JP2016529733A5 - - Google Patents

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Publication number
JP2016529733A5
JP2016529733A5 JP2016538940A JP2016538940A JP2016529733A5 JP 2016529733 A5 JP2016529733 A5 JP 2016529733A5 JP 2016538940 A JP2016538940 A JP 2016538940A JP 2016538940 A JP2016538940 A JP 2016538940A JP 2016529733 A5 JP2016529733 A5 JP 2016529733A5
Authority
JP
Japan
Prior art keywords
processing chamber
substrate
end support
pedestal
support member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016538940A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016529733A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2014/050227 external-priority patent/WO2015031023A1/en
Publication of JP2016529733A publication Critical patent/JP2016529733A/ja
Publication of JP2016529733A5 publication Critical patent/JP2016529733A5/ja
Pending legal-status Critical Current

Links

JP2016538940A 2013-08-30 2014-08-07 基板支持システム Pending JP2016529733A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361872545P 2013-08-30 2013-08-30
US61/872,545 2013-08-30
PCT/US2014/050227 WO2015031023A1 (en) 2013-08-30 2014-08-07 Substrate support system

Publications (2)

Publication Number Publication Date
JP2016529733A JP2016529733A (ja) 2016-09-23
JP2016529733A5 true JP2016529733A5 (enExample) 2017-09-14

Family

ID=52583785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016538940A Pending JP2016529733A (ja) 2013-08-30 2014-08-07 基板支持システム

Country Status (6)

Country Link
US (1) US20150064809A1 (enExample)
JP (1) JP2016529733A (enExample)
KR (1) KR20160047540A (enExample)
CN (1) CN105493262B (enExample)
TW (1) TWI673821B (enExample)
WO (1) WO2015031023A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US9741593B2 (en) 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
US10770309B2 (en) * 2015-12-30 2020-09-08 Mattson Technology, Inc. Features for improving process uniformity in a millisecond anneal system
KR102689380B1 (ko) 2016-01-26 2024-07-26 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 에지 링 리프팅 솔루션
JP6888007B2 (ja) 2016-01-26 2021-06-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ウェハエッジリングの持ち上げに関する解決
US9947517B1 (en) 2016-12-16 2018-04-17 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
US10553404B2 (en) 2017-02-01 2020-02-04 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
US10571069B2 (en) * 2017-09-14 2020-02-25 Applied Materials, Inc. Gimbal assembly for heater pedestal
US11075105B2 (en) 2017-09-21 2021-07-27 Applied Materials, Inc. In-situ apparatus for semiconductor process module
US11043400B2 (en) 2017-12-21 2021-06-22 Applied Materials, Inc. Movable and removable process kit
JP6971865B2 (ja) 2018-01-17 2021-11-24 キオクシア株式会社 処理装置
JP6770988B2 (ja) * 2018-03-14 2020-10-21 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置および半導体装置の製造方法
US10790123B2 (en) 2018-05-28 2020-09-29 Applied Materials, Inc. Process kit with adjustable tuning ring for edge uniformity control
US11935773B2 (en) 2018-06-14 2024-03-19 Applied Materials, Inc. Calibration jig and calibration method
US11289310B2 (en) 2018-11-21 2022-03-29 Applied Materials, Inc. Circuits for edge ring control in shaped DC pulsed plasma process device
WO2020214327A1 (en) 2019-04-19 2020-10-22 Applied Materials, Inc. Ring removal from processing chamber
US12009236B2 (en) 2019-04-22 2024-06-11 Applied Materials, Inc. Sensors and system for in-situ edge ring erosion monitor
CN112542370B (zh) * 2019-09-23 2024-04-05 中微半导体设备(上海)股份有限公司 一种等离子体处理器及其加热器组件
US11204312B2 (en) * 2020-03-13 2021-12-21 Applied Materials, Inc. In-situ full wafer metrology system
US12100579B2 (en) * 2020-11-18 2024-09-24 Applied Materials, Inc. Deposition ring for thin substrate handling via edge clamping
CN116982144A (zh) * 2021-04-02 2023-10-31 应用材料公司 用于场引导曝光后烘烤处理的处理单元

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5982986A (en) * 1995-02-03 1999-11-09 Applied Materials, Inc. Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
US6217663B1 (en) * 1996-06-21 2001-04-17 Kokusai Electric Co., Ltd. Substrate processing apparatus and substrate processing method
US6068441A (en) * 1997-11-21 2000-05-30 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
JP2000286328A (ja) * 1999-03-31 2000-10-13 Tokyo Electron Ltd ガス処理装置
JP2002050809A (ja) * 2000-08-01 2002-02-15 Anelva Corp 基板処理装置及び方法
JP4514942B2 (ja) * 2000-12-07 2010-07-28 株式会社アルバック 成膜装置
JP4061044B2 (ja) * 2001-10-05 2008-03-12 住友重機械工業株式会社 基板移動装置
US6776849B2 (en) * 2002-03-15 2004-08-17 Asm America, Inc. Wafer holder with peripheral lift ring
US7128806B2 (en) * 2003-10-21 2006-10-31 Applied Materials, Inc. Mask etch processing apparatus
US7198677B2 (en) * 2005-03-09 2007-04-03 Wafermasters, Inc. Low temperature wafer backside cleaning
ITTO20060131A1 (it) * 2006-02-24 2007-08-25 Fiat Auto Spa Dispositivo di controllo della movimentazione di una valvola in particolare di una valvola di aspirazione di un motore a combustione interna
JP2007242858A (ja) * 2006-03-08 2007-09-20 Wafermasters Inc ウエハ処理システム及び処理方法
JP4949091B2 (ja) * 2007-03-16 2012-06-06 東京エレクトロン株式会社 基板処理装置、基板処理方法および記録媒体
JP5283370B2 (ja) * 2007-11-29 2013-09-04 株式会社ニューフレアテクノロジー 気相成長装置および気相成長方法
US20100248397A1 (en) * 2009-03-26 2010-09-30 Tokyo Electron Limited High temperature susceptor having improved processing uniformity
JP5341706B2 (ja) * 2009-10-16 2013-11-13 株式会社ニューフレアテクノロジー 半導体製造装置および半導体製造方法
JP5504980B2 (ja) * 2010-03-04 2014-05-28 日新イオン機器株式会社 ウエハリフト回転機構、ステージ装置及びイオン注入装置
JP5527166B2 (ja) * 2010-11-05 2014-06-18 住友電気工業株式会社 加熱装置および気相成長装置
WO2012134663A2 (en) * 2011-03-16 2012-10-04 Applied Materials, Inc Method and apparatus utilizing a single lift mechanism for processing and transfer of substrates
WO2013162972A1 (en) * 2012-04-25 2013-10-31 Applied Materials, Inc. Process chamber having separate process gas and purge gas regions
WO2015138094A1 (en) * 2014-03-12 2015-09-17 Applied Materials, Inc. Wafer rotation in a semiconductor chamber

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