SG10201506082UA - Substrate edge tuning with retaining ring - Google Patents
Substrate edge tuning with retaining ringInfo
- Publication number
- SG10201506082UA SG10201506082UA SG10201506082UA SG10201506082UA SG10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA SG 10201506082U A SG10201506082U A SG 10201506082UA
- Authority
- SG
- Singapore
- Prior art keywords
- retaining ring
- substrate edge
- edge tuning
- tuning
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37164410P | 2010-08-06 | 2010-08-06 | |
| US201161479271P | 2011-04-26 | 2011-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201506082UA true SG10201506082UA (en) | 2015-09-29 |
Family
ID=45556486
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013009766A SG187782A1 (en) | 2010-08-06 | 2011-08-05 | Substrate edge tuning with retaining ring |
| SG10201506082UA SG10201506082UA (en) | 2010-08-06 | 2011-08-05 | Substrate edge tuning with retaining ring |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013009766A SG187782A1 (en) | 2010-08-06 | 2011-08-05 | Substrate edge tuning with retaining ring |
Country Status (8)
| Country | Link |
|---|---|
| US (5) | US20120034848A1 (en) |
| EP (2) | EP2601677B1 (en) |
| JP (2) | JP6073222B2 (en) |
| KR (3) | KR101882708B1 (en) |
| CN (2) | CN103098182B (en) |
| SG (2) | SG187782A1 (en) |
| TW (2) | TWI574785B (en) |
| WO (1) | WO2012019144A2 (en) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI574785B (en) | 2010-08-06 | 2017-03-21 | 應用材料股份有限公司 | Inner retaining ring and outer retaining ring |
| US20130102152A1 (en) * | 2011-10-20 | 2013-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
| JP5976522B2 (en) | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| US10702972B2 (en) | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
| US10532441B2 (en) * | 2012-11-30 | 2020-01-14 | Applied Materials, Inc. | Three-zone carrier head and flexible membrane |
| US9381613B2 (en) * | 2013-03-13 | 2016-07-05 | Applied Materials, Inc. | Reinforcement ring for carrier head |
| JP6403981B2 (en) * | 2013-11-13 | 2018-10-10 | 株式会社荏原製作所 | Substrate holding device, polishing device, polishing method, and retainer ring |
| KR102173323B1 (en) * | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | Carrier head, chemical mechanical polishing apparatus and wafer polishing method |
| JP2016155188A (en) * | 2015-02-24 | 2016-09-01 | 株式会社荏原製作所 | Retainer ring, substrate holding device, polishing device, and maintenance method of retainer ring |
| US9488218B2 (en) | 2015-03-30 | 2016-11-08 | Honeywell International Inc. | Pilot ring with controlled axial roll |
| JP6392193B2 (en) * | 2015-10-14 | 2018-09-19 | 株式会社荏原製作所 | Substrate holding device, substrate polishing device, and method of manufacturing substrate holding device |
| US10029346B2 (en) * | 2015-10-16 | 2018-07-24 | Applied Materials, Inc. | External clamp ring for a chemical mechanical polishing carrier head |
| US10160091B2 (en) * | 2015-11-16 | 2018-12-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMP polishing head design for improving removal rate uniformity |
| JP7250311B2 (en) * | 2016-04-01 | 2023-04-03 | モ カン，ジューン | Carrier head for chemical-mechanical polishing apparatus with substrate receiving member |
| JP7021863B2 (en) * | 2017-03-30 | 2022-02-17 | 富士紡ホールディングス株式会社 | Cage |
| CN109551365B (en) * | 2019-01-15 | 2023-12-08 | 合肥哈工普利世智能装备有限公司 | Plasma polishing clamping assembly, plasma polishing machine and polishing method thereof |
| KR20210122888A (en) * | 2019-02-28 | 2021-10-12 | 어플라이드 머티어리얼스, 인코포레이티드 | Retainers for chemical mechanical polishing carrier heads |
| US11325223B2 (en) | 2019-08-23 | 2022-05-10 | Applied Materials, Inc. | Carrier head with segmented substrate chuck |
| US11511390B2 (en) | 2019-08-30 | 2022-11-29 | Applied Materials, Inc. | Pivotable substrate retaining ring |
| WO2022005919A1 (en) | 2020-06-29 | 2022-01-06 | Applied Materials, Inc | Polishing carrier head with multiple angular pressurizable zones |
| US20220055181A1 (en) * | 2020-08-21 | 2022-02-24 | Applied Materials, Inc. | Retaining ring design |
| US11440159B2 (en) * | 2020-09-28 | 2022-09-13 | Applied Materials, Inc. | Edge load ring |
| US11623321B2 (en) * | 2020-10-14 | 2023-04-11 | Applied Materials, Inc. | Polishing head retaining ring tilting moment control |
| JP2022074321A (en) * | 2020-11-04 | 2022-05-18 | 株式会社荏原製作所 | Polishing head and polishing device |
| US11660721B2 (en) * | 2021-02-18 | 2023-05-30 | Applied Materials, Inc. | Dual loading retaining ring |
| KR102556166B1 (en) | 2022-01-28 | 2023-07-19 | 지앤에스건설 주식회사 | Floating interior stair manufacturing method and floating interior stair manufactured by the same |
| US20230356354A1 (en) * | 2022-05-03 | 2023-11-09 | Applied Materials, Inc. | Compliant inner ring for a chemical mechanical polishing system |
| US20230381917A1 (en) * | 2022-05-27 | 2023-11-30 | Applied Materials, Inc. | Clamping retainer for chemical mechanical polishing |
| KR102630907B1 (en) | 2022-08-24 | 2024-01-30 | 임형남 | Double helix step duplex |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW400567B (en) * | 1995-04-10 | 2000-08-01 | Matsushita Electric Ind Co Ltd | The polishing device and its polishing method for the substrate |
| US5795215A (en) * | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
| US5643061A (en) * | 1995-07-20 | 1997-07-01 | Integrated Process Equipment Corporation | Pneumatic polishing head for CMP apparatus |
| US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
| JPH09321002A (en) * | 1996-05-31 | 1997-12-12 | Komatsu Electron Metals Co Ltd | Polishing method for semiconductor wafer and polishing template therefor |
| US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
| US6110025A (en) * | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
| EP0881039B1 (en) * | 1997-05-28 | 2003-04-16 | Tokyo Seimitsu Co.,Ltd. | Wafer polishing apparatus with retainer ring |
| US6116992A (en) * | 1997-12-30 | 2000-09-12 | Applied Materials, Inc. | Substrate retaining ring |
| JP3966908B2 (en) * | 1998-04-06 | 2007-08-29 | 株式会社荏原製作所 | Polishing device |
| US6143127A (en) * | 1998-05-14 | 2000-11-07 | Applied Materials, Inc. | Carrier head with a retaining ring for a chemical mechanical polishing system |
| US6436228B1 (en) | 1998-05-15 | 2002-08-20 | Applied Materials, Inc. | Substrate retainer |
| US20020173242A1 (en) * | 1999-04-19 | 2002-11-21 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
| TW467795B (en) * | 1999-03-15 | 2001-12-11 | Mitsubishi Materials Corp | Wafer transporting device, wafer polishing device and method for making wafers |
| US6527624B1 (en) * | 1999-03-26 | 2003-03-04 | Applied Materials, Inc. | Carrier head for providing a polishing slurry |
| KR100546288B1 (en) * | 1999-04-10 | 2006-01-26 | 삼성전자주식회사 | Chemical-mechanical polishing CMP apparatus |
| JP3873557B2 (en) * | 2000-01-07 | 2007-01-24 | 株式会社日立製作所 | Manufacturing method of semiconductor device |
| US6517422B2 (en) * | 2000-03-07 | 2003-02-11 | Toshiba Ceramics Co., Ltd. | Polishing apparatus and method thereof |
| US6375549B1 (en) * | 2000-03-17 | 2002-04-23 | Motorola, Inc. | Polishing head for wafer, and method for polishing |
| US6558232B1 (en) * | 2000-05-12 | 2003-05-06 | Multi-Planar Technologies, Inc. | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control |
| US6602114B1 (en) * | 2000-05-19 | 2003-08-05 | Applied Materials Inc. | Multilayer retaining ring for chemical mechanical polishing |
| JP2002018709A (en) * | 2000-07-05 | 2002-01-22 | Tokyo Seimitsu Co Ltd | Wafer polishing device |
| US6857945B1 (en) * | 2000-07-25 | 2005-02-22 | Applied Materials, Inc. | Multi-chamber carrier head with a flexible membrane |
| TWI261009B (en) * | 2001-05-02 | 2006-09-01 | Hitoshi Suwabe | Polishing machine |
| US6872130B1 (en) * | 2001-12-28 | 2005-03-29 | Applied Materials Inc. | Carrier head with non-contact retainer |
| US6916226B2 (en) * | 2002-05-28 | 2005-07-12 | Ebara Technologies, Inc. | Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof |
| TWM255104U (en) * | 2003-02-05 | 2005-01-11 | Applied Materials Inc | Retaining ring with flange for chemical mechanical polishing |
| WO2005113193A1 (en) * | 2004-05-13 | 2005-12-01 | Applied Materials, Inc. | Retaining ring with conductive portion |
| CN101137464A (en) | 2005-04-12 | 2008-03-05 | 日本精密电子株式会社 | Retainer ring for CMP device, method of manufacturing the same, and CMP device |
| US7186171B2 (en) * | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
| KR200395968Y1 (en) * | 2005-06-16 | 2005-09-15 | 주식회사 윌비에스엔티 | Retainer ring of chemical mechanical polishing apparatus |
| US7198548B1 (en) * | 2005-09-30 | 2007-04-03 | Applied Materials, Inc. | Polishing apparatus and method with direct load platen |
| US7699688B2 (en) * | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
| US7575504B2 (en) * | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
| US7654888B2 (en) * | 2006-11-22 | 2010-02-02 | Applied Materials, Inc. | Carrier head with retaining ring and carrier ring |
| US7727055B2 (en) * | 2006-11-22 | 2010-06-01 | Applied Materials, Inc. | Flexible membrane for carrier head |
| JP2008302464A (en) | 2007-06-07 | 2008-12-18 | Renesas Technology Corp | Polishing device and manufacturing method of semiconductor device using it |
| JP2008307674A (en) * | 2007-06-18 | 2008-12-25 | Tokyo Seimitsu Co Ltd | Split pressurizing type retainer ring |
| JP5199691B2 (en) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | Polishing equipment |
| US7749052B2 (en) * | 2008-09-08 | 2010-07-06 | Applied Materials, Inc. | Carrier head using flexure restraints for retaining ring alignment |
| TWI574785B (en) | 2010-08-06 | 2017-03-21 | 應用材料股份有限公司 | Inner retaining ring and outer retaining ring |
| US20130102152A1 (en) * | 2011-10-20 | 2013-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
-
2011
- 2011-08-05 TW TW102108272A patent/TWI574785B/en active
- 2011-08-05 KR KR1020177037347A patent/KR101882708B1/en active IP Right Grant
- 2011-08-05 EP EP11815393.1A patent/EP2601677B1/en active Active
- 2011-08-05 US US13/204,541 patent/US20120034848A1/en not_active Abandoned
- 2011-08-05 KR KR1020137005683A patent/KR101701870B1/en active IP Right Grant
- 2011-08-05 US US13/204,571 patent/US8721391B2/en active Active
- 2011-08-05 CN CN201180044017.1A patent/CN103098182B/en active Active
- 2011-08-05 TW TW100127991A patent/TWI540021B/en active
- 2011-08-05 SG SG2013009766A patent/SG187782A1/en unknown
- 2011-08-05 EP EP18181304.9A patent/EP3406402B1/en active Active
- 2011-08-05 SG SG10201506082UA patent/SG10201506082UA/en unknown
- 2011-08-05 WO PCT/US2011/046828 patent/WO2012019144A2/en active Application Filing
- 2011-08-05 CN CN201310170453.4A patent/CN103252715B/en active Active
- 2011-08-05 KR KR1020137006070A patent/KR101814185B1/en active IP Right Grant
- 2011-08-05 JP JP2013523375A patent/JP6073222B2/en active Active
-
2013
- 2013-02-08 US US13/762,963 patent/US8840446B2/en active Active
- 2013-06-26 JP JP2013134227A patent/JP5924739B2/en active Active
-
2015
- 2015-12-03 US US14/958,814 patent/US10022837B2/en active Active
-
2018
- 2018-06-25 US US16/017,689 patent/US11173579B2/en active Active
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