TWM389354U - Substrate with metallized surface - Google Patents

Substrate with metallized surface

Info

Publication number
TWM389354U
TWM389354U TW099208317U TW99208317U TWM389354U TW M389354 U TWM389354 U TW M389354U TW 099208317 U TW099208317 U TW 099208317U TW 99208317 U TW99208317 U TW 99208317U TW M389354 U TWM389354 U TW M389354U
Authority
TW
Taiwan
Prior art keywords
substrate
metallized surface
metallized
Prior art date
Application number
TW099208317U
Other languages
Chinese (zh)
Inventor
Yuan-Chen Hsu
Yi-Jen Chen
Wei-Chun Yang
Original Assignee
Paragon Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Paragon Technologies Co Ltd filed Critical Paragon Technologies Co Ltd
Priority to TW099208317U priority Critical patent/TWM389354U/en
Publication of TWM389354U publication Critical patent/TWM389354U/en

Links

TW099208317U 2010-05-05 2010-05-05 Substrate with metallized surface TWM389354U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099208317U TWM389354U (en) 2010-05-05 2010-05-05 Substrate with metallized surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099208317U TWM389354U (en) 2010-05-05 2010-05-05 Substrate with metallized surface

Publications (1)

Publication Number Publication Date
TWM389354U true TWM389354U (en) 2010-09-21

Family

ID=60590529

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099208317U TWM389354U (en) 2010-05-05 2010-05-05 Substrate with metallized surface

Country Status (1)

Country Link
TW (1) TWM389354U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503951B (en) * 2010-11-19 2015-10-11 Soitec Silicon On Insulator Electronic device for radiofrequency or power applications and process for manufacturing such a device
TWI602237B (en) * 2013-03-08 2017-10-11 蘭姆研究公司 Method of etching an etch layer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI503951B (en) * 2010-11-19 2015-10-11 Soitec Silicon On Insulator Electronic device for radiofrequency or power applications and process for manufacturing such a device
US9198294B2 (en) 2010-11-19 2015-11-24 Soitec Electronic device for radiofrequency or power applications and process for manufacturing such a device
TWI602237B (en) * 2013-03-08 2017-10-11 蘭姆研究公司 Method of etching an etch layer

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees