TWM389354U - Substrate with metallized surface - Google Patents
Substrate with metallized surfaceInfo
- Publication number
- TWM389354U TWM389354U TW099208317U TW99208317U TWM389354U TW M389354 U TWM389354 U TW M389354U TW 099208317 U TW099208317 U TW 099208317U TW 99208317 U TW99208317 U TW 99208317U TW M389354 U TWM389354 U TW M389354U
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- metallized surface
- metallized
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099208317U TWM389354U (en) | 2010-05-05 | 2010-05-05 | Substrate with metallized surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099208317U TWM389354U (en) | 2010-05-05 | 2010-05-05 | Substrate with metallized surface |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM389354U true TWM389354U (en) | 2010-09-21 |
Family
ID=60590529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099208317U TWM389354U (en) | 2010-05-05 | 2010-05-05 | Substrate with metallized surface |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM389354U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI503951B (en) * | 2010-11-19 | 2015-10-11 | Soitec Silicon On Insulator | Electronic device for radiofrequency or power applications and process for manufacturing such a device |
TWI602237B (en) * | 2013-03-08 | 2017-10-11 | 蘭姆研究公司 | Method of etching an etch layer |
-
2010
- 2010-05-05 TW TW099208317U patent/TWM389354U/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI503951B (en) * | 2010-11-19 | 2015-10-11 | Soitec Silicon On Insulator | Electronic device for radiofrequency or power applications and process for manufacturing such a device |
US9198294B2 (en) | 2010-11-19 | 2015-11-24 | Soitec | Electronic device for radiofrequency or power applications and process for manufacturing such a device |
TWI602237B (en) * | 2013-03-08 | 2017-10-11 | 蘭姆研究公司 | Method of etching an etch layer |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2589082A4 (en) | Electronic devices with yielding substrates | |
GB2481187B (en) | Processing substrates | |
EP2617807A4 (en) | Culture substrate | |
EP2563956A4 (en) | Antimicrobial substrate | |
IL222083A (en) | Connection substrate | |
EP2593540A4 (en) | Microorganisms with extended substrate utilization range | |
EP2632237A4 (en) | Wiring substrate | |
GB2491217B (en) | Multilayer substrate | |
EP2560242A4 (en) | Electronic component | |
GB0904803D0 (en) | Coated substrate | |
GB201016748D0 (en) | Reflective substrate | |
EP2698426A4 (en) | Cell-adhering light-controllable substrate | |
EP2492090A4 (en) | Transparent substrate | |
GB201305721D0 (en) | Surface multiple well | |
SG11201403501PA (en) | Composite substrate | |
EP2732969A4 (en) | Composite substrate | |
GB2484742B (en) | Electronic component for surface mounting | |
EP2690941A4 (en) | Wiring substrate | |
EP2587910A4 (en) | Electronic component | |
ZA201209337B (en) | Conductive adhesive | |
PT3617754T (en) | Transparent substrate comprising an anti-glare coating | |
TWM389354U (en) | Substrate with metallized surface | |
SI2560823T1 (en) | Substrate | |
GB0910040D0 (en) | Substrate structure | |
EP2587909A4 (en) | Electronic component |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |