JP2015187267A5 - - Google Patents

Info

Publication number

JP2015187267A5

JP2015187267A5 JP2015062237A JP2015062237A JP2015187267A5 JP 2015187267 A5 JP2015187267 A5 JP 2015187267A5 JP 2015062237 A JP2015062237 A JP 2015062237A JP 2015062237 A JP2015062237 A JP 2015062237A JP 2015187267 A5 JP2015187267 A5 JP 2015187267A5

Authority

JP

Japan

Prior art keywords

glass

circuit breaker

weight

range

components

Prior art date

2015-03-25

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
• Global Dossier
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• 239000011521 glass Substances 0.000 claims 18
• 239000000203 mixture Substances 0.000 claims 13
• 239000000843 powder Substances 0.000 claims 7
• ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims 5
• 229920002292 Nylon 6 Polymers 0.000 claims 4
• 229920002302 Nylon 6,6 Polymers 0.000 claims 4
• 238000007561 laser diffraction method Methods 0.000 claims 4
• 239000000835 fiber Substances 0.000 claims 3
• 239000006096 absorbing agent Substances 0.000 claims 2
• ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical group O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims 2
• 239000004615 ingredient Substances 0.000 claims 2
• 238000004519 manufacturing process Methods 0.000 claims 2
• RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 1
• RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical group C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 claims 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 claims 1
• 239000005750 Copper hydroxide Substances 0.000 claims 1
• 239000000654 additive Substances 0.000 claims 1
• 230000000996 additive effect Effects 0.000 claims 1
• JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims 1
• 229910002113 barium titanate Inorganic materials 0.000 claims 1
• 229910052797 bismuth Inorganic materials 0.000 claims 1
• JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
• 238000000071 blow moulding Methods 0.000 claims 1
• 239000005388 borosilicate glass Substances 0.000 claims 1
• 229910052802 copper Inorganic materials 0.000 claims 1
• 239000010949 copper Substances 0.000 claims 1
• 229910001956 copper hydroxide Inorganic materials 0.000 claims 1
• CFJKTARZYCRBBI-UHFFFAOYSA-K copper potassium [hydroxy(oxido)phosphoryl] phosphate Chemical compound [O-]P([O-])(=O)OP(=O)([O-])O.[Cu+2].[K+] CFJKTARZYCRBBI-UHFFFAOYSA-K 0.000 claims 1
• GQDHEYWVLBJKBA-UHFFFAOYSA-H copper(ii) phosphate Chemical compound [Cu+2].[Cu+2].[Cu+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GQDHEYWVLBJKBA-UHFFFAOYSA-H 0.000 claims 1
• 238000001125 extrusion Methods 0.000 claims 1
• 239000000945 filler Substances 0.000 claims 1
• 239000003063 flame retardant Substances 0.000 claims 1
• 239000003365 glass fiber Substances 0.000 claims 1
• 238000001746 injection moulding Methods 0.000 claims 1
• 239000000314 lubricant Substances 0.000 claims 1
• 239000006082 mold release agent Substances 0.000 claims 1
• TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
• 238000004513 sizing Methods 0.000 claims 1
• 239000005361 soda-lime glass Substances 0.000 claims 1
• SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 claims 1
• XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
• 229910001887 tin oxide Inorganic materials 0.000 claims 1
• QUBMWJKTLKIJNN-UHFFFAOYSA-B tin(4+);tetraphosphate Chemical compound [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QUBMWJKTLKIJNN-UHFFFAOYSA-B 0.000 claims 1