TWI622123B - 具有微溝槽不黏表面之安裝夾具及安裝彈性體帶的方法 - Google Patents

具有微溝槽不黏表面之安裝夾具及安裝彈性體帶的方法 Download PDF

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Publication number
TWI622123B
TWI622123B TW103122372A TW103122372A TWI622123B TW I622123 B TWI622123 B TW I622123B TW 103122372 A TW103122372 A TW 103122372A TW 103122372 A TW103122372 A TW 103122372A TW I622123 B TWI622123 B TW I622123B
Authority
TW
Taiwan
Prior art keywords
ring
clamping
base ring
band
grooves
Prior art date
Application number
TW103122372A
Other languages
English (en)
Chinese (zh)
Other versions
TW201516278A (zh
Inventor
尼爾 牛頓
Original Assignee
蘭姆研究公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW201516278A publication Critical patent/TW201516278A/zh
Application granted granted Critical
Publication of TWI622123B publication Critical patent/TWI622123B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49863—Assembling or joining with prestressing of part
    • Y10T29/4987—Elastic joining of parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T403/00—Joints and connections
    • Y10T403/67—Thimble: screw or cam

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
TW103122372A 2013-06-28 2014-06-27 具有微溝槽不黏表面之安裝夾具及安裝彈性體帶的方法 TWI622123B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/930,659 US9502279B2 (en) 2013-06-28 2013-06-28 Installation fixture having a micro-grooved non-stick surface
US13/930,659 2013-06-28

Publications (2)

Publication Number Publication Date
TW201516278A TW201516278A (zh) 2015-05-01
TWI622123B true TWI622123B (zh) 2018-04-21

Family

ID=52115739

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103122372A TWI622123B (zh) 2013-06-28 2014-06-27 具有微溝槽不黏表面之安裝夾具及安裝彈性體帶的方法

Country Status (5)

Country Link
US (1) US9502279B2 (enExample)
JP (1) JP2015029088A (enExample)
KR (1) KR20150044371A (enExample)
CN (1) CN104253078A (enExample)
TW (1) TWI622123B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105405797B (zh) * 2015-12-30 2018-01-12 天津金海通自动化设备制造有限公司 一种给气浮动机构
JP6572788B2 (ja) * 2016-01-29 2019-09-11 住友大阪セメント株式会社 静電チャック装置
JP7340938B2 (ja) * 2019-02-25 2023-09-08 東京エレクトロン株式会社 載置台及び基板処理装置
CN116845004A (zh) * 2020-05-27 2023-10-03 北京北方华创微电子装备有限公司 半导体工艺设备

Citations (5)

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JP2004104113A (ja) * 2002-08-22 2004-04-02 Sumitomo Osaka Cement Co Ltd サセプタ装置
CN101223000A (zh) * 2005-07-19 2008-07-16 朗姆研究公司 保护在适于在等离子体处理系统中使用的基片支撑件中的粘结层的方法
JP2011216520A (ja) * 2010-03-31 2011-10-27 Dainippon Screen Mfg Co Ltd 基板保持回転装置および基板処理装置
TWM431430U (en) * 2011-08-24 2012-06-11 Wafer Works Corp Clip board type fastening device for use in annularly etching wafer
TW201403743A (zh) * 2012-04-04 2014-01-16 Lam Res Corp 用於彈性材料帶之安裝固定架及其使用方法

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US5740009A (en) 1996-11-29 1998-04-14 Applied Materials, Inc. Apparatus for improving wafer and chuck edge protection
US6090304A (en) 1997-08-28 2000-07-18 Lam Research Corporation Methods for selective plasma etch
US6364957B1 (en) 1997-10-09 2002-04-02 Applied Materials, Inc. Support assembly with thermal expansion compensation
WO2002089531A1 (en) 2001-04-30 2002-11-07 Lam Research, Corporation Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
US6771482B2 (en) 2001-07-30 2004-08-03 Unaxis Usa Inc. Perimeter seal for backside cooling of substrates
US7252738B2 (en) 2002-09-20 2007-08-07 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
AU2003254871A1 (en) 2002-10-25 2004-05-13 Nok Corporation Plasma resistant seal
US6944006B2 (en) 2003-04-03 2005-09-13 Applied Materials, Inc. Guard for electrostatic chuck
US7514506B2 (en) 2004-03-31 2009-04-07 Greene, Tweed Of Delaware, Inc. Fast curing fluoroelastomeric compositions, adhesive fluoroelastomeric compositions and methods for bonding fluoroelastomeric compositions
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
US7319316B2 (en) 2005-06-29 2008-01-15 Lam Research Corporation Apparatus for measuring a set of electrical characteristics in a plasma
JP2007207728A (ja) * 2006-02-06 2007-08-16 Aisin Seiki Co Ltd 固体高分子型燃料電池用セパレータ及びその製造方法、並びに固体高分子型燃料電池
GB0610479D0 (en) 2006-05-26 2006-07-05 Ge Healthcare Bio Sciences Ab A method for generating metal chelating affinity ligands
US20090179366A1 (en) 2008-01-16 2009-07-16 Sokudo Co., Ltd. Apparatus for supporting a substrate during semiconductor processing operations
CN102027574B (zh) * 2008-02-08 2014-09-10 朗姆研究公司 等离子体处理室部件的保护性涂层及其使用方法
CN201167837Y (zh) * 2008-03-06 2008-12-24 浙江爱仕达电器股份有限公司 铝合金阳极氧化物理不粘锅
US7884925B2 (en) 2008-05-23 2011-02-08 Lam Research Corporation Electrical and optical system and methods for monitoring erosion of electrostatic chuck edge bead materials
JP5518071B2 (ja) 2008-08-19 2014-06-11 ラム リサーチ コーポレーション 静電チャック用エッジリング
JP5635001B2 (ja) 2008-09-26 2014-12-03 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 結合リングをクロック回転させることによって調整可能な静電チャックとホットエッジリングとの間の熱的接触
KR101624123B1 (ko) 2008-10-31 2016-05-25 램 리써치 코포레이션 플라즈마 프로세싱 챔버의 하부 전극 어셈블리
US20100117309A1 (en) 2008-11-13 2010-05-13 Applied Materials, Inc. Sealing apparatus for a process chamber
US8409995B2 (en) 2009-08-07 2013-04-02 Tokyo Electron Limited Substrate processing apparatus, positioning method and focus ring installation method
US9869392B2 (en) * 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US8844106B2 (en) * 2011-11-10 2014-09-30 Lam Research Corporation Installation fixture for elastomer bands and methods of using the same
US9583377B2 (en) * 2013-12-17 2017-02-28 Lam Research Corporation Installation fixture for elastomer bands

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004104113A (ja) * 2002-08-22 2004-04-02 Sumitomo Osaka Cement Co Ltd サセプタ装置
CN101223000A (zh) * 2005-07-19 2008-07-16 朗姆研究公司 保护在适于在等离子体处理系统中使用的基片支撑件中的粘结层的方法
JP2011216520A (ja) * 2010-03-31 2011-10-27 Dainippon Screen Mfg Co Ltd 基板保持回転装置および基板処理装置
TWM431430U (en) * 2011-08-24 2012-06-11 Wafer Works Corp Clip board type fastening device for use in annularly etching wafer
TW201403743A (zh) * 2012-04-04 2014-01-16 Lam Res Corp 用於彈性材料帶之安裝固定架及其使用方法

Also Published As

Publication number Publication date
CN104253078A (zh) 2014-12-31
US20150003903A1 (en) 2015-01-01
US9502279B2 (en) 2016-11-22
JP2015029088A (ja) 2015-02-12
KR20150044371A (ko) 2015-04-24
TW201516278A (zh) 2015-05-01

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