW (1) | TWI622432B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018186120A (ja) * | 2017-04-24 | 2018-11-22 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5719546B2 (ja) * | 2009-09-08 | 2015-05-20 | 東京応化工業株式会社 | 塗布装置及び塗布方法 |
KR101877101B1 (ko) * | 2015-07-28 | 2018-08-09 | 주식회사 엘지화학 | 전극 활물질 슬러리 코팅 장치 및 방법 |
KR102492394B1 (ko) * | 2017-04-28 | 2023-01-27 | 도쿄엘렉트론가부시키가이샤 | 도포 처리 장치, 도포 처리 방법 및 광학막 형성 장치 |
CN107731661A (zh) * | 2017-11-14 | 2018-02-23 | 山东芯诺电子科技股份有限公司 | 一种玻璃钝化晶片玻璃胶涂覆方法及装置 |
US11660632B2 (en) * | 2018-03-28 | 2023-05-30 | Ecosys S.R.L. | Device for coating, in particular painting, the main surfaces of rigid panels with liquid products |
WO2021019435A1 (en) * | 2019-07-29 | 2021-02-04 | Xtpl S.A. | Methods of dispensing a metallic nanoparticle composition from a nozzle onto a substrate |
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2014
- 2014-05-22 JP JP2014106078A patent/JP6272138B2/ja active Active
-
2015
- 2015-05-06 KR KR1020150062912A patent/KR102316266B1/ko active IP Right Grant
- 2015-05-19 US US14/715,721 patent/US10112210B2/en active Active
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JP2018186120A (ja) * | 2017-04-24 | 2018-11-22 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
JP7220975B2 (ja) | 2017-04-24 | 2023-02-13 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
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US10112210B2 (en) | 2018-10-30 |
KR20150135075A (ko) | 2015-12-02 |
TWI622432B (zh) | 2018-05-01 |
JP6272138B2 (ja) | 2018-01-31 |
US20150336114A1 (en) | 2015-11-26 |
TW201611899A (en) | 2016-04-01 |
KR102316266B1 (ko) | 2021-10-25 |
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