JP2015067856A - マグネトロンスパッタ装置 - Google Patents

マグネトロンスパッタ装置 Download PDF

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Publication number
JP2015067856A
JP2015067856A JP2013202300A JP2013202300A JP2015067856A JP 2015067856 A JP2015067856 A JP 2015067856A JP 2013202300 A JP2013202300 A JP 2013202300A JP 2013202300 A JP2013202300 A JP 2013202300A JP 2015067856 A JP2015067856 A JP 2015067856A
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Japan
Prior art keywords
substrate
target
holder
opening
magnetron sputtering
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JP2013202300A
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Japanese (ja)
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JP2015067856A5 (enExample
Inventor
幸男 菊地
Yukio Kikuchi
幸男 菊地
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Seagate Technology LLC
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Seagate Technology LLC
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JP2013202300A 2013-09-27 2013-09-27 マグネトロンスパッタ装置 Pending JP2015067856A (ja)

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JP2013202300A JP2015067856A (ja) 2013-09-27 2013-09-27 マグネトロンスパッタ装置

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018084010A1 (ja) * 2016-11-04 2018-05-11 東京エレクトロン株式会社 成膜装置
KR20180064995A (ko) 2016-12-06 2018-06-15 도쿄엘렉트론가부시키가이샤 성막 장치
CN109778128A (zh) * 2017-11-15 2019-05-21 佳能特机株式会社 溅射装置
KR20190098070A (ko) 2018-02-13 2019-08-21 도쿄엘렉트론가부시키가이샤 성막 시스템 및 기판 상에 막을 형성하는 방법
KR20200000356A (ko) 2018-06-22 2020-01-02 도쿄엘렉트론가부시키가이샤 기판 배치대 및 성막 장치
KR20200001511A (ko) 2018-06-26 2020-01-06 도쿄엘렉트론가부시키가이샤 스퍼터링 장치
JP2020002395A (ja) * 2018-06-26 2020-01-09 東京エレクトロン株式会社 スパッタ装置
KR20200014209A (ko) * 2018-07-31 2020-02-10 도쿄엘렉트론가부시키가이샤 성막 장치 및 성막 방법
KR20200018278A (ko) 2018-08-10 2020-02-19 도쿄엘렉트론가부시키가이샤 성막 장치 및 성막 방법
KR20200018270A (ko) 2018-08-10 2020-02-19 도쿄엘렉트론가부시키가이샤 성막 장치, 성막 시스템 및 성막 방법
KR20210002545A (ko) 2018-04-24 2021-01-08 도쿄엘렉트론가부시키가이샤 성막 장치 및 성막 방법
US11220741B2 (en) 2018-05-16 2022-01-11 Tokyo Electron Limited Film forming apparatus and film forming method
US20220076932A1 (en) * 2018-10-16 2022-03-10 Jsw Afty Corporation Plasma film forming apparatus and plasma film forming method
US11414747B2 (en) 2018-06-26 2022-08-16 Tokyo Electron Limited Sputtering device
US11664207B2 (en) 2018-08-10 2023-05-30 Tokyo Electron Limited Film-forming apparatus, film-forming system, and film-forming method
CN116288194A (zh) * 2021-12-20 2023-06-23 佳能特机株式会社 溅射装置
US12125690B2 (en) 2019-01-30 2024-10-22 Jsw Afty Corporation Target, film forming apparatus, and method of manufacturing film formation object

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1036963A (ja) * 1996-07-23 1998-02-10 Sony Corp スパッタ装置及びこれを用いた軟磁性膜の成膜方法
JP2001192805A (ja) * 1999-10-28 2001-07-17 Akt Kk 汚染物質ブロック用シールド付き傾斜スパッタリングターゲット
JP2010174331A (ja) * 2009-01-29 2010-08-12 Canon Inc 硼化物膜の製造方法及び電子放出素子の製造方法
JP2010539674A (ja) * 2007-09-18 2010-12-16 ビーコ・インスツルメンツ・インコーポレーテッド エネルギー粒子ビームを使用した基板の表面処理方法及び装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1036963A (ja) * 1996-07-23 1998-02-10 Sony Corp スパッタ装置及びこれを用いた軟磁性膜の成膜方法
JP2001192805A (ja) * 1999-10-28 2001-07-17 Akt Kk 汚染物質ブロック用シールド付き傾斜スパッタリングターゲット
JP2010539674A (ja) * 2007-09-18 2010-12-16 ビーコ・インスツルメンツ・インコーポレーテッド エネルギー粒子ビームを使用した基板の表面処理方法及び装置
JP2010174331A (ja) * 2009-01-29 2010-08-12 Canon Inc 硼化物膜の製造方法及び電子放出素子の製造方法

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190056416A (ko) 2016-11-04 2019-05-24 도쿄엘렉트론가부시키가이샤 성막 장치
WO2018084010A1 (ja) * 2016-11-04 2018-05-11 東京エレクトロン株式会社 成膜装置
US11410837B2 (en) 2016-11-04 2022-08-09 Tokyo Electron Limited Film-forming device
KR20180064995A (ko) 2016-12-06 2018-06-15 도쿄엘렉트론가부시키가이샤 성막 장치
KR102107282B1 (ko) * 2016-12-06 2020-05-06 도쿄엘렉트론가부시키가이샤 성막 장치
US10392688B2 (en) 2016-12-06 2019-08-27 Tokyo Electron Limited Film forming apparatus
CN109778128B (zh) * 2017-11-15 2022-08-23 佳能特机株式会社 溅射装置
CN109778128A (zh) * 2017-11-15 2019-05-21 佳能特机株式会社 溅射装置
JP2019090083A (ja) * 2017-11-15 2019-06-13 キヤノントッキ株式会社 スパッタ装置および有機ｅｌパネルの製造方法
US11542592B2 (en) 2018-02-13 2023-01-03 Tokyo Electron Limited Film forming system and method for forming film on substrate
KR20210008550A (ko) 2018-02-13 2021-01-22 도쿄엘렉트론가부시키가이샤 성막 시스템 및 기판 상에 막을 형성하는 방법
KR102297165B1 (ko) 2018-02-13 2021-09-01 도쿄엘렉트론가부시키가이샤 성막 시스템 및 기판 상에 막을 형성하는 방법
KR20190098070A (ko) 2018-02-13 2019-08-21 도쿄엘렉트론가부시키가이샤 성막 시스템 및 기판 상에 막을 형성하는 방법
US11495446B2 (en) 2018-04-24 2022-11-08 Tokyo Electron Limited Film formation device and film formation method
KR20210002545A (ko) 2018-04-24 2021-01-08 도쿄엘렉트론가부시키가이샤 성막 장치 및 성막 방법
US11220741B2 (en) 2018-05-16 2022-01-11 Tokyo Electron Limited Film forming apparatus and film forming method
KR20200000356A (ko) 2018-06-22 2020-01-02 도쿄엘렉트론가부시키가이샤 기판 배치대 및 성막 장치
KR20210019523A (ko) 2018-06-26 2021-02-22 도쿄엘렉트론가부시키가이샤 스퍼터 장치
US11414747B2 (en) 2018-06-26 2022-08-16 Tokyo Electron Limited Sputtering device
KR20200001511A (ko) 2018-06-26 2020-01-06 도쿄엘렉트론가부시키가이샤 스퍼터링 장치
JP2020002395A (ja) * 2018-06-26 2020-01-09 東京エレクトロン株式会社 スパッタ装置
KR102287784B1 (ko) * 2018-07-31 2021-08-06 도쿄엘렉트론가부시키가이샤 성막 장치 및 성막 방법
KR20200014209A (ko) * 2018-07-31 2020-02-10 도쿄엘렉트론가부시키가이샤 성막 장치 및 성막 방법
US11158492B2 (en) 2018-07-31 2021-10-26 Tokyo Electron Limited Film forming apparatus and film forming method
JP2020026547A (ja) * 2018-08-10 2020-02-20 東京エレクトロン株式会社 成膜装置および成膜方法
CN114293156A (zh) * 2018-08-10 2022-04-08 东京毅力科创株式会社 成膜系统和成膜方法
JP7097777B2 (ja) 2018-08-10 2022-07-08 東京エレクトロン株式会社 成膜装置および成膜方法
KR20200018278A (ko) 2018-08-10 2020-02-19 도쿄엘렉트론가부시키가이샤 성막 장치 및 성막 방법
KR20200018270A (ko) 2018-08-10 2020-02-19 도쿄엘렉트론가부시키가이샤 성막 장치, 성막 시스템 및 성막 방법
JP2020026575A (ja) * 2018-08-10 2020-02-20 東京エレクトロン株式会社 成膜装置、成膜システム、および成膜方法
KR102290842B1 (ko) * 2018-08-10 2021-08-17 도쿄엘렉트론가부시키가이샤 성막 장치 및 성막 방법
US11512388B2 (en) 2018-08-10 2022-11-29 Tokyo Electron Limited Film forming apparatus and film forming method
KR102269997B1 (ko) * 2018-08-10 2021-06-25 도쿄엘렉트론가부시키가이샤 성막 장치, 성막 시스템 및 성막 방법
US11664207B2 (en) 2018-08-10 2023-05-30 Tokyo Electron Limited Film-forming apparatus, film-forming system, and film-forming method
US20220076932A1 (en) * 2018-10-16 2022-03-10 Jsw Afty Corporation Plasma film forming apparatus and plasma film forming method
US12125690B2 (en) 2019-01-30 2024-10-22 Jsw Afty Corporation Target, film forming apparatus, and method of manufacturing film formation object
CN116288194A (zh) * 2021-12-20 2023-06-23 佳能特机株式会社 溅射装置

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