CN104625948B - 基板保持装置、研磨装置、研磨方法及保持环 - Google Patents

基板保持装置、研磨装置、研磨方法及保持环 Download PDF

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Publication number
CN104625948B
CN104625948B CN201410640498.8A CN201410640498A CN104625948B CN 104625948 B CN104625948 B CN 104625948B CN 201410640498 A CN201410640498 A CN 201410640498A CN 104625948 B CN104625948 B CN 104625948B
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CN
China
Prior art keywords
pad
press section
grinding
retaining ring
width
Prior art date
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Active
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CN201410640498.8A
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English (en)
Chinese (zh)
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CN104625948A (zh
Inventor
山木晓
安田穗积
并木计介
锅谷治
福岛诚
富樫真吾
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Ebara Corp
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Ebara Corp
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Publication date
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Publication of CN104625948A publication Critical patent/CN104625948A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201410640498.8A 2013-11-13 2014-11-13 基板保持装置、研磨装置、研磨方法及保持环 Active CN104625948B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-235210 2013-11-13
JP2013235210 2013-11-13
JP2014-093840 2014-04-30
JP2014093840A JP6403981B2 (ja) 2013-11-13 2014-04-30 基板保持装置、研磨装置、研磨方法、およびリテーナリング

Publications (2)

Publication Number Publication Date
CN104625948A CN104625948A (zh) 2015-05-20
CN104625948B true CN104625948B (zh) 2019-04-09

Family

ID=53044185

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410640498.8A Active CN104625948B (zh) 2013-11-13 2014-11-13 基板保持装置、研磨装置、研磨方法及保持环

Country Status (6)

Country Link
US (1) US9815171B2 (enExample)
JP (1) JP6403981B2 (enExample)
KR (2) KR20150055566A (enExample)
CN (1) CN104625948B (enExample)
SG (1) SG10201407353UA (enExample)
TW (1) TWI614091B (enExample)

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JP2016155188A (ja) * 2015-02-24 2016-09-01 株式会社荏原製作所 リテーナリング、基板保持装置、研磨装置およびリテーナリングのメンテナンス方法
US10293454B2 (en) * 2015-06-11 2019-05-21 Toshiba Memory Corporation Polishing head, polishing apparatus and polishing method
TWD179095S (zh) 2015-08-25 2016-10-21 荏原製作所股份有限公司 基板保持環
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
KR102420066B1 (ko) 2016-07-25 2022-07-11 어플라이드 머티어리얼스, 인코포레이티드 Cmp를 위한 리테이닝 링
KR102872854B1 (ko) 2018-03-13 2025-10-16 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리셔의 소모성 부품 모니터링
TWI639486B (zh) * 2018-05-31 2018-11-01 國立清華大學 全向整合式調節裝置
JP7287761B2 (ja) 2018-07-31 2023-06-06 株式会社荏原製作所 球面軸受の軸受半径決定方法
JP6446590B1 (ja) * 2018-08-09 2018-12-26 国立大学法人 東京大学 局所研磨加工方法、および局所研磨加工装置、並びに該局所研磨加工装置を用いた修正研磨加工装置
KR102725357B1 (ko) * 2020-10-20 2024-11-06 주식회사 케이씨텍 리테이너링 및 이를 포함하는 기판 연마 장치
JP6927617B1 (ja) * 2020-11-19 2021-09-01 不二越機械工業株式会社 ワーク研磨装置およびトップリング用樹脂マット体
TWI826051B (zh) * 2022-10-19 2023-12-11 力晶積成電子製造股份有限公司 化學機械研磨裝置及研磨方法

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US6428403B1 (en) * 1997-04-08 2002-08-06 Ebara Corporation Polishing apparatus
US6913516B1 (en) * 2004-02-02 2005-07-05 Powerchip Semiconductor Corp. Dummy process and polishing-pad conditioning process for chemical mechanical polishing apparatus
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US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
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US6428403B1 (en) * 1997-04-08 2002-08-06 Ebara Corporation Polishing apparatus
US6409583B1 (en) * 1999-05-07 2002-06-25 Tokyo Seimtsu Co., Ltd. Apparatus for polishing wafers
US6913516B1 (en) * 2004-02-02 2005-07-05 Powerchip Semiconductor Corp. Dummy process and polishing-pad conditioning process for chemical mechanical polishing apparatus
CN101045286A (zh) * 2006-03-31 2007-10-03 株式会社荏原制作所 基底夹持装置、抛光装置及抛光方法

Also Published As

Publication number Publication date
KR20150055566A (ko) 2015-05-21
TW201524679A (zh) 2015-07-01
US9815171B2 (en) 2017-11-14
SG10201407353UA (en) 2015-06-29
JP2015116656A (ja) 2015-06-25
TWI614091B (zh) 2018-02-11
KR102208160B1 (ko) 2021-01-27
KR20180101303A (ko) 2018-09-12
US20150133038A1 (en) 2015-05-14
CN104625948A (zh) 2015-05-20
JP6403981B2 (ja) 2018-10-10

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