JP2015191911A - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
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- JP2015191911A JP2015191911A JP2014065821A JP2014065821A JP2015191911A JP 2015191911 A JP2015191911 A JP 2015191911A JP 2014065821 A JP2014065821 A JP 2014065821A JP 2014065821 A JP2014065821 A JP 2014065821A JP 2015191911 A JP2015191911 A JP 2015191911A
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- 229910052751 metal Inorganic materials 0.000 claims description 83
- 239000002184 metal Substances 0.000 claims description 83
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 62
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- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 9
- 229910002601 GaN Inorganic materials 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
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- 239000010953 base metal Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
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- 239000010703 silicon Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
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- 238000000748 compression moulding Methods 0.000 description 1
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- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Abstract
【解決手段】発光層の放射光に対して透過性を有する光学層が、半導体層の第1の側、およびチップ外周部の第2の絶縁膜上に設けられている。半導体層の第1の側には複数の凸部と複数の凹部とが設けられ、凸部の頂部は、チップ外周部の光学層における第2の絶縁膜側の端よりも、第2の側に位置する。
【選択図】図1
Description
図2(a)は、実施形態の半導体発光装置におけるp側電極16とn側電極17の平面レイアウトの一例を示す模式平面図である。図1は、図2(a)におけるA−A’断面に対応する。図2(a)は、図1における配線部41、43、樹脂層25、絶縁膜18、および反射膜51を取り除いて半導体層15の第2の側を見た図に対応する。また、図2(a)は、図8(b)の積層体(基板10を除く)の上面図に対応する。
図2(b)は、実施形態の半導体発光装置の実装面(図1の半導体発光装置の下面)の模式平面図である。
図6は、実施形態の半導体発光装置における第1の側15a付近の断面の電子顕微鏡画像である。
Claims (13)
- 第1の側と、前記第1の側の反対側の第2の側とを持ち、発光層を有する半導体層と、
前記第2の側において前記半導体層に設けられた第1の電極と、
前記第2の側において前記半導体層に設けられた第2の電極と、
前記第2の側に設けられた第1の絶縁膜と、
前記第1の絶縁膜上に設けられるとともに、前記第1の電極に接続された第1の配線部と、
前記第1の絶縁膜上に設けられるとともに、前記第2の電極に接続された第2の配線部と、
前記第1の配線部と前記第2の配線部との間、および前記半導体層の側面に隣接するチップ外周部に設けられた第2の絶縁膜と、
前記第1の側、および前記チップ外周部の前記第2の絶縁膜上に設けられ、前記発光層の放射光に対して透過性を有する光学層と、
を備え、
前記第1の側には複数の凸部と複数の凹部とが設けられ、前記凸部の頂部は、前記チップ外周部の前記光学層における前記第2の絶縁膜側の端よりも、前記第2の側に位置する半導体発光装置。 - 前記凸部の前記頂部は、前記光学層の前記第2の絶縁膜側の端に対して1μm以上前記第2の側に位置する請求項1記載の半導体発光装置。
- 前記第1の側には複数の凸部と複数の凹部とが設けられ、前記複数の凸部は、第1の凸部と、前記第1の凸部よりも高さが低い第2の凸部とを有する請求項1または2に記載の半導体発光装置。
- 前記第1の側におけるチップ外周部側よりも中心部側の領域が前記第2の側にくぼむように前記第1の側が湾曲している請求項1〜3のいずれか1つに記載の半導体発光装置。
- 第1の側と、前記第1の側の反対側の第2の側とを持ち、発光層を有する半導体層と、
前記第2の側において前記半導体層に設けられた第1の電極と、
前記第2の側において前記半導体層に設けられた第2の電極と、
前記第2の側に設けられた第1の絶縁膜と、
前記第1の絶縁膜上に設けられるとともに、前記第1の電極に接続された第1の配線部と、
前記第1の絶縁膜上に設けられるとともに、前記第2の電極に接続された第2の配線部と、
前記第1の配線部と前記第2の配線部との間に設けられた第2の絶縁膜と、
前記第1の側に設けられ、前記発光層の放射光に対して透過性を有する光学層と、
を備え、
前記第1の側には複数の凸部と複数の凹部とが設けられ、前記複数の凸部は、第1の凸部と、前記第1の凸部よりも高さが低い第2の凸部とを有する半導体発光装置。 - 前記第1の凸部の高さは前記第2の凸部の高さの2倍以上である請求項5記載の半導体発光装置。
- 第1の側と、前記第1の側の反対側の第2の側とを持ち、発光層を有する半導体層と、
前記第2の側において前記半導体層に設けられた第1の電極と、
前記第2の側において前記半導体層に設けられた第2の電極と、
前記第2の側に設けられた第1の絶縁膜と、
前記第1の絶縁膜上に設けられるとともに、前記第1の電極に接続された第1の配線部と、
前記第1の絶縁膜上に設けられるとともに、前記第2の電極に接続された第2の配線部と、
前記第1の配線部と前記第2の配線部との間に設けられた第2の絶縁膜と、
前記第1の側に設けられ、前記発光層の放射光に対して透過性を有する光学層と、
を備え、
前記第1の側におけるチップ外周部側よりも中心部側の領域が前記第2の側にくぼむように前記第1の側が湾曲している半導体発光装置。 - 前記第1の側は粗面化されている請求項7記載の半導体発光装置。
- 前記第1の絶縁膜は、前記半導体層における前記第1の側に続く側面にも設けられている請求項1〜8のいずれか1つに記載の半導体発光装置。
- 前記半導体層の前記側面に、前記第1の絶縁膜を介して反射膜が設けられている請求項9記載の半導体発光装置。
- 前記半導体層の前記側面は、前記第1の側及び前記第2の側に対して傾斜している請求項9または10に記載の半導体発光装置。
- 前記第1の配線部は、前記第1の絶縁膜上に設けられた第1の配線層と、前記第1の配線層上に設けられ、前記第1の配線層よりも厚い第1の金属ピラーとを有し、
前記第2の配線部は、前記第1の絶縁膜上に設けられた第2の配線層と、前記第2の配線層上に設けられ、前記第2の配線層よりも厚い第2の金属ピラーとを有する請求項1〜11のいずれか1つに記載の半導体発光装置。 - 前記光学層は、
前記発光層の放射光により励起され前記発光層の放射光とは異なる波長の光を放射する複数の蛍光体と、
前記複数の蛍光体を一体化し、前記発光層の放射光及び前記蛍光体の放射光を透過させる結合材と、
を含む蛍光体層である請求項1〜12のいずれか1つに記載の半導体発光装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014065821A JP6106120B2 (ja) | 2014-03-27 | 2014-03-27 | 半導体発光装置 |
TW103124605A TWI550910B (zh) | 2014-03-27 | 2014-07-17 | Semiconductor light emitting device |
CN201410454133.6A CN104953016A (zh) | 2014-03-27 | 2014-09-05 | 半导体发光装置 |
US14/481,262 US9224919B2 (en) | 2014-03-27 | 2014-09-09 | Semiconductor light emitting device |
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JP2014065821A JP6106120B2 (ja) | 2014-03-27 | 2014-03-27 | 半導体発光装置 |
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JP2015191911A true JP2015191911A (ja) | 2015-11-02 |
JP6106120B2 JP6106120B2 (ja) | 2017-03-29 |
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JP2014065821A Active JP6106120B2 (ja) | 2014-03-27 | 2014-03-27 | 半導体発光装置 |
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US (1) | US9224919B2 (ja) |
JP (1) | JP6106120B2 (ja) |
CN (1) | CN104953016A (ja) |
TW (1) | TWI550910B (ja) |
Cited By (1)
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JP2016004959A (ja) * | 2014-06-19 | 2016-01-12 | サンケン電気株式会社 | 発光装置 |
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