TWI673821B - 基板支撐系統 - Google Patents
基板支撐系統 Download PDFInfo
- Publication number
- TWI673821B TWI673821B TW103129966A TW103129966A TWI673821B TW I673821 B TWI673821 B TW I673821B TW 103129966 A TW103129966 A TW 103129966A TW 103129966 A TW103129966 A TW 103129966A TW I673821 B TWI673821 B TW I673821B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- base
- processing
- support member
- edge support
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 224
- 238000012545 processing Methods 0.000 claims abstract description 93
- 238000000034 method Methods 0.000 claims abstract description 42
- 238000012544 monitoring process Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000009826 distribution Methods 0.000 description 15
- 230000033001 locomotion Effects 0.000 description 15
- 230000008021 deposition Effects 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 210000002381 plasma Anatomy 0.000 description 8
- 238000012546 transfer Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000011066 ex-situ storage Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Robotics (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361872545P | 2013-08-30 | 2013-08-30 | |
| US61/872,545 | 2013-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201523785A TW201523785A (zh) | 2015-06-16 |
| TWI673821B true TWI673821B (zh) | 2019-10-01 |
Family
ID=52583785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103129966A TWI673821B (zh) | 2013-08-30 | 2014-08-29 | 基板支撐系統 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20150064809A1 (enExample) |
| JP (1) | JP2016529733A (enExample) |
| KR (1) | KR20160047540A (enExample) |
| CN (1) | CN105493262B (enExample) |
| TW (1) | TWI673821B (enExample) |
| WO (1) | WO2015031023A1 (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9966240B2 (en) | 2014-10-14 | 2018-05-08 | Applied Materials, Inc. | Systems and methods for internal surface conditioning assessment in plasma processing equipment |
| US9355922B2 (en) | 2014-10-14 | 2016-05-31 | Applied Materials, Inc. | Systems and methods for internal surface conditioning in plasma processing equipment |
| US9741593B2 (en) | 2015-08-06 | 2017-08-22 | Applied Materials, Inc. | Thermal management systems and methods for wafer processing systems |
| US9691645B2 (en) | 2015-08-06 | 2017-06-27 | Applied Materials, Inc. | Bolted wafer chuck thermal management systems and methods for wafer processing systems |
| US10504700B2 (en) | 2015-08-27 | 2019-12-10 | Applied Materials, Inc. | Plasma etching systems and methods with secondary plasma injection |
| US10770309B2 (en) * | 2015-12-30 | 2020-09-08 | Mattson Technology, Inc. | Features for improving process uniformity in a millisecond anneal system |
| KR102689380B1 (ko) | 2016-01-26 | 2024-07-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 에지 링 리프팅 솔루션 |
| JP6888007B2 (ja) | 2016-01-26 | 2021-06-16 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | ウェハエッジリングの持ち上げに関する解決 |
| US9947517B1 (en) | 2016-12-16 | 2018-04-17 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
| US10553404B2 (en) | 2017-02-01 | 2020-02-04 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
| US10571069B2 (en) * | 2017-09-14 | 2020-02-25 | Applied Materials, Inc. | Gimbal assembly for heater pedestal |
| US11075105B2 (en) | 2017-09-21 | 2021-07-27 | Applied Materials, Inc. | In-situ apparatus for semiconductor process module |
| US11043400B2 (en) | 2017-12-21 | 2021-06-22 | Applied Materials, Inc. | Movable and removable process kit |
| JP6971865B2 (ja) | 2018-01-17 | 2021-11-24 | キオクシア株式会社 | 処理装置 |
| JP6770988B2 (ja) * | 2018-03-14 | 2020-10-21 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置および半導体装置の製造方法 |
| US10790123B2 (en) | 2018-05-28 | 2020-09-29 | Applied Materials, Inc. | Process kit with adjustable tuning ring for edge uniformity control |
| US11935773B2 (en) | 2018-06-14 | 2024-03-19 | Applied Materials, Inc. | Calibration jig and calibration method |
| US11289310B2 (en) | 2018-11-21 | 2022-03-29 | Applied Materials, Inc. | Circuits for edge ring control in shaped DC pulsed plasma process device |
| WO2020214327A1 (en) | 2019-04-19 | 2020-10-22 | Applied Materials, Inc. | Ring removal from processing chamber |
| US12009236B2 (en) | 2019-04-22 | 2024-06-11 | Applied Materials, Inc. | Sensors and system for in-situ edge ring erosion monitor |
| CN112542370B (zh) * | 2019-09-23 | 2024-04-05 | 中微半导体设备(上海)股份有限公司 | 一种等离子体处理器及其加热器组件 |
| US11204312B2 (en) * | 2020-03-13 | 2021-12-21 | Applied Materials, Inc. | In-situ full wafer metrology system |
| US12100579B2 (en) * | 2020-11-18 | 2024-09-24 | Applied Materials, Inc. | Deposition ring for thin substrate handling via edge clamping |
| CN116982144A (zh) * | 2021-04-02 | 2023-10-31 | 应用材料公司 | 用于场引导曝光后烘烤处理的处理单元 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982986A (en) * | 1995-02-03 | 1999-11-09 | Applied Materials, Inc. | Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber |
| US6068441A (en) * | 1997-11-21 | 2000-05-30 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
| US20060201623A1 (en) * | 2005-03-09 | 2006-09-14 | Yoo Woo S | Low temperature wafer backside cleaning |
| US20090139448A1 (en) * | 2007-11-29 | 2009-06-04 | Hironobu Hirata | Vapor phase growth apparatus ans vapor phase growth method |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6217663B1 (en) * | 1996-06-21 | 2001-04-17 | Kokusai Electric Co., Ltd. | Substrate processing apparatus and substrate processing method |
| JP2000286328A (ja) * | 1999-03-31 | 2000-10-13 | Tokyo Electron Ltd | ガス処理装置 |
| JP2002050809A (ja) * | 2000-08-01 | 2002-02-15 | Anelva Corp | 基板処理装置及び方法 |
| JP4514942B2 (ja) * | 2000-12-07 | 2010-07-28 | 株式会社アルバック | 成膜装置 |
| JP4061044B2 (ja) * | 2001-10-05 | 2008-03-12 | 住友重機械工業株式会社 | 基板移動装置 |
| US6776849B2 (en) * | 2002-03-15 | 2004-08-17 | Asm America, Inc. | Wafer holder with peripheral lift ring |
| US7128806B2 (en) * | 2003-10-21 | 2006-10-31 | Applied Materials, Inc. | Mask etch processing apparatus |
| ITTO20060131A1 (it) * | 2006-02-24 | 2007-08-25 | Fiat Auto Spa | Dispositivo di controllo della movimentazione di una valvola in particolare di una valvola di aspirazione di un motore a combustione interna |
| JP2007242858A (ja) * | 2006-03-08 | 2007-09-20 | Wafermasters Inc | ウエハ処理システム及び処理方法 |
| JP4949091B2 (ja) * | 2007-03-16 | 2012-06-06 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記録媒体 |
| US20100248397A1 (en) * | 2009-03-26 | 2010-09-30 | Tokyo Electron Limited | High temperature susceptor having improved processing uniformity |
| JP5341706B2 (ja) * | 2009-10-16 | 2013-11-13 | 株式会社ニューフレアテクノロジー | 半導体製造装置および半導体製造方法 |
| JP5504980B2 (ja) * | 2010-03-04 | 2014-05-28 | 日新イオン機器株式会社 | ウエハリフト回転機構、ステージ装置及びイオン注入装置 |
| JP5527166B2 (ja) * | 2010-11-05 | 2014-06-18 | 住友電気工業株式会社 | 加熱装置および気相成長装置 |
| WO2012134663A2 (en) * | 2011-03-16 | 2012-10-04 | Applied Materials, Inc | Method and apparatus utilizing a single lift mechanism for processing and transfer of substrates |
| WO2013162972A1 (en) * | 2012-04-25 | 2013-10-31 | Applied Materials, Inc. | Process chamber having separate process gas and purge gas regions |
| WO2015138094A1 (en) * | 2014-03-12 | 2015-09-17 | Applied Materials, Inc. | Wafer rotation in a semiconductor chamber |
-
2014
- 2014-08-07 JP JP2016538940A patent/JP2016529733A/ja active Pending
- 2014-08-07 WO PCT/US2014/050227 patent/WO2015031023A1/en not_active Ceased
- 2014-08-07 CN CN201480047900.XA patent/CN105493262B/zh not_active Expired - Fee Related
- 2014-08-07 KR KR1020167007843A patent/KR20160047540A/ko not_active Ceased
- 2014-08-08 US US14/455,028 patent/US20150064809A1/en not_active Abandoned
- 2014-08-29 TW TW103129966A patent/TWI673821B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982986A (en) * | 1995-02-03 | 1999-11-09 | Applied Materials, Inc. | Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber |
| US6068441A (en) * | 1997-11-21 | 2000-05-30 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
| US20060201623A1 (en) * | 2005-03-09 | 2006-09-14 | Yoo Woo S | Low temperature wafer backside cleaning |
| US20090139448A1 (en) * | 2007-11-29 | 2009-06-04 | Hironobu Hirata | Vapor phase growth apparatus ans vapor phase growth method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015031023A1 (en) | 2015-03-05 |
| US20150064809A1 (en) | 2015-03-05 |
| KR20160047540A (ko) | 2016-05-02 |
| TW201523785A (zh) | 2015-06-16 |
| CN105493262B (zh) | 2019-02-15 |
| CN105493262A (zh) | 2016-04-13 |
| JP2016529733A (ja) | 2016-09-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |