JP2015050465A - パワー半導体装置及びパワー半導体装置を製造するための方法 - Google Patents

パワー半導体装置及びパワー半導体装置を製造するための方法 Download PDF

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Publication number
JP2015050465A
JP2015050465A JP2014176971A JP2014176971A JP2015050465A JP 2015050465 A JP2015050465 A JP 2015050465A JP 2014176971 A JP2014176971 A JP 2014176971A JP 2014176971 A JP2014176971 A JP 2014176971A JP 2015050465 A JP2015050465 A JP 2015050465A
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Japan
Prior art keywords
cooling
housing member
power semiconductor
cooling housing
semiconductor device
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JP2014176971A
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English (en)
Japanese (ja)
Inventor
ボーゲン インゴ
Bogen Ingo
ボーゲン インゴ
ベック マルクス
Markus Beck
ベック マルクス
クーラス ハルトムート
Kuras Hartmut
クーラス ハルトムート
ポペスク アレクサンダー
Popescu Alexander
ポペスク アレクサンダー
ヘルデルファー ラインハルト
Helldoerfer Reinhard
ヘルデルファー ラインハルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
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Filing date
Publication date
Application filed by Semikron GmbH and Co KG, Semikron Elektronik GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of JP2015050465A publication Critical patent/JP2015050465A/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014176971A 2013-09-03 2014-09-01 パワー半導体装置及びパワー半導体装置を製造するための方法 Withdrawn JP2015050465A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013109589.5 2013-09-03
DE201310109589 DE102013109589B3 (de) 2013-09-03 2013-09-03 Leistungshalbleitereinrichtung und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung

Publications (1)

Publication Number Publication Date
JP2015050465A true JP2015050465A (ja) 2015-03-16

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JP2014176971A Withdrawn JP2015050465A (ja) 2013-09-03 2014-09-01 パワー半導体装置及びパワー半導体装置を製造するための方法

Country Status (7)

Country Link
US (1) US9111900B2 (enExample)
EP (1) EP2844051A3 (enExample)
JP (1) JP2015050465A (enExample)
KR (1) KR20150026862A (enExample)
CN (1) CN104425406B (enExample)
DE (1) DE102013109589B3 (enExample)
IN (1) IN2014MU02658A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016203885A1 (ja) * 2015-06-17 2017-09-21 富士電機株式会社 パワー半導体モジュール及び冷却器
JP2017212401A (ja) * 2016-05-27 2017-11-30 日産自動車株式会社 電力変換装置の製造方法と冷却構造
JP2019110208A (ja) * 2017-12-18 2019-07-04 トヨタ自動車株式会社 リアクトルユニット
JP2022524749A (ja) * 2019-03-04 2022-05-10 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト スタンピングされたプレートの使用によるパワーコンバータの直接冷却
JP2022524961A (ja) * 2019-02-28 2022-05-11 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 冷却器フレームの一体化が向上した電力変換装置
JP2023086174A (ja) * 2021-12-10 2023-06-22 株式会社レゾナック 冷却装置
JP2023086175A (ja) * 2021-12-10 2023-06-22 株式会社レゾナック 冷却装置

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DE102015211163A1 (de) * 2015-06-17 2016-12-22 Zf Friedrichshafen Ag Anordnung zum Kühlen eines Leistungsmoduls
DE102015211160A1 (de) * 2015-06-17 2016-12-22 Zf Friedrichshafen Ag Anordnung zum Kühlen eines Leistungsmoduls
EP3116292B1 (de) 2015-07-06 2021-03-17 EDAG Engineering AG Elektronikmodul mit generativ erzeugtem kühlkörper
DE102015114188B4 (de) * 2015-08-26 2019-03-07 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches Submodul mit einem zweiteiligen Gehäuse
DE102015223413A1 (de) * 2015-11-26 2017-06-01 Zf Friedrichshafen Ag Kupfer-Alu-Kühlkörper
US9824953B1 (en) 2016-05-16 2017-11-21 Caterpillar Inc. Mounting and environmental protection device for an IGBT module
KR101956983B1 (ko) 2016-09-20 2019-03-11 현대자동차일본기술연구소 파워 모듈 및 그 제조 방법
DE102017101269B4 (de) 2017-01-24 2019-03-07 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung mit einem Leistungshalbleitermodul und einem Kühlkörper
DE102017001351A1 (de) * 2017-02-11 2018-08-16 Leopold Kostal Gmbh & Co. Kg Elektrisches Gerät und Verfahren zur Herstellung eines elektrischen Geräts
US10950522B2 (en) * 2017-02-13 2021-03-16 Shindengen Electric Manufacturing Co., Ltd. Electronic device
DE102019200142A1 (de) * 2019-01-08 2020-07-09 Volkswagen Aktiengesellschaft Kühleinheit zur Abfuhr von Abwärme von zumindest einem Leistungsbauteil
DE102019202903A1 (de) * 2019-03-04 2020-09-10 Abb Schweiz Ag Elektronischer Konverter ausgebildet basierend auf Schweißtechnologien
DE102019206523A1 (de) * 2019-05-07 2020-11-12 Zf Friedrichshafen Ag Leistungsmodul mit gehäusten Leistungshalbleitern zur steuerbaren elektrischen Leistungsversorgung eines Verbrauchers
CN110173957B (zh) * 2019-06-19 2023-09-08 广东文轩热能科技股份有限公司 一种新型液冷板
CN114175221B (zh) * 2019-07-25 2022-10-28 日立能源瑞士股份公司 功率半导体模块以及其形成方法
DE102020207966A1 (de) * 2019-11-25 2021-05-27 Volkswagen Aktiengesellschaft Kühlanordnung für elektronische Komponenten eines Kraftfahrzeugs
DE102020110937B4 (de) 2020-04-22 2022-06-09 Semikron Elektronik Gmbh & Co. Kg Kühleinrichtung zur Kühlung eines Leistungshalbleitermoduls
DE102020111528A1 (de) * 2020-04-28 2021-10-28 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung mit einem Mehrphasen-Leistungshalbleitermodul
CN215935363U (zh) * 2020-09-02 2022-03-01 春鸿电子科技(重庆)有限公司 液冷头
CN114361122B (zh) * 2021-08-11 2025-03-11 华为技术有限公司 功率模块的封装结构及封装方法
KR102623554B1 (ko) * 2021-11-10 2024-01-11 동양피스톤 주식회사 수냉식 방열모듈 조립체
DE102022201557B3 (de) 2022-02-15 2023-07-20 Magna powertrain gmbh & co kg Baueinheit für Leistungsmodule sowie Montageverfahren für die Baueinheit für Leistungsmodule
US20240064944A1 (en) * 2022-08-17 2024-02-22 Semiconductor Components Industries, Llc Sealing method for direct liquid cooled power electronics package
CN115551302B (zh) * 2022-09-28 2025-08-12 华为数字能源技术有限公司 散热系统及电子设备
DE102022212458A1 (de) * 2022-11-22 2024-05-23 Magna powertrain gmbh & co kg Stromrichter mit direkt gekühltem Leistungsmodul und Verfahren zur Herstellung eines Stromrichters
US20240395662A1 (en) * 2023-05-26 2024-11-28 Semiconductor Components Industries, Llc Method of direct cooling using a conductive strip

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US5323292A (en) * 1992-10-06 1994-06-21 Hewlett-Packard Company Integrated multi-chip module having a conformal chip/heat exchanger interface
US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
JP3946018B2 (ja) * 2001-09-18 2007-07-18 株式会社日立製作所 液冷却式回路装置
WO2005088714A1 (en) * 2004-03-08 2005-09-22 Remmele Engineering, Inc. Cold plate and method of making the same
US7071552B2 (en) * 2004-03-29 2006-07-04 Intel Corporation IC die with directly bonded liquid cooling device
JP4600199B2 (ja) * 2005-07-29 2010-12-15 三菱マテリアル株式会社 冷却器及びパワーモジュール
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
DE102010043446B3 (de) 2010-11-05 2012-01-12 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitersystem
US10269682B2 (en) * 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2016203885A1 (ja) * 2015-06-17 2017-09-21 富士電機株式会社 パワー半導体モジュール及び冷却器
US10304756B2 (en) 2015-06-17 2019-05-28 Fuji Electric Co., Ltd. Power semiconductor module and cooler
JP2017212401A (ja) * 2016-05-27 2017-11-30 日産自動車株式会社 電力変換装置の製造方法と冷却構造
JP2019110208A (ja) * 2017-12-18 2019-07-04 トヨタ自動車株式会社 リアクトルユニット
JP2022524961A (ja) * 2019-02-28 2022-05-11 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト 冷却器フレームの一体化が向上した電力変換装置
US12016162B2 (en) 2019-02-28 2024-06-18 Audi Ag Electric power converter device with improved integration of cooler frame
JP2022524749A (ja) * 2019-03-04 2022-05-10 ヒタチ・エナジー・スウィツァーランド・アクチェンゲゼルシャフト スタンピングされたプレートの使用によるパワーコンバータの直接冷却
US12160982B2 (en) 2019-03-04 2024-12-03 Audi Ag Direct cooling of a power converter by using a stamped plate
JP2023086174A (ja) * 2021-12-10 2023-06-22 株式会社レゾナック 冷却装置
JP2023086175A (ja) * 2021-12-10 2023-06-22 株式会社レゾナック 冷却装置
JP7782242B2 (ja) 2021-12-10 2025-12-09 株式会社レゾナック 冷却装置
JP7782243B2 (ja) 2021-12-10 2025-12-09 株式会社レゾナック 冷却装置

Also Published As

Publication number Publication date
CN104425406A (zh) 2015-03-18
DE102013109589B3 (de) 2015-03-05
KR20150026862A (ko) 2015-03-11
EP2844051A3 (de) 2016-06-01
US9111900B2 (en) 2015-08-18
CN104425406B (zh) 2019-01-08
IN2014MU02658A (enExample) 2015-10-09
US20150061112A1 (en) 2015-03-05
EP2844051A2 (de) 2015-03-04

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