JP2015144258A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2015144258A JP2015144258A JP2014256896A JP2014256896A JP2015144258A JP 2015144258 A JP2015144258 A JP 2015144258A JP 2014256896 A JP2014256896 A JP 2014256896A JP 2014256896 A JP2014256896 A JP 2014256896A JP 2015144258 A JP2015144258 A JP 2015144258A
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- Prior art keywords
- film
- transistor
- layer
- oxide
- aluminum oxide
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
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Abstract
【解決手段】基板100と、基板上のボロンを含む第1の酸化アルミニウム膜102と、第1の酸化アルミニウム膜上の酸素過剰絶縁層103と、酸素過剰絶縁層に接触する酸化物半導体膜122と、酸化物半導体膜上のゲート絶縁膜112と、ゲート絶縁膜上のゲート電極114と、ゲート絶縁膜及びゲート電極を覆う層間絶縁膜124と、層間絶縁膜に設けられたコンタクトホール130を介して、酸化物半導体膜と接続された配線116と、配線を覆うボロンを含む第2の酸化アルミニウム膜117を有する。ボロンを含む酸化アルミニウム膜が酸化物半導体膜への水素の拡散を防止する。
【選択図】図1
Description
本実施の形態では、トップゲート構造のトランジスタを構成した一つの例を説明する。
本実施の形態では、ボトムゲート構造のトランジスタを構成した一つの例を説明する。
本実施の形態では、ボトムゲート構造のトランジスタを構成した一つの例を説明する。
図4(A)は、本発明の一態様の半導体装置の回路図の一例である。図4(A)に示す半導体装置は、第1のトランジスタ410と、第2のトランジスタ400と、容量430と、配線SLと、配線BLと、配線WLと、配線CLと、配線BGとを有する。
第1のトランジスタ410は、半導体基板411上に設けられ、半導体基板411の一部からなる半導体層412、ゲート絶縁層414、ゲート電極415、及びソース領域またはドレイン領域として機能する低抵抗層413a及び低抵抗層413bを有する。
第1のトランジスタ410を覆って、絶縁層421、絶縁層422、及び絶縁層423が順に積層して設けられている。
絶縁層423の上部には、配線431、配線432、配線433及び配線434等が設けられている。
バリア層420は、絶縁層424、配線431、配線432、配線433及び配線434等の上面を覆って設けられている。
バリア層420上に、配線441、配線442等が設けられている。
絶縁層425の上部には、第2のトランジスタ400が設けられている。
本実施の形態では、トップゲート構造のトランジスタを構成した一つの例を説明する。
本発明の一態様に係る電気特性の安定したトランジスタを利用して様々な半導体装置、例えば液晶パネル、液晶モジュール、液晶表示装置、ELパネル、ELモジュール、EL表示装置、電子インクまたは電気泳動素子を用いた表示装置、LSI、メモリ、RFタグ、CPU、電子機器等に応用することが可能である。
以下では、上述したトランジスタ、または記憶装置を含むRFタグについて、図8を用いて説明する。
以下では、本発明の一態様に係るRFタグの使用例について図9を用いて説明する。RFタグの用途は広範にわたるが、例えば、紙幣、硬貨、有価証券類、無記名債券類、証書類(運転免許証や住民票等、図9(A)参照。)、包装用容器類(包装紙やボトル等、図9(C)参照。)、記録媒体(DVDやビデオテープ等、図9(B)参照。)、乗り物類(自転車等、図9(D)参照。)、身の回り品(鞄や眼鏡等)、食品類、植物類、動物類、人体、衣類、生活用品類、薬品や薬剤を含む医療品、または電子機器(液晶表示装置、EL表示装置、テレビジョン装置、または携帯電話)等の物品、もしくは各物品に取り付ける荷札(図9(E)および図9(F)参照。)等に設けて使用することができる。
以下では、上述したトランジスタや上述した記憶装置などの半導体装置を含むCPUについて説明する。
以下では、本発明の一態様に係る表示装置の構成例について説明する。
図12(A)には、本発明の一態様に係る表示装置の上面図を示す。また、図12(B)には、本発明の一態様に係る表示装置の画素に液晶素子を用いた場合における画素回路を示す。また、図12(C)には、本発明の一態様に係る表示装置の画素に有機EL素子を用いた場合における画素回路を示す。
また、画素の回路構成の一例を図12(B)に示す。ここでは、VA型液晶表示装置の画素などに適用することができる画素回路を示す。
画素の回路構成の他の一例を図12(C)に示す。ここでは、有機EL素子を用いた表示装置の画素構造を示す。
以下では、本発明の一態様に係る半導体装置を適用した表示モジュールについて、図13を用いて説明を行う。
本発明の一態様に係る半導体装置は、表示機器、パーソナルコンピュータ、記録媒体を備えた画像再生装置(代表的にはDVD:Digital Versatile Disc等の記録媒体を再生し、その画像を表示しうるディスプレイを有する装置)に用いることができる。その他に、本発明の一態様に係る半導体装置を用いることができる電子機器として、携帯電話、携帯型を含むゲーム機、携帯データ端末、電子書籍端末、ビデオカメラ、デジタルスチルカメラ等のカメラ、ゴーグル型ディスプレイ(ヘッドマウントディスプレイ)、ナビゲーションシステム、音響再生装置(カーオーディオ、デジタルオーディオプレイヤー等)、複写機、ファクシミリ、プリンタ、プリンタ複合機、現金自動預け入れ払い機(ATM)、自動販売機などが挙げられる。これら電子機器の具体例を図14に示す。
102 酸化アルミニウム膜
103 酸素過剰絶縁層
104 絶縁膜
112 ゲート絶縁膜
113 絶縁膜
114 ゲート電極
116 配線
117 酸化アルミニウム膜
122 酸化物半導体膜
123a 第1の酸化物半導体膜
123b 第2の酸化物半導体膜
124 層間絶縁膜
130 コンタクトホール
400 トランジスタ
401a 酸化物層
401b 酸化物層
402 半導体層
403a 電極
403b 電極
404 ゲート絶縁層
405 ゲート電極
407 絶縁層
408 絶縁層
410 トランジスタ
411 半導体基板
412 半導体層
413a 低抵抗層
413b 低抵抗層
414 ゲート絶縁層
415 ゲート電極
420 バリア層
421 絶縁層
422 絶縁層
423 絶縁層
424 絶縁層
425 絶縁層
426 絶縁層
430 容量
431 配線
432 配線
433 配線
434 配線
441 配線
442 配線
461 プラグ
462 プラグ
800 RFタグ
801 通信器
802 アンテナ
803 無線信号
804 アンテナ
805 整流回路
806 定電圧回路
807 復調回路
808 変調回路
809 論理回路
810 記憶回路
811 ROM
901 筐体
902 筐体
903 表示部
904 表示部
905 マイクロフォン
906 スピーカー
907 操作キー
908 スタイラス
911 筐体
912 筐体
913 表示部
914 表示部
915 接続部
916 操作キー
921 筐体
922 表示部
923 キーボード
924 ポインティングデバイス
931 筐体
932 冷蔵室用扉
933 冷凍室用扉
941 筐体
942 筐体
943 表示部
944 操作キー
945 レンズ
946 接続部
951 車体
952 車輪
953 ダッシュボード
954 ライト
1189 ROMインターフェース
1190 基板
1191 ALU
1192 ALUコントローラ
1193 インストラクションデコーダ
1194 インタラプトコントローラ
1195 タイミングコントローラ
1196 レジスタ
1197 レジスタコントローラ
1198 バスインターフェース
1199 ROM
1200 記憶素子
1201 回路
1202 回路
1203 スイッチ
1204 スイッチ
1206 論理素子
1207 容量素子
1208 容量素子
1209 トランジスタ
1210 トランジスタ
1213 トランジスタ
1214 トランジスタ
1220 回路
4000 RFタグ
5000 基板
5001 画素部
5002 走査線駆動回路
5003 走査線駆動回路
5004 信号線駆動回路
5010 容量配線
5012 ゲート配線
5013 ゲート配線
5014 ドレイン電極
5016 トランジスタ
5017 トランジスタ
5018 液晶素子
5019 液晶素子
5020 画素
5021 スイッチング用トランジスタ
5022 駆動用トランジスタ
5023 容量素子
5024 発光素子
5025 信号線
5026 走査線
5027 電源線
5028 共通電極
8000 表示モジュール
8001 上部カバー
8002 下部カバー
8003 FPC
8004 タッチパネル
8005 FPC
8006 表示パネル
8007 バックライトユニット
8008 光源
8009 フレーム
8010 プリント基板
8011 バッテリー
Claims (5)
- ボロンを含む第1の酸化アルミニウム膜と、
前記ボロンを含む第1の酸化アルミニウム膜上の酸化物半導体膜と、
前記酸化物半導体膜上のボロンを含む第2の酸化アルミニウム膜と、を有することを特徴とする半導体装置。 - 請求項1において、前記酸化物半導体膜は前記ボロンを含む第1の酸化アルミニウム膜および前記ボロンを含む第2の酸化アルミニウム膜に接することを特徴とする半導体装置。
- 請求項1又は2において、前記酸化物半導体膜に接する酸素過剰絶縁層を有することを特徴とする半導体装置。
- 請求項1乃至3のいずれか一において、前記ボロンを含む第1、第2の酸化アルミニウム膜のうち少なくとも一つは、膜厚が30nm以上50nm以下である領域を有することを特徴とする半導体装置。
- 請求項1乃至4のいずれか一おいて、前記ボロンを含む第1、第2の酸化アルミニウム膜のうち少なくとも一つは、ボロンの最大濃度が5.0×1020 atoms/cm3以上、1.0×1022atoms/cm3以下であることを特徴とする半導体装置。
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