JP5283370B2 - 気相成長装置および気相成長方法 - Google Patents
気相成長装置および気相成長方法 Download PDFInfo
- Publication number
- JP5283370B2 JP5283370B2 JP2007309271A JP2007309271A JP5283370B2 JP 5283370 B2 JP5283370 B2 JP 5283370B2 JP 2007309271 A JP2007309271 A JP 2007309271A JP 2007309271 A JP2007309271 A JP 2007309271A JP 5283370 B2 JP5283370 B2 JP 5283370B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holder
- vapor phase
- phase growth
- susceptor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/12—Substrate holders or susceptors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4585—Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
2 チャンバ
3 ガス供給管
4 整流板
5 サセプタ
6 回転胴
7 ガス排気管
8 ヒーター
9 ウェーハ突き上げ機構
10 ホルダ
10a ホルダ突出部
11 温度センサ
12 ウェーハ搬送アーム
20 シングルウェーハマルチチャンバ
21 チャンバ
22 チャンバ
23 チャンバ
24 ウェーハ搬送ロボット
W ウェーハ
A ガス供給方向
B ガス排気方向
C 回転胴回転方向
D ウェーハ突き上げ機構の動作方向
E−E ウェーハW設置状態の上面図の矢視方向
Claims (5)
- 周縁部に複数の突出部を有し、ウェーハを収容する円環形状のホルダと、
前記ホルダの円環形状の内周端と当接させる円周状段差を上面に設けた皿型形状のサセプタと、
前記ウェーハを所定の回転速度で回転させる回転駆動機能を有し、前記ホルダを保持する回転胴と、
前記ウェーハを加熱する手段であって、前記回転胴の内部に配置された加熱手段と、
前記回転胴の外側に、前記突出部下面を押し上げるウェーハ突き上げ手段とを備えたことを特徴とする気相成長装置。 - 前記サセプタは、炭素の基材上に炭化珪素(SiC)を被膜したもの、炭化珪素(SiC)基材、もしくはシリコン含浸炭化珪素のうちいずれか1つで形成されることを特徴とする請求項1に記載の気相成長装置。
- 前記ウェーハ突き上げ手段は、前記ホルダの周縁部に設けられた突出部下面を下方から押し上げるピン形状であることを特徴とする請求項1に記載の気相成長装置。
- 前記ホルダは、240度以上の角度に渡る円環形状の周縁部に突出部を設け、炭素の基材上に炭化珪素(SiC)を被膜したもの、炭化珪素(SiC)基材、もしくはシリコン含浸炭化珪素のうちいずれか1つで形成されることを特徴とする請求項1に記載の気相成長装置。
- 周縁部に複数の突出部を有し、ウェーハを収容する円環形状のホルダと、
前記ホルダの円環形状の内周端と当接させる円周状段差を上面に設けた皿型形状のサセプタと、
前記ウェーハを所定の回転速度で回転させる回転駆動機能を有し、前記ホルダを保持する回転胴と、
前記ウェーハを加熱する手段であって、前記回転胴の内部に配置された加熱手段と、
前記回転胴の外側に、前記突出部下面を押し上げるウェーハ突き上げ手段とを備えた気相成長装置を用いて、前記ウェーハ上に気相成長膜を形成する方法であって、
前記ウェーハ突き上げ手段が前記突出部下面を押し上げた際に、前記ウェーハを搬入するウェーハ搬入工程と、
前記サセプタの上面に設けられた円周状段差と、前記ホルダの円環形状の内周端と、を当接させた際に、前記気相成長膜を形成する気相成長工程と、
前記ウェーハ突き上げ手段が前記突出部下面を押し上げた際に、前記ウェーハを搬出するウェーハ搬出工程と、
を備えたことを特徴とする気相成長方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007309271A JP5283370B2 (ja) | 2007-11-29 | 2007-11-29 | 気相成長装置および気相成長方法 |
US12/323,362 US20090139448A1 (en) | 2007-11-29 | 2008-11-25 | Vapor phase growth apparatus ans vapor phase growth method |
TW097145947A TWI401337B (zh) | 2007-11-29 | 2008-11-27 | 氣相成長裝置及氣相成長方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007309271A JP5283370B2 (ja) | 2007-11-29 | 2007-11-29 | 気相成長装置および気相成長方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009135228A JP2009135228A (ja) | 2009-06-18 |
JP5283370B2 true JP5283370B2 (ja) | 2013-09-04 |
Family
ID=40674455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007309271A Expired - Fee Related JP5283370B2 (ja) | 2007-11-29 | 2007-11-29 | 気相成長装置および気相成長方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090139448A1 (ja) |
JP (1) | JP5283370B2 (ja) |
TW (1) | TWI401337B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009087989A (ja) * | 2007-09-27 | 2009-04-23 | Nuflare Technology Inc | エピタキシャル成長膜形成方法 |
JP5038365B2 (ja) * | 2009-07-01 | 2012-10-03 | 株式会社東芝 | サセプタおよび成膜装置 |
DE102010006725B4 (de) * | 2010-02-03 | 2016-03-03 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe aus Silizium mit einer epitaktisch abgeschiedenen Schicht |
JP5615102B2 (ja) * | 2010-08-31 | 2014-10-29 | 株式会社ニューフレアテクノロジー | 半導体製造方法及び半導体製造装置 |
US8802545B2 (en) * | 2011-03-14 | 2014-08-12 | Plasma-Therm Llc | Method and apparatus for plasma dicing a semi-conductor wafer |
CA2839406C (en) * | 2011-06-16 | 2019-10-29 | Zimmer, Inc. | Chemical vapor infiltration apparatus and process |
JP5719720B2 (ja) * | 2011-08-19 | 2015-05-20 | 株式会社ニューフレアテクノロジー | 薄膜処理方法 |
WO2013099063A1 (ja) | 2011-12-27 | 2013-07-04 | キヤノンアネルバ株式会社 | 基板熱処理装置 |
JP2013207196A (ja) * | 2012-03-29 | 2013-10-07 | Nuflare Technology Inc | 成膜装置および成膜方法 |
US9425077B2 (en) | 2013-03-15 | 2016-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor apparatus with transportable edge ring for substrate transport |
JP6109657B2 (ja) * | 2013-07-08 | 2017-04-05 | 株式会社ニューフレアテクノロジー | 気相成長装置および気相成長方法 |
JP2016529733A (ja) * | 2013-08-30 | 2016-09-23 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板支持システム |
US10851458B2 (en) * | 2018-03-27 | 2020-12-01 | Lam Research Corporation | Connector for substrate support with embedded temperature sensors |
US11774306B2 (en) * | 2018-06-26 | 2023-10-03 | Applied Materials, Inc. | System and method for maintenance of rotation-lift assembly |
JP7153582B2 (ja) * | 2019-02-01 | 2022-10-14 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
Family Cites Families (16)
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US5444217A (en) * | 1993-01-21 | 1995-08-22 | Moore Epitaxial Inc. | Rapid thermal processing apparatus for processing semiconductor wafers |
US5982986A (en) * | 1995-02-03 | 1999-11-09 | Applied Materials, Inc. | Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber |
US5639334A (en) * | 1995-03-07 | 1997-06-17 | International Business Machines Corporation | Uniform gas flow arrangements |
DE19622322C2 (de) * | 1995-06-15 | 1999-02-25 | Toshiba Ceramics Co | Vorrichtung zum Züchten aus der Dampfphase |
US6079356A (en) * | 1997-12-02 | 2000-06-27 | Applied Materials, Inc. | Reactor optimized for chemical vapor deposition of titanium |
KR100433465B1 (ko) * | 1998-08-03 | 2004-05-31 | 닛본 덴끼 가부시끼가이샤 | 금속산화물유전체막의 기상성장방법 및 금속산화물유전체재료의 기상성장을 위한 장치 |
JP2001210597A (ja) * | 2000-01-28 | 2001-08-03 | Hitachi Kokusai Electric Inc | 半導体製造装置及び半導体装置の製造方法 |
JP4203206B2 (ja) * | 2000-03-24 | 2008-12-24 | 株式会社日立国際電気 | 基板処理装置 |
US6599815B1 (en) * | 2000-06-30 | 2003-07-29 | Memc Electronic Materials, Inc. | Method and apparatus for forming a silicon wafer with a denuded zone |
JP2002057210A (ja) * | 2001-06-08 | 2002-02-22 | Applied Materials Inc | ウェハ支持装置及び半導体製造装置 |
US7270708B2 (en) * | 2001-11-30 | 2007-09-18 | Shin-Etsu Handotai Co., Ltd. | Susceptor, vapor phase growth apparatus, epitaxial wafer manufacturing apparatus, epitaxial wafer manufacturing method, and epitaxial wafer |
EP1643544A4 (en) * | 2003-06-26 | 2009-07-01 | Shinetsu Handotai Kk | METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER AND EPITAXIAL SILICON WAFER |
US7265036B2 (en) * | 2004-07-23 | 2007-09-04 | Applied Materials, Inc. | Deposition of nano-crystal silicon using a single wafer chamber |
US7432201B2 (en) * | 2005-07-19 | 2008-10-07 | Applied Materials, Inc. | Hybrid PVD-CVD system |
TWI354320B (en) * | 2006-02-21 | 2011-12-11 | Nuflare Technology Inc | Vopor phase deposition apparatus and support table |
JP2007251078A (ja) * | 2006-03-20 | 2007-09-27 | Nuflare Technology Inc | 気相成長装置 |
-
2007
- 2007-11-29 JP JP2007309271A patent/JP5283370B2/ja not_active Expired - Fee Related
-
2008
- 2008-11-25 US US12/323,362 patent/US20090139448A1/en not_active Abandoned
- 2008-11-27 TW TW097145947A patent/TWI401337B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI401337B (zh) | 2013-07-11 |
JP2009135228A (ja) | 2009-06-18 |
TW200936802A (en) | 2009-09-01 |
US20090139448A1 (en) | 2009-06-04 |
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