JP5837456B2 - 半導体発光装置及び発光モジュール - Google Patents
半導体発光装置及び発光モジュール Download PDFInfo
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- JP5837456B2 JP5837456B2 JP2012120547A JP2012120547A JP5837456B2 JP 5837456 B2 JP5837456 B2 JP 5837456B2 JP 2012120547 A JP2012120547 A JP 2012120547A JP 2012120547 A JP2012120547 A JP 2012120547A JP 5837456 B2 JP5837456 B2 JP 5837456B2
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- 239000004065 semiconductor Substances 0.000 title claims description 239
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 114
- 229910052751 metal Inorganic materials 0.000 claims description 88
- 239000002184 metal Substances 0.000 claims description 88
- 239000000758 substrate Substances 0.000 claims description 61
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 37
- 239000011347 resin Substances 0.000 description 37
- 238000004519 manufacturing process Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 12
- 230000005284 excitation Effects 0.000 description 11
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910002601 GaN Inorganic materials 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000010948 rhodium Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910004122 SrSi Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
図1(a)は、第1実施形態の半導体発光装置1aの模式断面図であり、図1(b)は、その半導体発光装置1aの模式上面図である。
図2(a)は、第2実施形態の半導体発光装置1bの模式断面図であり、図2(b)は、その半導体発光装置1bの模式上面図である。
図3(a)は、第3実施形態の半導体発光装置1cの模式断面図であり、図3(b)は、その半導体発光装置1cの模式上面図である。
図10は、第4実施形態の半導体発光装置1dの模式断面図である。
次に、図11(b)は、第5実施形態の半導体発光装置1eの模式断面図である。
図12(a)は、第6実施形態の半導体発光装置1fの模式断面図である。
図12(b)は、第6実施形態の半導体発光装置1gの模式断面図である。
図13(b)は、第8実施形態の半導体発光装置1hの模式断面図である。
図14(b)は、第9実施形態の半導体発光装置1iの模式断面図である。
Claims (7)
- 第1の面と、その反対側の第2の面と、発光層とを有する半導体層と、
前記発光層を含む領域における前記第2の面に設けられたp側電極と、
前記発光層を含まない領域における前記第2の面に設けられたn側電極と、
前記第p側電極及び前記n側電極を覆う第1の絶縁膜と、
前記第1の絶縁膜上に設けられ、前記第1の絶縁膜を貫通する第1のビアを通じて前記p側電極と電気的に接続されたp側配線部と、
前記第1の絶縁膜上に設けられ、前記第1の絶縁膜を貫通する第2のビアを通じて前記n側電極と電気的に接続されたn側配線部と、
前記p側配線部と前記n側配線部との間、および前記半導体層の側面の外側に設けられ、前記発光層の光に対して遮光性をもつ第2の絶縁膜と、
前記第1の面上、および前記半導体層の前記側面の外側に設けられた前記第2の絶縁膜の上に設けられた蛍光体層と、
を備え、
前記蛍光体層は、上面と、前記上面と鈍角の角を形成して、前記第1の面に対して傾斜し、前記第2の絶縁膜の側面よりも内側に形成された斜面とを有し、
前記斜面の直下の前記蛍光体層の厚さは、前記上面の直下の前記蛍光体層の厚さよりも薄い半導体発光装置。 - 前記蛍光体層は、前記第1の面に対する傾斜角度が異なる複数の前記斜面を有する請求項1記載の半導体発光装置。
- 前記半導体層のエッジが、前記蛍光体層のエッジよりも内側にある請求項1または2に記載の半導体発光装置。
- 前記斜面は、前記上面の周囲のすべてにわたって設けられている請求項1〜3のいずれか1つに記載の半導体発光装置。
- 前記第1の絶縁膜は、前記半導体層の前記第1の面から続く側面を覆っている請求項1〜4のいずれか1つに記載の半導体発光装置。
- 前記p側配線部は、
前記第1の絶縁膜上に設けられたp側配線層と、
前記p側配線層上に設けられ、前記p側配線層よりも厚いp側金属ピラーと、
を有し、
前記n側配線部は、
前記第1の絶縁膜上に設けられたn側配線層と、
前記n側配線層上に設けられ、前記n側配線層よりも厚いn側金属ピラーと、
を有する請求項1〜5のいずれか1つに記載の半導体発光装置。 - 実装面と、前記実装面に設けられたパッドとを有する実装基板と、
前記p側配線部及び前記n側配線部を前記パッドに接続させて前記実装基板上に実装された請求項1〜6のいずれかに記載の複数の半導体発光装置と、
を備えた発光モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012120547A JP5837456B2 (ja) | 2012-05-28 | 2012-05-28 | 半導体発光装置及び発光モジュール |
EP12182345.4A EP2669964A3 (en) | 2012-05-28 | 2012-08-30 | Semiconductor light emitting device and light emitting module |
US13/601,336 US8648375B2 (en) | 2012-05-28 | 2012-08-31 | Semiconductor light emitting device and light emitting module |
TW101147165A TWI493758B (zh) | 2012-05-28 | 2012-12-13 | 半導體發光裝置及發光模組 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012120547A JP5837456B2 (ja) | 2012-05-28 | 2012-05-28 | 半導体発光装置及び発光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013247269A JP2013247269A (ja) | 2013-12-09 |
JP5837456B2 true JP5837456B2 (ja) | 2015-12-24 |
Family
ID=47018755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012120547A Active JP5837456B2 (ja) | 2012-05-28 | 2012-05-28 | 半導体発光装置及び発光モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US8648375B2 (ja) |
EP (1) | EP2669964A3 (ja) |
JP (1) | JP5837456B2 (ja) |
TW (1) | TWI493758B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10825964B2 (en) | 2017-11-17 | 2020-11-03 | Stanley Electric Co., Ltd. | Semiconductor light emitting device and light transmitting member |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102231580B1 (ko) * | 2014-02-14 | 2021-03-24 | 엘지이노텍 주식회사 | 광변환기판 및 이를 포함하는 발광패키지, 차량용 램프 |
US10205063B2 (en) * | 2014-12-08 | 2019-02-12 | Lumileds Llc | Wavelength converted semiconductor light emitting device |
JP6734654B2 (ja) * | 2016-01-21 | 2020-08-05 | 浜松ホトニクス株式会社 | 受光モジュール及び受光モジュールの製造方法 |
KR102534245B1 (ko) * | 2016-05-04 | 2023-05-18 | 삼성전자주식회사 | 칩 스케일 렌즈를 포함한 발광장치 |
JP2019140305A (ja) * | 2018-02-14 | 2019-08-22 | スタンレー電気株式会社 | 発光装置 |
JP7257247B2 (ja) * | 2019-05-16 | 2023-04-13 | スタンレー電気株式会社 | 発光装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080164482A1 (en) * | 2004-04-28 | 2008-07-10 | Kunihiko Obara | Light-Emitting Device and Method for Manufacturing Same |
JP4667803B2 (ja) * | 2004-09-14 | 2011-04-13 | 日亜化学工業株式会社 | 発光装置 |
US7955875B2 (en) * | 2008-09-26 | 2011-06-07 | Cree, Inc. | Forming light emitting devices including custom wavelength conversion structures |
WO2010061592A1 (ja) * | 2008-11-28 | 2010-06-03 | 株式会社小糸製作所 | 発光モジュール、発光モジュールの製造方法、および灯具ユニット |
JP4724222B2 (ja) * | 2008-12-12 | 2011-07-13 | 株式会社東芝 | 発光装置の製造方法 |
JP5482378B2 (ja) * | 2009-04-20 | 2014-05-07 | 日亜化学工業株式会社 | 発光装置 |
EP2435212A1 (en) * | 2009-05-28 | 2012-04-04 | Koninklijke Philips Electronics N.V. | Barrel grinding of lumiramic platelets |
TW201044639A (en) * | 2009-06-04 | 2010-12-16 | Provision Business & Technology Consulting Services Inc | Method for manufacturing light-emitting module |
US20110012147A1 (en) * | 2009-07-15 | 2011-01-20 | Koninklijke Philips Electronics N.V. | Wavelength-converted semiconductor light emitting device including a filter and a scattering structure |
JP5379615B2 (ja) * | 2009-09-09 | 2013-12-25 | パナソニック株式会社 | 照明装置 |
JP5349260B2 (ja) | 2009-11-19 | 2013-11-20 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
EP2333854B1 (en) * | 2009-12-09 | 2018-02-07 | Samsung Electronics Co., Ltd. | Light emitting diode |
JP5390472B2 (ja) * | 2010-06-03 | 2014-01-15 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
KR20120024104A (ko) * | 2010-09-06 | 2012-03-14 | 서울옵토디바이스주식회사 | 발광 소자 |
JP5647028B2 (ja) * | 2011-02-14 | 2014-12-24 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
-
2012
- 2012-05-28 JP JP2012120547A patent/JP5837456B2/ja active Active
- 2012-08-30 EP EP12182345.4A patent/EP2669964A3/en not_active Withdrawn
- 2012-08-31 US US13/601,336 patent/US8648375B2/en not_active Expired - Fee Related
- 2012-12-13 TW TW101147165A patent/TWI493758B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10825964B2 (en) | 2017-11-17 | 2020-11-03 | Stanley Electric Co., Ltd. | Semiconductor light emitting device and light transmitting member |
Also Published As
Publication number | Publication date |
---|---|
EP2669964A3 (en) | 2015-10-28 |
US20130313581A1 (en) | 2013-11-28 |
TWI493758B (zh) | 2015-07-21 |
JP2013247269A (ja) | 2013-12-09 |
EP2669964A2 (en) | 2013-12-04 |
TW201349571A (zh) | 2013-12-01 |
US8648375B2 (en) | 2014-02-11 |
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