JP2014529523A5 - - Google Patents

Download PDF

Info

Publication number
JP2014529523A5
JP2014529523A5 JP2014526487A JP2014526487A JP2014529523A5 JP 2014529523 A5 JP2014529523 A5 JP 2014529523A5 JP 2014526487 A JP2014526487 A JP 2014526487A JP 2014526487 A JP2014526487 A JP 2014526487A JP 2014529523 A5 JP2014529523 A5 JP 2014529523A5
Authority
JP
Japan
Prior art keywords
powder
layer
hydrophobic
binder
suspension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014526487A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014529523A (ja
JP5985641B2 (ja
Filing date
Publication date
Priority claimed from SE1100624A external-priority patent/SE536670C2/sv
Application filed filed Critical
Publication of JP2014529523A publication Critical patent/JP2014529523A/ja
Publication of JP2014529523A5 publication Critical patent/JP2014529523A5/ja
Application granted granted Critical
Publication of JP5985641B2 publication Critical patent/JP5985641B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014526487A 2011-08-26 2012-08-22 多材料から構成される自由造形可能な微細部品の積層造形法 Expired - Fee Related JP5985641B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE1100624A SE536670C2 (sv) 2011-08-26 2011-08-26 Skiktbaserad tillverkning av friformade mikrokomponenter avmultimaterial
SE1100624-4 2011-08-26
PCT/EP2012/066339 WO2013030064A1 (en) 2011-08-26 2012-08-22 Layered manufacturing of free-form multi-material micro-components

Publications (3)

Publication Number Publication Date
JP2014529523A JP2014529523A (ja) 2014-11-13
JP2014529523A5 true JP2014529523A5 (enExample) 2015-08-20
JP5985641B2 JP5985641B2 (ja) 2016-09-06

Family

ID=46750323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014526487A Expired - Fee Related JP5985641B2 (ja) 2011-08-26 2012-08-22 多材料から構成される自由造形可能な微細部品の積層造形法

Country Status (11)

Country Link
US (1) US9545669B2 (enExample)
EP (1) EP2747986B1 (enExample)
JP (1) JP5985641B2 (enExample)
KR (1) KR101995940B1 (enExample)
CN (1) CN103826830B (enExample)
BR (1) BR112014004155B1 (enExample)
CA (1) CA2846461C (enExample)
EA (1) EA025234B1 (enExample)
ES (1) ES2567076T3 (enExample)
SE (1) SE536670C2 (enExample)
WO (1) WO2013030064A1 (enExample)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9156680B2 (en) * 2012-10-26 2015-10-13 Analog Devices, Inc. Packages and methods for packaging
US10462907B2 (en) 2013-06-24 2019-10-29 President And Fellows Of Harvard College Printed three-dimensional (3D) functional part and method of making
EP3055604B1 (en) * 2013-10-07 2021-03-31 Raytheon Technologies Corporation Additively grown enhanced impact resistance features for improved structure and joint protection
US11273594B2 (en) 2014-01-16 2022-03-15 Hewlett-Packard Development Company, L.P. Modifying data representing three-dimensional objects
US10452038B2 (en) 2014-01-16 2019-10-22 Hewlett-Packard Development Company, L.P. Build material profile
MX393796B (es) 2014-01-16 2025-03-24 Hewlett Packard Development Co Generar objetos tridimensionales.
US10538074B2 (en) 2014-01-16 2020-01-21 Hewlett-Packard Development Company, L.P. Processing slice data
WO2015108544A1 (en) 2014-01-16 2015-07-23 Hewlett-Packard Development Company, L.P. Polymeric powder composition for three-dimensional (3d) printing
US10583612B2 (en) 2014-01-16 2020-03-10 Hewlett-Packard Development Company, L.P. Three-dimensional (3D) printing method
CN106061714B (zh) 2014-01-16 2019-07-12 惠普发展公司，有限责任合伙企业 基于辐射率的温度确定
WO2015108552A1 (en) 2014-01-16 2015-07-23 Hewlett-Packard Development Company, L.P. Generating three-dimensional objects
WO2015106838A1 (en) 2014-01-16 2015-07-23 Hewlett-Packard Development Company, L.P. Generating a three-dimensional object
EP3094472B1 (en) * 2014-01-16 2020-04-01 Hewlett-Packard Development Company, L.P. Processing slice data for an additive manufacturing system
MX372915B (es) 2014-01-16 2020-04-27 Hewlett Packard Development Co Generar objetos tridimensionales.
US10889059B2 (en) 2014-01-16 2021-01-12 Hewlett-Packard Development Company, L.P. Generating three-dimensional objects
DE102014201121A1 (de) * 2014-01-22 2015-07-23 Robert Bosch Gmbh Elektronisches Funktionsbauteil und Verfahren zur Herstellung eines elektronischen Funktionsbauteils
US9818665B2 (en) 2014-02-28 2017-11-14 Infineon Technologies Ag Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces
DE102014207510B4 (de) 2014-04-17 2021-12-16 Kennametal Inc. Zerspanungswerkzeug sowie Verfahren zum Herstellen eines Zerspanungswerkzeugs
DE102014207507B4 (de) 2014-04-17 2021-12-16 Kennametal Inc. Zerspanungswerkzeug sowie Verfahren zum Herstellen eines Zerspanungswerkzeugs
US9586371B2 (en) 2014-09-02 2017-03-07 Empire Technology Development Llc Method of bonding material layers in an additive manufacturing process
PL3009233T3 (pl) * 2014-10-15 2019-05-31 Vk Invest Gmbh Narzędzie do obróbki materiału i sposób wytwarzania narzędzia
US20160304210A1 (en) * 2014-10-15 2016-10-20 Rosemount Aerospace Inc. One-piece air data probe
JP6458543B2 (ja) * 2015-02-23 2019-01-30 株式会社リコー 造形データ作成装置、プログラム、造形装置
US10507638B2 (en) * 2015-03-17 2019-12-17 Elementum 3D, Inc. Reactive additive manufacturing
US11802321B2 (en) 2015-03-17 2023-10-31 Elementum 3D, Inc. Additive manufacturing of metal alloys and metal alloy matrix composites
JP6596861B2 (ja) * 2015-03-20 2019-10-30 日本電気株式会社 積層造形構造体
DE102015006363A1 (de) * 2015-05-20 2016-12-15 Voxeljet Ag Phenolharzverfahren
DE102015108646A1 (de) * 2015-06-01 2016-12-01 Bundesrepublik Deutschland, Vertreten Durch Den Bundesminister Für Wirtschaft Und Energie, Dieser Vertreten Durch Den Präsidenten Der Bundesanstalt Für Materialforschung Und -Prüfung (Bam) Verfahren zur Herstellung keramischer Multilagen-Schaltungsträger auf Basis einer schlickerbasierten additiven Fertigung
CN107847306B (zh) * 2015-07-16 2020-10-02 3M创新有限公司 制备牙科制品的方法
DE102015214997A1 (de) 2015-08-06 2017-02-09 ALL-Impex GmbH Import/Export Verfahren zur Herstellung eines Bauteils aus keramischen Werkstoffen
JP6751251B2 (ja) * 2015-10-15 2020-09-02 セイコーエプソン株式会社 三次元造形物の製造方法及び三次元造形物の製造装置
JP2017133055A (ja) * 2016-01-26 2017-08-03 セイコーエプソン株式会社 機能素子構造体の三次元製造方法及び機能素子構造体
US10576542B2 (en) * 2016-02-03 2020-03-03 Grid Logic Incorporated System and method for manufacturing a part
US11613070B2 (en) * 2016-02-23 2023-03-28 Xerox Corporation System and method for building three-dimensional printed objects with materials having different properties
US11654627B2 (en) 2016-03-25 2023-05-23 Sprintray, Inc. System and method for three-dimensional printing
EP3389994B1 (en) 2016-04-04 2020-05-27 Hewlett-Packard Development Company, L.P. Definition of a shield feature for additive manufacture
US20170297102A1 (en) 2016-04-14 2017-10-19 Desktop Metal, Inc. Removable sinter supports
US20170305141A1 (en) * 2016-04-26 2017-10-26 Ricoh Company, Ltd. Apparatus and method for fabricating three-dimensional objects
US11465341B2 (en) 2016-04-28 2022-10-11 Hewlett-Packard Development Company, L.P. 3-dimensional printed parts
CN108603062A (zh) 2016-04-28 2018-09-28 惠普发展公司有限责任合伙企业 光致发光材料组
WO2017189306A1 (en) 2016-04-28 2017-11-02 Hewlett-Packard Development Company, L.P. 3-dimensional printing
GB201610267D0 (en) 2016-06-13 2016-07-27 Digital Metal Ab Slot die manufacturing apparatus and manufacturing method
CN109311221B (zh) 2016-07-21 2022-08-05 惠普发展公司，有限责任合伙企业 具有导电通道的以增材方式形成的3d物体
EP4342605A3 (en) 2016-08-03 2024-08-14 3Deo, Inc. Devices and methods for three-dimensional printing
US9987682B2 (en) 2016-08-03 2018-06-05 3Deo, Inc. Devices and methods for three-dimensional printing
WO2018057330A1 (en) 2016-09-12 2018-03-29 University Of Washington Vat photopolymerization additive manufacturing of multi-material parts
EP3323530A1 (en) * 2016-11-16 2018-05-23 Montfort Watches SA 3d printed watch dial
US10000011B1 (en) 2016-12-02 2018-06-19 Markforged, Inc. Supports for sintering additively manufactured parts
US10800108B2 (en) 2016-12-02 2020-10-13 Markforged, Inc. Sinterable separation material in additive manufacturing
US20180154580A1 (en) * 2016-12-02 2018-06-07 Markforged, Inc. Stress relaxation in additively manufactured parts
CA3040921C (en) 2016-12-06 2024-02-20 Markforged, Inc. Additive manufacturing with heat-flexed material feeding
EP3338915A1 (de) * 2016-12-22 2018-06-27 HILTI Aktiengesellschaft Verfahren zur schichtweisen fertigung eines grünlings aus pulver- oder pastenförmigem werkstoff mit definiert angeordneten schneidelementen
EP3338916A1 (de) * 2016-12-22 2018-06-27 HILTI Aktiengesellschaft Verfahren zur schichtweisen fertigung eines bauteils aus pulverförmigem werkstoff
EP3338917A1 (de) * 2016-12-22 2018-06-27 HILTI Aktiengesellschaft Verfahren zur schichtweisen fertigung eines grünlings aus pulverförmigem werkstoff mit definiert angeordneten einsatzelementen
EP3592562B1 (en) * 2017-03-06 2024-10-16 Katholieke Universiteit Leuven 3d printing of porous liquid handling device
US11396129B2 (en) * 2017-04-18 2022-07-26 Hewlett-Packard Development Company, L.P. Increasing electrical conductivity at selected locations of a 3D object
CN110520280B (zh) * 2017-04-26 2021-10-29 惠普发展公司，有限责任合伙企业 打印导电元件
KR102356699B1 (ko) * 2017-04-28 2022-01-27 한국전자통신연구원 3d 프린팅을 이용한 센서 제작 방법 및 그 3d 프린터
WO2018210803A1 (en) 2017-05-15 2018-11-22 Analog Devices Global Unlimited Company Integrated ion sensing apparatus and methods
FR3070134B1 (fr) * 2017-08-18 2019-08-16 S.A.S 3Dceram-Sinto Procede et machine de fabrication d'au moins une piece en au moins un materiau ceramique et/ou metallique par la technique des procedes additifs
FR3070135B1 (fr) * 2017-08-18 2019-08-16 S.A.S 3Dceram-Sinto Procede et machine de fabrication de pieces en materiau ceramique ou metallique par la technique des procedes additifs
US20190061234A1 (en) * 2017-08-28 2019-02-28 Harris Corporation Method for making a metal isolator body and associated device including the same
US20190082560A1 (en) * 2017-09-08 2019-03-14 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and methods for additive manufacturing of wick structure for vapor chamber
WO2019083531A1 (en) * 2017-10-25 2019-05-02 Hewlett-Packard Development Company, L.P. THERMAL SUPPORTS FOR 3D ELEMENTS FORMED FROM PARTICLES
DE102017127315A1 (de) * 2017-11-20 2018-03-08 Agilent Technologies, Inc. (N.D.Ges.D. Staates Delaware) Herstellung eines mikrofluidischen Bauteils mittels additiver Fertigung
WO2019226815A1 (en) * 2018-05-22 2019-11-28 Markforged, Inc. Sinterable separation material in additive manufacturing
US20210354395A1 (en) * 2018-07-31 2021-11-18 Hewlett-Packard Development Company, L.P. Thermal supports for formation of 3d object portions
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
US20210205887A1 (en) * 2018-09-26 2021-07-08 Hewlett-Packard Development Company, L.P. Three dimensional (3d) printed molds having breakaway features
DE102019102913A1 (de) * 2019-02-06 2020-08-06 Hochschule Offenburg Verfahren zur Herstellung eines Roboterelements, insbesondere eines Greifers, mittels 3D-Druck
EP3962715A4 (en) * 2019-04-29 2022-12-07 Hewlett-Packard Development Company, L.P. Three-dimensional printing conductive elements
JP7346917B2 (ja) * 2019-06-04 2023-09-20 セイコーエプソン株式会社 三次元造形物の製造方法
US11587839B2 (en) 2019-06-27 2023-02-21 Analog Devices, Inc. Device with chemical reaction chamber
FR3099491B1 (fr) 2019-08-02 2022-01-14 Aml Finances Procédé de dépôt d’un métal conducteur électrique sur au moins une partie de la surface interne d’une cavité interne d’un guide d’ondes
US12474290B2 (en) 2019-11-20 2025-11-18 Analog Devices International Unlimited Company Electrochemical device
US20220032585A1 (en) * 2020-07-28 2022-02-03 Ge Aviation Systems Llc Insulated ferromagnetic laminates and method of manufacturing
JP2024509814A (ja) 2021-03-05 2024-03-05 サンーゴバン アブレイシブズ，インコーポレイティド 研磨物品及びそれを形成するための方法
KR102568142B1 (ko) * 2021-03-09 2023-08-22 (주)쓰리디머티리얼즈 우레아 반응 기반 3d 프린팅용 잉크 조성물 및 이를 이용한 3d 프린팅 방법
EP4457057A1 (en) 2021-12-30 2024-11-06 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for forming same
US12296434B2 (en) 2021-12-30 2025-05-13 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for forming same
DE102024115204A1 (de) * 2024-03-07 2025-09-11 Tdk Electronics Ag Additives Fertigungsverfahren, Verfahren zur Konzeption eines Bauteils und Bauteil

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5387380A (en) * 1989-12-08 1995-02-07 Massachusetts Institute Of Technology Three-dimensional printing techniques
US5204055A (en) * 1989-12-08 1993-04-20 Massachusetts Institute Of Technology Three-dimensional printing techniques
US6146567A (en) 1993-02-18 2000-11-14 Massachusetts Institute Of Technology Three dimensional printing methods
WO1998056566A1 (en) * 1997-06-13 1998-12-17 Massachusetts Institute Of Technology Jetting layers of powder and the formation of fine powder beds thereby
US6363606B1 (en) * 1998-10-16 2002-04-02 Agere Systems Guardian Corp. Process for forming integrated structures using three dimensional printing techniques
SE523394C2 (sv) 2001-12-13 2004-04-13 Fcubic Ab Anordning och förfarande för upptäckt och kompensering av fel vid skiktvis framställning av en produkt
US20040169699A1 (en) * 2003-02-28 2004-09-02 Hunter Shawn D. Methods and systems for producing an object through solid freeform fabrication using immiscible fluids
JP2005007572A (ja) * 2003-04-22 2005-01-13 Fuji Photo Film Co Ltd 三次元造形物の製造方法
US7389154B2 (en) 2004-09-29 2008-06-17 Hewlett-Packard Development Company, L.P. Fabricating a three-dimensional object
JP4888236B2 (ja) * 2007-06-08 2012-02-29 セイコーエプソン株式会社 三次元造形装置、および三次元造形方法
JP2009006538A (ja) * 2007-06-27 2009-01-15 Seiko Epson Corp 三次元造形装置、および三次元造形方法
EP2151214B1 (de) * 2008-07-30 2013-01-23 Ivoclar Vivadent AG Lichthärtende Schlicker für die stereolithographische Herstellung von Dentalkeramiken
JP2010274480A (ja) * 2009-05-27 2010-12-09 Sony Corp 三次元構造体の製造方法
JP2011245713A (ja) * 2010-05-26 2011-12-08 Seiko Epson Corp 造形方法
JP5621400B2 (ja) * 2010-08-17 2014-11-12 セイコーエプソン株式会社 造形方法

Similar Documents

Publication Publication Date Title
JP2014529523A5 (enExample)
JP5985641B2 (ja) 多材料から構成される自由造形可能な微細部品の積層造形法
KR102315603B1 (ko) 소결체, 그 제조 방법, 및 정전 척
JP5498384B2 (ja) 気流発生装置およびその製造方法
CN108348998B (zh) 附加制造方法和设备
Li et al. Direct ink writing of 3–3 piezoelectric composite
CN104302713B (zh) 喷墨用墨水、印刷方法及陶瓷电子部件的制造方法
CN107073820A (zh) 用于控制三维打印制品的空腔在热处理期间的翘曲的方法
JP5261817B2 (ja) 表面に微細凹凸パターンを有したセラミックス焼成体及びその製造方法
JP6766717B2 (ja) 放熱シート
CN104649678B (zh) 在陶瓷材料表面形成导电几何结构的方法以及陶瓷基超材料
JP2006131429A5 (enExample)
Zhao et al. Transfer and control of the orientation of 3D nanostructures fabricated by nanoskiving
JP2015074573A (ja) 焼成用さや及び電子部品の製造方法
Bonnas et al. Electrophoretic deposition for fabrication of ceramic microparts
JP6608595B2 (ja) トンネル付きセラミック部材の製造方法
Seils et al. Free‐Standing Patterned Ceramic Structures Obtained by Soft Micromolding
JP2009004752A5 (enExample)
Gomez Advancements In Polymer Synthesis And Ceramic Additive Manufacturing For Energy Applications
Kim et al. Material-specific three-dimensional printing of electrostatic chuck components via digital light processing: Integration of Al2O3 and BaTiO3 as dual materials for performance optimization
JPWO2014168140A1 (ja) Ｅｓｄ保護装置及びその製造方法
CN202369385U (zh) 纳米线、纳米线手术扩张架及由编织的纳米线构成的薄片
Dormal et al. SINTERING OF CERAMIC PORCELAIN POWDERS
JP2016219742A (ja) プラズマ処理装置用プレートおよびプラズマ処理装置