JP2015116656A5 - - Google Patents

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Publication number
JP2015116656A5
JP2015116656A5 JP2014093840A JP2014093840A JP2015116656A5 JP 2015116656 A5 JP2015116656 A5 JP 2015116656A5 JP 2014093840 A JP2014093840 A JP 2014093840A JP 2014093840 A JP2014093840 A JP 2014093840A JP 2015116656 A5 JP2015116656 A5 JP 2015116656A5
Authority
JP
Japan
Prior art keywords
pad
pressing portion
polishing
width
retainer ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014093840A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015116656A (ja
JP6403981B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014093840A external-priority patent/JP6403981B2/ja
Priority to JP2014093840A priority Critical patent/JP6403981B2/ja
Priority to SG10201407353UA priority patent/SG10201407353UA/en
Priority to US14/537,809 priority patent/US9815171B2/en
Priority to KR1020140155293A priority patent/KR20150055566A/ko
Priority to TW103138997A priority patent/TWI614091B/zh
Priority to CN201410640498.8A priority patent/CN104625948B/zh
Publication of JP2015116656A publication Critical patent/JP2015116656A/ja
Publication of JP2015116656A5 publication Critical patent/JP2015116656A5/ja
Priority to KR1020180104398A priority patent/KR102208160B1/ko
Publication of JP6403981B2 publication Critical patent/JP6403981B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014093840A 2013-11-13 2014-04-30 基板保持装置、研磨装置、研磨方法、およびリテーナリング Active JP6403981B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014093840A JP6403981B2 (ja) 2013-11-13 2014-04-30 基板保持装置、研磨装置、研磨方法、およびリテーナリング
SG10201407353UA SG10201407353UA (en) 2013-11-13 2014-11-07 Substrate holder, polishing apparatus, polishing method, and retaining ring
US14/537,809 US9815171B2 (en) 2013-11-13 2014-11-10 Substrate holder, polishing apparatus, polishing method, and retaining ring
KR1020140155293A KR20150055566A (ko) 2013-11-13 2014-11-10 기판 보유 지지 장치, 연마 장치, 연마 방법 및 리테이너 링
TW103138997A TWI614091B (zh) 2013-11-13 2014-11-11 基板保持裝置、研磨裝置、研磨方法、及扣環
CN201410640498.8A CN104625948B (zh) 2013-11-13 2014-11-13 基板保持装置、研磨装置、研磨方法及保持环
KR1020180104398A KR102208160B1 (ko) 2013-11-13 2018-09-03 기판 보유 지지 장치, 연마 장치, 연마 방법 및 리테이너 링

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013235210 2013-11-13
JP2013235210 2013-11-13
JP2014093840A JP6403981B2 (ja) 2013-11-13 2014-04-30 基板保持装置、研磨装置、研磨方法、およびリテーナリング

Publications (3)

Publication Number Publication Date
JP2015116656A JP2015116656A (ja) 2015-06-25
JP2015116656A5 true JP2015116656A5 (enExample) 2017-12-14
JP6403981B2 JP6403981B2 (ja) 2018-10-10

Family

ID=53044185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014093840A Active JP6403981B2 (ja) 2013-11-13 2014-04-30 基板保持装置、研磨装置、研磨方法、およびリテーナリング

Country Status (6)

Country Link
US (1) US9815171B2 (enExample)
JP (1) JP6403981B2 (enExample)
KR (2) KR20150055566A (enExample)
CN (1) CN104625948B (enExample)
SG (1) SG10201407353UA (enExample)
TW (1) TWI614091B (enExample)

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US10293454B2 (en) * 2015-06-11 2019-05-21 Toshiba Memory Corporation Polishing head, polishing apparatus and polishing method
TWD179095S (zh) 2015-08-25 2016-10-21 荏原製作所股份有限公司 基板保持環
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
US10322492B2 (en) 2016-07-25 2019-06-18 Applied Materials, Inc. Retaining ring for CMP
KR102872854B1 (ko) 2018-03-13 2025-10-16 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리셔의 소모성 부품 모니터링
TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
JP7287761B2 (ja) 2018-07-31 2023-06-06 株式会社荏原製作所 球面軸受の軸受半径決定方法
JP6446590B1 (ja) * 2018-08-09 2018-12-26 国立大学法人 東京大学 局所研磨加工方法、および局所研磨加工装置、並びに該局所研磨加工装置を用いた修正研磨加工装置
KR102725357B1 (ko) * 2020-10-20 2024-11-06 주식회사 케이씨텍 리테이너링 및 이를 포함하는 기판 연마 장치
JP6927617B1 (ja) * 2020-11-19 2021-09-01 不二越機械工業株式会社 ワーク研磨装置およびトップリング用樹脂マット体
TWI826051B (zh) * 2022-10-19 2023-12-11 力晶積成電子製造股份有限公司 化學機械研磨裝置及研磨方法

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US5885135A (en) * 1997-04-23 1999-03-23 International Business Machines Corporation CMP wafer carrier for preferential polishing of a wafer
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JP2000233363A (ja) * 1999-02-16 2000-08-29 Ebara Corp ポリッシング装置及び方法
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