CN104253078A - 具有微槽不粘表面的安装夹具 - Google Patents
具有微槽不粘表面的安装夹具 Download PDFInfo
- Publication number
- CN104253078A CN104253078A CN201410306477.2A CN201410306477A CN104253078A CN 104253078 A CN104253078 A CN 104253078A CN 201410306477 A CN201410306477 A CN 201410306477A CN 104253078 A CN104253078 A CN 104253078A
- Authority
- CN
- China
- Prior art keywords
- ring
- elastic webbing
- basic ring
- clamping
- clamping ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims description 14
- 238000007599 discharging Methods 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 abstract description 9
- 239000000806 elastomer Substances 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 34
- 210000002381 plasma Anatomy 0.000 description 32
- 235000012431 wafers Nutrition 0.000 description 20
- 239000000463 material Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 16
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 238000010276 construction Methods 0.000 description 13
- 239000007789 gas Substances 0.000 description 13
- 238000009940 knitting Methods 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229920006169 Perfluoroelastomer Polymers 0.000 description 1
- PRPAGESBURMWTI-UHFFFAOYSA-N [C].[F] Chemical compound [C].[F] PRPAGESBURMWTI-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920000260 silastic Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49863—Assembling or joining with prestressing of part
- Y10T29/4987—Elastic joining of parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T403/00—Joints and connections
- Y10T403/67—Thimble: screw or cam
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/930,659 US9502279B2 (en) | 2013-06-28 | 2013-06-28 | Installation fixture having a micro-grooved non-stick surface |
| US13/930,659 | 2013-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104253078A true CN104253078A (zh) | 2014-12-31 |
Family
ID=52115739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410306477.2A Pending CN104253078A (zh) | 2013-06-28 | 2014-06-30 | 具有微槽不粘表面的安装夹具 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9502279B2 (enExample) |
| JP (1) | JP2015029088A (enExample) |
| KR (1) | KR20150044371A (enExample) |
| CN (1) | CN104253078A (enExample) |
| TW (1) | TWI622123B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725096A (zh) * | 2020-05-27 | 2020-09-29 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105405797B (zh) * | 2015-12-30 | 2018-01-12 | 天津金海通自动化设备制造有限公司 | 一种给气浮动机构 |
| JP6572788B2 (ja) * | 2016-01-29 | 2019-09-11 | 住友大阪セメント株式会社 | 静電チャック装置 |
| JP7340938B2 (ja) * | 2019-02-25 | 2023-09-08 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007207728A (ja) * | 2006-02-06 | 2007-08-16 | Aisin Seiki Co Ltd | 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池 |
| CN201167837Y (zh) * | 2008-03-06 | 2008-12-24 | 浙江爱仕达电器股份有限公司 | 铝合金阳极氧化物理不粘锅 |
| CN104272445A (zh) * | 2012-04-04 | 2015-01-07 | 朗姆研究公司 | 用于弹性体带的安装固定架及其使用方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5636098A (en) | 1994-01-06 | 1997-06-03 | Applied Materials, Inc. | Barrier seal for electrostatic chuck |
| US5740009A (en) | 1996-11-29 | 1998-04-14 | Applied Materials, Inc. | Apparatus for improving wafer and chuck edge protection |
| US6090304A (en) | 1997-08-28 | 2000-07-18 | Lam Research Corporation | Methods for selective plasma etch |
| US6364957B1 (en) | 1997-10-09 | 2002-04-02 | Applied Materials, Inc. | Support assembly with thermal expansion compensation |
| WO2002089531A1 (en) | 2001-04-30 | 2002-11-07 | Lam Research, Corporation | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
| US6771482B2 (en) | 2001-07-30 | 2004-08-03 | Unaxis Usa Inc. | Perimeter seal for backside cooling of substrates |
| JP4451098B2 (ja) * | 2002-08-22 | 2010-04-14 | 住友大阪セメント株式会社 | サセプタ装置 |
| US7252738B2 (en) | 2002-09-20 | 2007-08-07 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| AU2003254871A1 (en) | 2002-10-25 | 2004-05-13 | Nok Corporation | Plasma resistant seal |
| US6944006B2 (en) | 2003-04-03 | 2005-09-13 | Applied Materials, Inc. | Guard for electrostatic chuck |
| US7514506B2 (en) | 2004-03-31 | 2009-04-07 | Greene, Tweed Of Delaware, Inc. | Fast curing fluoroelastomeric compositions, adhesive fluoroelastomeric compositions and methods for bonding fluoroelastomeric compositions |
| US8038796B2 (en) | 2004-12-30 | 2011-10-18 | Lam Research Corporation | Apparatus for spatial and temporal control of temperature on a substrate |
| US7319316B2 (en) | 2005-06-29 | 2008-01-15 | Lam Research Corporation | Apparatus for measuring a set of electrical characteristics in a plasma |
| US7431788B2 (en) | 2005-07-19 | 2008-10-07 | Lam Research Corporation | Method of protecting a bond layer in a substrate support adapted for use in a plasma processing system |
| GB0610479D0 (en) | 2006-05-26 | 2006-07-05 | Ge Healthcare Bio Sciences Ab | A method for generating metal chelating affinity ligands |
| US20090179366A1 (en) | 2008-01-16 | 2009-07-16 | Sokudo Co., Ltd. | Apparatus for supporting a substrate during semiconductor processing operations |
| CN102027574B (zh) * | 2008-02-08 | 2014-09-10 | 朗姆研究公司 | 等离子体处理室部件的保护性涂层及其使用方法 |
| US7884925B2 (en) | 2008-05-23 | 2011-02-08 | Lam Research Corporation | Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials |
| JP5518071B2 (ja) | 2008-08-19 | 2014-06-11 | ラム リサーチ コーポレーション | 静電チャック用エッジリング |
| JP5635001B2 (ja) | 2008-09-26 | 2014-12-03 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | 結合リングをクロック回転させることによって調整可能な静電チャックとホットエッジリングとの間の熱的接触 |
| KR101624123B1 (ko) | 2008-10-31 | 2016-05-25 | 램 리써치 코포레이션 | 플라즈마 프로세싱 챔버의 하부 전극 어셈블리 |
| US20100117309A1 (en) | 2008-11-13 | 2010-05-13 | Applied Materials, Inc. | Sealing apparatus for a process chamber |
| US8409995B2 (en) | 2009-08-07 | 2013-04-02 | Tokyo Electron Limited | Substrate processing apparatus, positioning method and focus ring installation method |
| JP5291039B2 (ja) * | 2010-03-31 | 2013-09-18 | 大日本スクリーン製造株式会社 | 基板保持回転装置および基板処理装置 |
| TWM431430U (en) * | 2011-08-24 | 2012-06-11 | Wafer Works Corp | Clip board type fastening device for use in annularly etching wafer |
| US9869392B2 (en) * | 2011-10-20 | 2018-01-16 | Lam Research Corporation | Edge seal for lower electrode assembly |
| US8844106B2 (en) * | 2011-11-10 | 2014-09-30 | Lam Research Corporation | Installation fixture for elastomer bands and methods of using the same |
| US9583377B2 (en) * | 2013-12-17 | 2017-02-28 | Lam Research Corporation | Installation fixture for elastomer bands |
-
2013
- 2013-06-28 US US13/930,659 patent/US9502279B2/en active Active
-
2014
- 2014-06-27 JP JP2014132168A patent/JP2015029088A/ja active Pending
- 2014-06-27 TW TW103122372A patent/TWI622123B/zh active
- 2014-06-30 CN CN201410306477.2A patent/CN104253078A/zh active Pending
- 2014-06-30 KR KR20140081147A patent/KR20150044371A/ko not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007207728A (ja) * | 2006-02-06 | 2007-08-16 | Aisin Seiki Co Ltd | 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池 |
| CN201167837Y (zh) * | 2008-03-06 | 2008-12-24 | 浙江爱仕达电器股份有限公司 | 铝合金阳极氧化物理不粘锅 |
| CN104272445A (zh) * | 2012-04-04 | 2015-01-07 | 朗姆研究公司 | 用于弹性体带的安装固定架及其使用方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725096A (zh) * | 2020-05-27 | 2020-09-29 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
| CN111725096B (zh) * | 2020-05-27 | 2023-08-18 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI622123B (zh) | 2018-04-21 |
| US20150003903A1 (en) | 2015-01-01 |
| US9502279B2 (en) | 2016-11-22 |
| JP2015029088A (ja) | 2015-02-12 |
| KR20150044371A (ko) | 2015-04-24 |
| TW201516278A (zh) | 2015-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141231 |