JP2015029088A5 - - Google Patents
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- Publication number
- JP2015029088A5 JP2015029088A5 JP2014132168A JP2014132168A JP2015029088A5 JP 2015029088 A5 JP2015029088 A5 JP 2015029088A5 JP 2014132168 A JP2014132168 A JP 2014132168A JP 2014132168 A JP2014132168 A JP 2014132168A JP 2015029088 A5 JP2015029088 A5 JP 2015029088A5
- Authority
- JP
- Japan
- Prior art keywords
- ring
- application example
- base ring
- clamp
- elastomer band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001971 elastomer Polymers 0.000 description 38
- 239000000806 elastomer Substances 0.000 description 38
- 239000000758 substrate Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/930,659 US9502279B2 (en) | 2013-06-28 | 2013-06-28 | Installation fixture having a micro-grooved non-stick surface |
| US13/930,659 | 2013-06-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015029088A JP2015029088A (ja) | 2015-02-12 |
| JP2015029088A5 true JP2015029088A5 (enExample) | 2017-09-21 |
Family
ID=52115739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014132168A Pending JP2015029088A (ja) | 2013-06-28 | 2014-06-27 | 微細溝付き非付着面を有する装着装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9502279B2 (enExample) |
| JP (1) | JP2015029088A (enExample) |
| KR (1) | KR20150044371A (enExample) |
| CN (1) | CN104253078A (enExample) |
| TW (1) | TWI622123B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405797B (zh) * | 2015-12-30 | 2018-01-12 | 天津金海通自动化设备制造有限公司 | 一种给气浮动机构 |
| JP6572788B2 (ja) * | 2016-01-29 | 2019-09-11 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP7340938B2 (ja) * | 2019-02-25 | 2023-09-08 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
| CN116845004A (zh) * | 2020-05-27 | 2023-10-03 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5636098A (en) | 1994-01-06 | 1997-06-03 | Applied Materials, Inc. | Barrier seal for electrostatic chuck |
| US5740009A (en) | 1996-11-29 | 1998-04-14 | Applied Materials, Inc. | Apparatus for improving wafer and chuck edge protection |
| US6090304A (en) | 1997-08-28 | 2000-07-18 | Lam Research Corporation | Methods for selective plasma etch |
| US6364957B1 (en) | 1997-10-09 | 2002-04-02 | Applied Materials, Inc. | Support assembly with thermal expansion compensation |
| WO2002089531A1 (en) | 2001-04-30 | 2002-11-07 | Lam Research, Corporation | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
| US6771482B2 (en) | 2001-07-30 | 2004-08-03 | Unaxis Usa Inc. | Perimeter seal for backside cooling of substrates |
| JP4451098B2 (ja) * | 2002-08-22 | 2010-04-14 | 住友大阪セメント株式会社 | サセプタ装置 |
| US7252738B2 (en) | 2002-09-20 | 2007-08-07 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| AU2003254871A1 (en) | 2002-10-25 | 2004-05-13 | Nok Corporation | Plasma resistant seal |
| US6944006B2 (en) | 2003-04-03 | 2005-09-13 | Applied Materials, Inc. | Guard for electrostatic chuck |
| US7514506B2 (en) | 2004-03-31 | 2009-04-07 | Greene, Tweed Of Delaware, Inc. | Fast curing fluoroelastomeric compositions, adhesive fluoroelastomeric compositions and methods for bonding fluoroelastomeric compositions |
| US8038796B2 (en) | 2004-12-30 | 2011-10-18 | Lam Research Corporation | Apparatus for spatial and temporal control of temperature on a substrate |
| US7319316B2 (en) | 2005-06-29 | 2008-01-15 | Lam Research Corporation | Apparatus for measuring a set of electrical characteristics in a plasma |
| US7431788B2 (en) | 2005-07-19 | 2008-10-07 | Lam Research Corporation | Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system |
| JP2007207728A (ja) * | 2006-02-06 | 2007-08-16 | Aisin Seiki Co Ltd | 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池 |
| GB0610479D0 (en) | 2006-05-26 | 2006-07-05 | Ge Healthcare Bio Sciences Ab | A method for generating metal chelating affinity ligands |
| US20090179366A1 (en) | 2008-01-16 | 2009-07-16 | Sokudo Co., Ltd. | Apparatus for supporting a substrate during semiconductor processing operations |
| CN102027574B (zh) * | 2008-02-08 | 2014-09-10 | 朗姆研究公司 | 等离子体处理室部件的保护性涂层及其使用方法 |
| CN201167837Y (zh) * | 2008-03-06 | 2008-12-24 | 浙江爱仕达电器股份有限公司 | 铝合金阳极氧化物理不粘锅 |
| US7884925B2 (en) | 2008-05-23 | 2011-02-08 | Lam Research Corporation | Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials |
| JP5518071B2 (ja) | 2008-08-19 | 2014-06-11 | ラム リサーチ コーポレーション | 静電チャック用エッジリング |
| JP5635001B2 (ja) | 2008-09-26 | 2014-12-03 | ラム リサーチ コーポレーションLam Research Corporation | 結合リングをクロック回転させることによって調整可能な静電チャックとホットエッジリングとの間の熱的接触 |
| KR101624123B1 (ko) | 2008-10-31 | 2016-05-25 | 램 리써치 코포레이션 | 플라즈마 프로세싱 챔버의 하부 전극 어셈블리 |
| US20100117309A1 (en) | 2008-11-13 | 2010-05-13 | Applied Materials, Inc. | Sealing apparatus for a process chamber |
| US8409995B2 (en) | 2009-08-07 | 2013-04-02 | Tokyo Electron Limited | Substrate processing apparatus, positioning method and focus ring installation method |
| JP5291039B2 (ja) * | 2010-03-31 | 2013-09-18 | 大日本スクリーン製造株式会社 | 基板保持回転装置および基板処理装置 |
| TWM431430U (en) * | 2011-08-24 | 2012-06-11 | Wafer Works Corp | Clip board type fastening device for use in annularly etching wafer |
| US9869392B2 (en) * | 2011-10-20 | 2018-01-16 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US8844106B2 (en) * | 2011-11-10 | 2014-09-30 | Lam Research Corporation | Installation fixture for elastomer bands and methods of using the same |
| US8677586B2 (en) * | 2012-04-04 | 2014-03-25 | Lam Research Corporation | Installation fixture for elastomer bands and methods of using the same |
| US9583377B2 (en) * | 2013-12-17 | 2017-02-28 | Lam Research Corporation | Installation fixture for elastomer bands |
-
2013
- 2013-06-28 US US13/930,659 patent/US9502279B2/en active Active
-
2014
- 2014-06-27 JP JP2014132168A patent/JP2015029088A/ja active Pending
- 2014-06-27 TW TW103122372A patent/TWI622123B/zh active
- 2014-06-30 CN CN201410306477.2A patent/CN104253078A/zh active Pending
- 2014-06-30 KR KR20140081147A patent/KR20150044371A/ko not_active Withdrawn
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