JP2015035461A - 炭化珪素半導体装置の製造方法 - Google Patents
炭化珪素半導体装置の製造方法 Download PDFInfo
- Publication number
- JP2015035461A JP2015035461A JP2013164798A JP2013164798A JP2015035461A JP 2015035461 A JP2015035461 A JP 2015035461A JP 2013164798 A JP2013164798 A JP 2013164798A JP 2013164798 A JP2013164798 A JP 2013164798A JP 2015035461 A JP2015035461 A JP 2015035461A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- silicon carbide
- semiconductor device
- nickel silicide
- carbide semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 122
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 120
- 239000004065 semiconductor Substances 0.000 title claims abstract description 76
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000010410 layer Substances 0.000 claims abstract description 153
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 229910021334 nickel silicide Inorganic materials 0.000 claims abstract description 55
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 claims abstract description 55
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 20
- 239000002344 surface layer Substances 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 238000005498 polishing Methods 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 27
- 238000007740 vapor deposition Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 2
- 239000010936 titanium Substances 0.000 abstract description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 6
- 238000000151 deposition Methods 0.000 abstract description 6
- 229910052719 titanium Inorganic materials 0.000 abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 25
- 229910052799 carbon Inorganic materials 0.000 description 24
- 239000012535 impurity Substances 0.000 description 9
- 239000002244 precipitate Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910005881 NiSi 2 Inorganic materials 0.000 description 1
- 239000005708 Sodium hypochlorite Substances 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/048—Making electrodes
- H01L21/0485—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/0475—Changing the shape of the semiconductor body, e.g. forming recesses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
実施の形態にかかる炭化珪素半導体装置の製造方法によって作製(製造)される炭化珪素半導体装置の構造について、縦型の絶縁ゲート型電界効果トランジスタ(MOSFET)を例に説明する。図1は、実施の形態にかかる炭化珪素半導体装置の製造方法により製造される炭化珪素半導体装置の一例を示す断面図である。図1に示すように、実施の形態にかかる炭化珪素半導体装置において、炭化珪素(SiC)からなるn+型半導体基板(以下、n+型SiC基板とする)1のおもて面上にはn-型SiCエピタキシャル層2が設けられている。n-型SiCエピタキシャル層2のn+型SiC基板1側に対して反対側の面の表面層には、p型ベース層3が選択的に設けられている。p型ベース層3の内部には、n+型ソース層4およびp+型コンタクト層5が選択的に設けられている。n+型ソース層4およびp+型コンタクト層5は互いに接する。
2 n-型SiCエピタキシャル層
3 p型ベース層
4 n+型ソース層
5 p+型コンタクト層
6 ゲート絶縁膜
7 ゲート電極
8 層間絶縁膜
9 ソース電極
10,11 ニッケルシリサイド層
11a ニッケルシリサイド層の内部に一様に分散された炭素
12 裏面電極
21 裏面側n-型SiC蒸着層
22 コンタクトホール
Claims (5)
- 炭化珪素からなる半導体基板の裏面を研削して、前記半導体基板の厚さを薄くする研削工程と、
前記研削工程によって前記半導体基板の裏面の表面層に生じた変質層を研磨またはエッチングにより除去する除去工程と、
前記除去工程後、前記半導体基板の裏面にニッケル膜を形成する工程と、
熱処理により前記ニッケル膜をシリサイド化してニッケルシリサイド層を形成する工程と、
前記ニッケルシリサイド層の表面上に金属電極を形成する工程と、
を含むことを特徴とする炭化珪素半導体装置の製造方法。 - 前記研磨は、化学機械研磨であることを特徴とする請求項1に記載の炭化珪素半導体装置の製造方法。
- 前記エッチングは、ドライエッチングまたはウェットエッチングであることを特徴とする請求項1に記載の炭化珪素半導体装置の製造方法。
- 前記除去工程では、前記半導体基板の厚さを100nm以上薄くすることを特徴とする請求項1〜3のいずれか一つに記載の炭化珪素半導体装置の製造方法。
- 前記研削工程前に、前記半導体基板のおもて面上にエピタキシャル層を成長させる成長工程をさらに含み、
前記成長工程では、前記半導体基板の裏面に蒸着層が成長し、
前記研削工程では、前記蒸着層を除去するとともに、前記半導体基板の裏面の表面層を除去することを特徴とする請求項1〜4のいずれか一つに記載の炭化珪素半導体装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013164798A JP6107526B2 (ja) | 2013-08-08 | 2013-08-08 | 炭化珪素半導体装置の製造方法 |
PCT/JP2014/071121 WO2015020219A1 (ja) | 2013-08-08 | 2014-08-08 | 炭化珪素半導体装置の製造方法 |
CN201480044578.5A CN105453228B (zh) | 2013-08-08 | 2014-08-08 | 碳化硅半导体装置的制造方法 |
US15/017,576 US9685333B2 (en) | 2013-08-08 | 2016-02-05 | Manufacturing method of silicon carbide semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013164798A JP6107526B2 (ja) | 2013-08-08 | 2013-08-08 | 炭化珪素半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015035461A true JP2015035461A (ja) | 2015-02-19 |
JP6107526B2 JP6107526B2 (ja) | 2017-04-05 |
Family
ID=52461542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013164798A Active JP6107526B2 (ja) | 2013-08-08 | 2013-08-08 | 炭化珪素半導体装置の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9685333B2 (ja) |
JP (1) | JP6107526B2 (ja) |
CN (1) | CN105453228B (ja) |
WO (1) | WO2015020219A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018070263A1 (ja) * | 2016-10-13 | 2018-04-19 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP2021027113A (ja) * | 2019-08-02 | 2021-02-22 | 株式会社豊田中央研究所 | 半導体装置 |
JP2021064672A (ja) * | 2019-10-11 | 2021-04-22 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106024761A (zh) * | 2016-05-26 | 2016-10-12 | 中山港科半导体科技有限公司 | 一种功率半导体芯片背面金属结构及其制备方法 |
JP6737987B2 (ja) * | 2016-11-28 | 2020-08-12 | 株式会社デンソー | 半導体装置の製造方法 |
JP6728096B2 (ja) * | 2017-04-24 | 2020-07-22 | 株式会社東芝 | 半導体装置、半導体装置の製造方法、インバータ回路、駆動装置、車両、及び、昇降機 |
CN110364430B (zh) * | 2019-07-29 | 2022-03-01 | 武汉新芯集成电路制造有限公司 | 一种晶圆的减薄方法及晶圆结构 |
CN111276395A (zh) * | 2020-02-19 | 2020-06-12 | 华芯威半导体科技(北京)有限责任公司 | 一种碳化硅器件原料的制造方法及使用该原料制备的碳化硅器件 |
IT202100001922A1 (it) * | 2021-01-29 | 2022-07-29 | St Microelectronics Srl | Struttura di contatto dal retro perfezionata per un dispositivo a semiconduttore e relativo procedimento di fabbricazione |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007201155A (ja) * | 2006-01-26 | 2007-08-09 | Nissan Motor Co Ltd | 炭化珪素半導体装置及び炭化珪素半導体装置の製造方法 |
WO2012049792A1 (ja) * | 2010-10-15 | 2012-04-19 | 三菱電機株式会社 | 炭化珪素半導体素子の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3871607B2 (ja) | 2001-12-14 | 2007-01-24 | 松下電器産業株式会社 | 半導体素子およびその製造方法 |
JP4539140B2 (ja) | 2004-03-29 | 2010-09-08 | 住友電気工業株式会社 | 炭化珪素基板およびその製造方法 |
JP2007184571A (ja) | 2005-12-08 | 2007-07-19 | Nissan Motor Co Ltd | 炭化珪素半導体装置、炭化珪素半導体装置の製造方法、炭化珪素半導体装置中の遷移金属シリサイドと金属膜との接合体及び炭化珪素半導体装置中の遷移金属シリサイドと金属膜との接合体の製造方法 |
JP4846445B2 (ja) | 2006-05-19 | 2011-12-28 | 新日本製鐵株式会社 | 炭化珪素単結晶ウェハ表面の仕上げ研磨方法 |
JP2008053291A (ja) | 2006-08-22 | 2008-03-06 | Rohm Co Ltd | SiC半導体素子およびその製造方法 |
JP2009194216A (ja) * | 2008-02-15 | 2009-08-27 | Hitachi Ltd | 半導体装置の製造方法 |
JP5369581B2 (ja) | 2008-09-29 | 2013-12-18 | 住友電気工業株式会社 | 半導体デバイス用裏面電極、半導体デバイスおよび半導体デバイス用裏面電極の製造方法 |
CN102107391B (zh) * | 2009-12-24 | 2014-01-15 | 北京天科合达蓝光半导体有限公司 | 一种SiC单晶晶片的加工方法 |
US8847238B2 (en) * | 2012-11-09 | 2014-09-30 | Panasonic Corporation | Semiconductor device which can withstand high voltage or high current and method for fabricating the same |
JP6048581B2 (ja) * | 2013-06-04 | 2016-12-21 | 新日鐵住金株式会社 | エピタキシャル炭化珪素ウエハ用炭化珪素単結晶基板の製造方法 |
-
2013
- 2013-08-08 JP JP2013164798A patent/JP6107526B2/ja active Active
-
2014
- 2014-08-08 WO PCT/JP2014/071121 patent/WO2015020219A1/ja active Application Filing
- 2014-08-08 CN CN201480044578.5A patent/CN105453228B/zh active Active
-
2016
- 2016-02-05 US US15/017,576 patent/US9685333B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007201155A (ja) * | 2006-01-26 | 2007-08-09 | Nissan Motor Co Ltd | 炭化珪素半導体装置及び炭化珪素半導体装置の製造方法 |
WO2012049792A1 (ja) * | 2010-10-15 | 2012-04-19 | 三菱電機株式会社 | 炭化珪素半導体素子の製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018070263A1 (ja) * | 2016-10-13 | 2018-04-19 | 三菱電機株式会社 | 半導体装置の製造方法 |
US10665459B2 (en) | 2016-10-13 | 2020-05-26 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
JP2021027113A (ja) * | 2019-08-02 | 2021-02-22 | 株式会社豊田中央研究所 | 半導体装置 |
JP7101147B2 (ja) | 2019-08-02 | 2022-07-14 | 株式会社豊田中央研究所 | 半導体装置 |
JP2021064672A (ja) * | 2019-10-11 | 2021-04-22 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
JP7314758B2 (ja) | 2019-10-11 | 2023-07-26 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105453228A (zh) | 2016-03-30 |
CN105453228B (zh) | 2017-12-19 |
JP6107526B2 (ja) | 2017-04-05 |
WO2015020219A1 (ja) | 2015-02-12 |
US9685333B2 (en) | 2017-06-20 |
US20160155640A1 (en) | 2016-06-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6107526B2 (ja) | 炭化珪素半導体装置の製造方法 | |
WO2016013658A1 (ja) | 半導体素子及びその製造方法、半導体基板、並びに結晶積層構造体 | |
JP5550738B2 (ja) | 炭化珪素半導体素子の製造方法 | |
JP5646527B2 (ja) | 半導体装置および半導体装置の製造方法 | |
TW200908326A (en) | Field effect transistor using carbon based stress liner | |
JP6222771B2 (ja) | 炭化珪素半導体装置の製造方法 | |
TW201230178A (en) | Method for manufacturing silicon carbide semiconductor device and apparatus for manufacturing silicon carbide semiconductor device | |
JP6571155B2 (ja) | 炭化ケイ素上への金属接触層の形成及び金属接触構造を有する半導体デバイス | |
WO2013084620A1 (ja) | 半導体装置の製造方法 | |
TW201133573A (en) | Method for manufacturing semiconductor device | |
CN104871288A (zh) | 制造碳化硅半导体器件的方法 | |
US11948880B2 (en) | SOI substrate and related methods | |
WO2016002386A1 (ja) | 炭化珪素半導体素子の製造方法 | |
JP2004022878A (ja) | 半導体装置およびその製造方法 | |
JP5840366B2 (ja) | 炭化珪素半導体基板の製造方法および炭化珪素半導体装置の製造方法 | |
JP2019012836A (ja) | 半導体素子 | |
JP6164062B2 (ja) | 炭化珪素半導体装置の製造方法 | |
JP6152701B2 (ja) | 炭化珪素半導体装置の製造方法および炭化珪素半導体装置 | |
KR20120047537A (ko) | 게이트 형성 방법 및 이를 이용한 반도체 소자의 제조 방법 | |
JP2016197737A (ja) | 半導体素子及びその製造方法、並びに結晶積層構造体 | |
JP2008004726A (ja) | 半導体素子およびその製造方法 | |
TW201403793A (zh) | 互補型半導體裝置及其製造方法 | |
JP2017168672A (ja) | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 | |
JP2017028219A (ja) | 炭化珪素半導体装置およびその製造方法 | |
JP6705231B2 (ja) | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20150318 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20150318 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160215 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160719 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160916 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170207 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170220 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6107526 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |