KR20150026862A - 전력 반도체 장치 및 전력 반도체 장치 제조 방법 - Google Patents

전력 반도체 장치 및 전력 반도체 장치 제조 방법 Download PDF

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Publication number
KR20150026862A
KR20150026862A KR20140109594A KR20140109594A KR20150026862A KR 20150026862 A KR20150026862 A KR 20150026862A KR 20140109594 A KR20140109594 A KR 20140109594A KR 20140109594 A KR20140109594 A KR 20140109594A KR 20150026862 A KR20150026862 A KR 20150026862A
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KR
South Korea
Prior art keywords
housing part
cooling
power semiconductor
cooling housing
welding seam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR20140109594A
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English (en)
Korean (ko)
Inventor
보겐 잉고
베크 마르쿠스
쿠라스 할트무트
포페스쿠 알렉산더
헬도퍼 라인하르트
Original Assignee
세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 filed Critical 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지
Publication of KR20150026862A publication Critical patent/KR20150026862A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR20140109594A 2013-09-03 2014-08-22 전력 반도체 장치 및 전력 반도체 장치 제조 방법 Withdrawn KR20150026862A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013109589.5 2013-09-03
DE201310109589 DE102013109589B3 (de) 2013-09-03 2013-09-03 Leistungshalbleitereinrichtung und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung

Publications (1)

Publication Number Publication Date
KR20150026862A true KR20150026862A (ko) 2015-03-11

Family

ID=51167798

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140109594A Withdrawn KR20150026862A (ko) 2013-09-03 2014-08-22 전력 반도체 장치 및 전력 반도체 장치 제조 방법

Country Status (7)

Country Link
US (1) US9111900B2 (enExample)
EP (1) EP2844051A3 (enExample)
JP (1) JP2015050465A (enExample)
KR (1) KR20150026862A (enExample)
CN (1) CN104425406B (enExample)
DE (1) DE102013109589B3 (enExample)
IN (1) IN2014MU02658A (enExample)

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US10541188B2 (en) 2016-09-20 2020-01-21 Hyundai Motor Company Power module and manufacturing method thereof

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WO2016203885A1 (ja) 2015-06-17 2016-12-22 富士電機株式会社 パワー半導体モジュール及び冷却器
DE102015211163A1 (de) * 2015-06-17 2016-12-22 Zf Friedrichshafen Ag Anordnung zum Kühlen eines Leistungsmoduls
DE102015211160A1 (de) * 2015-06-17 2016-12-22 Zf Friedrichshafen Ag Anordnung zum Kühlen eines Leistungsmoduls
EP3116292B1 (de) 2015-07-06 2021-03-17 EDAG Engineering AG Elektronikmodul mit generativ erzeugtem kühlkörper
DE102015114188B4 (de) * 2015-08-26 2019-03-07 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches Submodul mit einem zweiteiligen Gehäuse
DE102015223413A1 (de) * 2015-11-26 2017-06-01 Zf Friedrichshafen Ag Kupfer-Alu-Kühlkörper
US9824953B1 (en) 2016-05-16 2017-11-21 Caterpillar Inc. Mounting and environmental protection device for an IGBT module
JP6811551B2 (ja) * 2016-05-27 2021-01-13 日産自動車株式会社 電力変換装置の製造方法と冷却構造
DE102017101269B4 (de) 2017-01-24 2019-03-07 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitereinrichtung mit einem Leistungshalbleitermodul und einem Kühlkörper
DE102017001351A1 (de) * 2017-02-11 2018-08-16 Leopold Kostal Gmbh & Co. Kg Elektrisches Gerät und Verfahren zur Herstellung eines elektrischen Geräts
US10950522B2 (en) * 2017-02-13 2021-03-16 Shindengen Electric Manufacturing Co., Ltd. Electronic device
JP6988432B2 (ja) * 2017-12-18 2022-01-05 株式会社デンソー リアクトルユニット
DE102019200142A1 (de) * 2019-01-08 2020-07-09 Volkswagen Aktiengesellschaft Kühleinheit zur Abfuhr von Abwärme von zumindest einem Leistungsbauteil
EP3703117B1 (en) 2019-02-28 2022-11-23 Audi Ag Electric power converter device with improved integration of cooler frame
DE102019202903A1 (de) * 2019-03-04 2020-09-10 Abb Schweiz Ag Elektronischer Konverter ausgebildet basierend auf Schweißtechnologien
DE102019202902A1 (de) * 2019-03-04 2020-09-10 Abb Schweiz Ag Direkte Kühlung eines Stromrichters durch Verwendung einer geprägten Platte
DE102019206523A1 (de) * 2019-05-07 2020-11-12 Zf Friedrichshafen Ag Leistungsmodul mit gehäusten Leistungshalbleitern zur steuerbaren elektrischen Leistungsversorgung eines Verbrauchers
CN110173957B (zh) * 2019-06-19 2023-09-08 广东文轩热能科技股份有限公司 一种新型液冷板
CN114175221B (zh) * 2019-07-25 2022-10-28 日立能源瑞士股份公司 功率半导体模块以及其形成方法
DE102020207966A1 (de) * 2019-11-25 2021-05-27 Volkswagen Aktiengesellschaft Kühlanordnung für elektronische Komponenten eines Kraftfahrzeugs
DE102020110937B4 (de) 2020-04-22 2022-06-09 Semikron Elektronik Gmbh & Co. Kg Kühleinrichtung zur Kühlung eines Leistungshalbleitermoduls
DE102020111528A1 (de) * 2020-04-28 2021-10-28 Semikron Elektronik Gmbh & Co. Kg Leistungselektronische Anordnung mit einem Mehrphasen-Leistungshalbleitermodul
CN215935363U (zh) * 2020-09-02 2022-03-01 春鸿电子科技(重庆)有限公司 液冷头
CN114361122B (zh) * 2021-08-11 2025-03-11 华为技术有限公司 功率模块的封装结构及封装方法
KR102623554B1 (ko) * 2021-11-10 2024-01-11 동양피스톤 주식회사 수냉식 방열모듈 조립체
JP7782243B2 (ja) * 2021-12-10 2025-12-09 株式会社レゾナック 冷却装置
JP7782242B2 (ja) * 2021-12-10 2025-12-09 株式会社レゾナック 冷却装置
DE102022201557B3 (de) 2022-02-15 2023-07-20 Magna powertrain gmbh & co kg Baueinheit für Leistungsmodule sowie Montageverfahren für die Baueinheit für Leistungsmodule
US20240064944A1 (en) * 2022-08-17 2024-02-22 Semiconductor Components Industries, Llc Sealing method for direct liquid cooled power electronics package
CN115551302B (zh) * 2022-09-28 2025-08-12 华为数字能源技术有限公司 散热系统及电子设备
DE102022212458A1 (de) * 2022-11-22 2024-05-23 Magna powertrain gmbh & co kg Stromrichter mit direkt gekühltem Leistungsmodul und Verfahren zur Herstellung eines Stromrichters
US20240395662A1 (en) * 2023-05-26 2024-11-28 Semiconductor Components Industries, Llc Method of direct cooling using a conductive strip

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US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
JP3946018B2 (ja) * 2001-09-18 2007-07-18 株式会社日立製作所 液冷却式回路装置
WO2005088714A1 (en) * 2004-03-08 2005-09-22 Remmele Engineering, Inc. Cold plate and method of making the same
US7071552B2 (en) * 2004-03-29 2006-07-04 Intel Corporation IC die with directly bonded liquid cooling device
JP4600199B2 (ja) * 2005-07-29 2010-12-15 三菱マテリアル株式会社 冷却器及びパワーモジュール
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
DE102010043446B3 (de) 2010-11-05 2012-01-12 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitersystem
US10269682B2 (en) * 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10541188B2 (en) 2016-09-20 2020-01-21 Hyundai Motor Company Power module and manufacturing method thereof

Also Published As

Publication number Publication date
JP2015050465A (ja) 2015-03-16
CN104425406A (zh) 2015-03-18
DE102013109589B3 (de) 2015-03-05
EP2844051A3 (de) 2016-06-01
US9111900B2 (en) 2015-08-18
CN104425406B (zh) 2019-01-08
IN2014MU02658A (enExample) 2015-10-09
US20150061112A1 (en) 2015-03-05
EP2844051A2 (de) 2015-03-04

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000