JP2015181142A5 - - Google Patents

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Publication number
JP2015181142A5
JP2015181142A5 JP2014105652A JP2014105652A JP2015181142A5 JP 2015181142 A5 JP2015181142 A5 JP 2015181142A5 JP 2014105652 A JP2014105652 A JP 2014105652A JP 2014105652 A JP2014105652 A JP 2014105652A JP 2015181142 A5 JP2015181142 A5 JP 2015181142A5
Authority
JP
Japan
Prior art keywords
insulating layer
pad
outermost surface
wiring board
silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014105652A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015181142A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014105652A priority Critical patent/JP2015181142A/ja
Priority claimed from JP2014105652A external-priority patent/JP2015181142A/ja
Priority to US14/627,099 priority patent/US9538668B2/en
Publication of JP2015181142A publication Critical patent/JP2015181142A/ja
Publication of JP2015181142A5 publication Critical patent/JP2015181142A5/ja
Pending legal-status Critical Current

Links

JP2014105652A 2014-03-03 2014-05-21 配線基板及びその製造方法、絶縁層の表面改質方法 Pending JP2015181142A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014105652A JP2015181142A (ja) 2014-03-03 2014-05-21 配線基板及びその製造方法、絶縁層の表面改質方法
US14/627,099 US9538668B2 (en) 2014-03-03 2015-02-20 Wiring substrate, method for manufacturing wiring substrate, and method for modifying surface of insulating layer

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014040864 2014-03-03
JP2014040864 2014-03-03
JP2014105652A JP2015181142A (ja) 2014-03-03 2014-05-21 配線基板及びその製造方法、絶縁層の表面改質方法

Publications (2)

Publication Number Publication Date
JP2015181142A JP2015181142A (ja) 2015-10-15
JP2015181142A5 true JP2015181142A5 (enExample) 2017-03-02

Family

ID=54007412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014105652A Pending JP2015181142A (ja) 2014-03-03 2014-05-21 配線基板及びその製造方法、絶縁層の表面改質方法

Country Status (2)

Country Link
US (1) US9538668B2 (enExample)
JP (1) JP2015181142A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6086055B2 (ja) * 2013-11-26 2017-03-01 トヨタ自動車株式会社 半導体装置
JP6259695B2 (ja) * 2014-03-24 2018-01-10 芝浦メカトロニクス株式会社 基板処理装置、基板処理方法及び基板を製造する方法
US9978674B2 (en) * 2016-04-05 2018-05-22 Samsung Electronics Co., Ltd. Chip-on-film semiconductor packages and display apparatus including the same
US10403591B2 (en) * 2017-10-31 2019-09-03 Xilinx, Inc. Chip package assembly with enhanced interconnects and method for fabricating the same
US20190275600A1 (en) * 2018-03-07 2019-09-12 Powertech Technology Inc. Flux transfer tool and flux transfer method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06152109A (ja) * 1992-11-02 1994-05-31 Matsushita Electric Ind Co Ltd プリント基板およびその製造方法
JP2004022713A (ja) * 2002-06-14 2004-01-22 Dainippon Printing Co Ltd 多層配線基板
JP2007012787A (ja) * 2005-06-29 2007-01-18 Mitsubishi Chemicals Corp パターン形成方法、電子部材および光学部材
US8074350B2 (en) * 2007-12-11 2011-12-13 Palo Also Research Center Incorporated Method of printing electronic circuits
JP2009277838A (ja) 2008-05-14 2009-11-26 Fujitsu Microelectronics Ltd 半導体装置の製造方法、基板トレイ、及び基板収納装置
JP2011053421A (ja) * 2009-09-01 2011-03-17 Taiyo Holdings Co Ltd 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
KR101109230B1 (ko) * 2009-10-20 2012-01-30 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5230578B2 (ja) * 2009-10-28 2013-07-10 京セラ株式会社 電子部品搭載用基板
JP2011199179A (ja) 2010-03-23 2011-10-06 Ngk Spark Plug Co Ltd はんだバンプを有する配線基板の製造方法
US9502730B2 (en) * 2011-11-30 2016-11-22 The Regents Of The University Of California Printed biofuel cells
TWI492111B (zh) * 2012-10-02 2015-07-11 傑聖科技股份有限公司 觸控面板及其製造方法
JP5886503B2 (ja) * 2013-01-11 2016-03-16 太陽誘電株式会社 積層セラミックコンデンサ

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