JP2015029088A5 - - Google Patents

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Publication number
JP2015029088A5
JP2015029088A5 JP2014132168A JP2014132168A JP2015029088A5 JP 2015029088 A5 JP2015029088 A5 JP 2015029088A5 JP 2014132168 A JP2014132168 A JP 2014132168A JP 2014132168 A JP2014132168 A JP 2014132168A JP 2015029088 A5 JP2015029088 A5 JP 2015029088A5
Authority
JP
Japan
Prior art keywords
ring
application example
base ring
clamp
elastomer band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014132168A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015029088A (ja
Filing date
Publication date
Priority claimed from US13/930,659 external-priority patent/US9502279B2/en
Application filed filed Critical
Publication of JP2015029088A publication Critical patent/JP2015029088A/ja
Publication of JP2015029088A5 publication Critical patent/JP2015029088A5/ja
Pending legal-status Critical Current

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JP2014132168A 2013-06-28 2014-06-27 微細溝付き非付着面を有する装着装置 Pending JP2015029088A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/930,659 US9502279B2 (en) 2013-06-28 2013-06-28 Installation fixture having a micro-grooved non-stick surface
US13/930,659 2013-06-28

Publications (2)

Publication Number Publication Date
JP2015029088A JP2015029088A (ja) 2015-02-12
JP2015029088A5 true JP2015029088A5 (enExample) 2017-09-21

Family

ID=52115739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014132168A Pending JP2015029088A (ja) 2013-06-28 2014-06-27 微細溝付き非付着面を有する装着装置

Country Status (5)

Country Link
US (1) US9502279B2 (enExample)
JP (1) JP2015029088A (enExample)
KR (1) KR20150044371A (enExample)
CN (1) CN104253078A (enExample)
TW (1) TWI622123B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105405797B (zh) * 2015-12-30 2018-01-12 天津金海通自动化设备制造有限公司 一种给气浮动机构
JP6572788B2 (ja) * 2016-01-29 2019-09-11 住友大阪セメント株式会社 静電チャック装置
JP7340938B2 (ja) * 2019-02-25 2023-09-08 東京エレクトロン株式会社 載置台及び基板処理装置
CN116845004A (zh) * 2020-05-27 2023-10-03 北京北方华创微电子装备有限公司 半导体工艺设备

Family Cites Families (31)

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US6364957B1 (en) 1997-10-09 2002-04-02 Applied Materials, Inc. Support assembly with thermal expansion compensation
WO2002089531A1 (en) 2001-04-30 2002-11-07 Lam Research, Corporation Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
US6771482B2 (en) 2001-07-30 2004-08-03 Unaxis Usa Inc. Perimeter seal for backside cooling of substrates
JP4451098B2 (ja) * 2002-08-22 2010-04-14 住友大阪セメント株式会社 サセプタ装置
US7252738B2 (en) 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
AU2003254871A1 (en) 2002-10-25 2004-05-13 Nok Corporation Plasma resistant seal
US6944006B2 (en) 2003-04-03 2005-09-13 Applied Materials, Inc. Guard for electrostatic chuck
US7514506B2 (en) 2004-03-31 2009-04-07 Greene, Tweed Of Delaware, Inc. Fast curing fluoroelastomeric compositions, adhesive fluoroelastomeric compositions and methods for bonding fluoroelastomeric compositions
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
US7319316B2 (en) 2005-06-29 2008-01-15 Lam Research Corporation Apparatus for measuring a set of electrical characteristics in a plasma
US7431788B2 (en) 2005-07-19 2008-10-07 Lam Research Corporation Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system
JP2007207728A (ja) * 2006-02-06 2007-08-16 Aisin Seiki Co Ltd 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池
GB0610479D0 (en) 2006-05-26 2006-07-05 Ge Healthcare Bio Sciences Ab A method for generating metal chelating affinity ligands
US20090179366A1 (en) 2008-01-16 2009-07-16 Sokudo Co., Ltd. Apparatus for supporting a substrate during semiconductor processing operations
CN102027574B (zh) * 2008-02-08 2014-09-10 朗姆研究公司 等离子体处理室部件的保护性涂层及其使用方法
CN201167837Y (zh) * 2008-03-06 2008-12-24 浙江爱仕达电器股份有限公司 铝合金阳极氧化物理不粘锅
US7884925B2 (en) 2008-05-23 2011-02-08 Lam Research Corporation Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
JP5518071B2 (ja) 2008-08-19 2014-06-11 ラム リサーチ コーポレーション 静電チャック用エッジリング
JP5635001B2 (ja) 2008-09-26 2014-12-03 ラム リサーチ コーポレーションLam Research Corporation 結合リングをクロック回転させることによって調整可能な静電チャックとホットエッジリングとの間の熱的接触
KR101624123B1 (ko) 2008-10-31 2016-05-25 램 리써치 코포레이션 플라즈마 프로세싱 챔버의 하부 전극 어셈블리
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US8409995B2 (en) 2009-08-07 2013-04-02 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
JP5291039B2 (ja) * 2010-03-31 2013-09-18 大日本スクリーン製造株式会社 基板保持回転装置および基板処理装置
TWM431430U (en) * 2011-08-24 2012-06-11 Wafer Works Corp Clip board type fastening device for use in annularly etching wafer
US9869392B2 (en) * 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US8844106B2 (en) * 2011-11-10 2014-09-30 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same
US8677586B2 (en) * 2012-04-04 2014-03-25 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same
US9583377B2 (en) * 2013-12-17 2017-02-28 Lam Research Corporation Installation fixture for elastomer bands

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