US20190061234A1 - Method for making a metal isolator body and associated device including the same - Google Patents

Method for making a metal isolator body and associated device including the same Download PDF

Info

Publication number
US20190061234A1
US20190061234A1 US15/687,816 US201715687816A US2019061234A1 US 20190061234 A1 US20190061234 A1 US 20190061234A1 US 201715687816 A US201715687816 A US 201715687816A US 2019061234 A1 US2019061234 A1 US 2019061234A1
Authority
US
United States
Prior art keywords
metal
isolator body
metal isolator
generating
sensitive component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/687,816
Inventor
Brian C. Strom
Christopher A. Corey
Timothy F. McLellan
Casey L. FENDER
Murray T. Hann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Priority to US15/687,816 priority Critical patent/US20190061234A1/en
Assigned to HARRIS CORPORATION reassignment HARRIS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STROM, BRIAN C., HANN, MURRAY T., FENDER, CASEY L., MCLELLAN, TIMOTHY F., COREY, CHRISTOPHER A.
Priority to TW107120444A priority patent/TWI781182B/en
Priority to KR1020180072777A priority patent/KR102469989B1/en
Publication of US20190061234A1 publication Critical patent/US20190061234A1/en
Priority to US17/656,675 priority patent/US20220212400A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present invention relates to the field of thermal isolators, and more particularly, to a method of making a thermally isolated body out of a thermally conductive metal and corresponding device including the same.
  • Thermal isolators are used to isolate heat sources from heat sensitive components. For example, space systems in general experience extreme changes in temperature when orbiting the earth. Extreme temperature changes can have adverse effects on heat sensitive components within the space systems. Thermal isolators block or slow the flow of heat from the heat sources to the heat sensitive components.
  • Design engineers take into account the operating temperature of the heat sensitive components when selecting the type of material to be used as a thermal isolator.
  • Low thermal conductivity materials such as thermoplastics and ceramics are typically used as thermal isolators.
  • thermal isolators are often in contact with metal assemblies that make up the rest of the system. These metal assemblies include the heat sensitive components and the heat sources. Even though thermoplastics and ceramics are good thermal isolators, they have mechanical properties that are different than the metal assemblies.
  • thermoplastic When thermoplastic is introduced into a metal assembly as a thermal isolator, it begins to soften at high temperatures. When the high temperatures approach 200° C. the thermoplastic starts to break down. In contrast, ceramic can withstand a higher temperature limit above 200° C. but is much stiffer and more brittle than the surrounding metal components.
  • Design engineers may have to compromise system parameters of the metal assemblies, such as stiffness or operating temperature, to isolate heat sensitive components. Operating temperatures of the metal assemblies may be curtailed by thermoplastic limitations, whereas reliability of the metal assemblies may be reduced by ceramic durability limitations.
  • a metal such as titanium may be used as a thermal isolator because it has a lower conductivity than other metals typically found in aerospace assemblies. Even though titanium maintains the structural integrity of the metal assembly, there is a coefficient of thermal expansion (CTE) mismatch with the metal assembly. Consequently, there may be a need for a thermal isolator for a metal assembly for isolating a heat sensitive component from a heat source without compromising system parameters.
  • CTE coefficient of thermal expansion
  • a method for making a metal isolator body to be positioned between a heat sensitive component and a heat source includes obtaining at least a thermal conductivity specification and a load specification for the metal isolator body, generating a metal isolator body design including solid regions and lattice regions to meet at least the thermal conductivity specification and the load specification, and using three dimensional (3D) metal printing to form the metal isolator body based upon the metal isolator body design.
  • the 3D metal printing advantageously allows a thermal isolator to be formed out of a thermally conductive metal by being able to print the lattice regions that are used to tailor the thermal properties of the metal isolator body to meet the thermal conductivity specification.
  • the ability to create a thermal isolator out of metal means that design engineers may no longer have to compromise system parameters, such as stiffness or operating temperature, to isolate heat sensitive components.
  • the method may further comprise obtaining a coefficient of thermal expansion (CTE) specification for the metal isolator body, and generating the metal isolator body design including solid regions and lattice regions to also meet the CTE specification.
  • CTE coefficient of thermal expansion
  • the metal isolator body may thus comprise a same metal as at least one of the heat source and the heat sensitive component.
  • the metal isolator body may comprise a cold face to be positioned adjacent the heat sensitive component, and a hot face to be positioned adjacent the heat source.
  • the metal isolator body may have at least one fastener receiving passageway extending between the cold face and the hot face.
  • Generating the metal isolator body design may comprise generating the metal isolator body design so that the metal isolator body has a thermal conductivity less than one tenth a thermal conductivity of a hypothetical solid metal body having a same outer shape as the metal isolator body.
  • Another aspect is directed to a method for isolating a heat sensitive component from a heat source comprising generating a metal isolator body design including solid regions and lattice regions to meet at least a thermal conductivity specification and a load specification, using three dimensional (3D) metal printing to form the metal isolator body based upon the metal isolator body design, and positioning the metal isolator body between the heat sensitive component and the heat source.
  • a method for isolating a heat sensitive component from a heat source comprising generating a metal isolator body design including solid regions and lattice regions to meet at least a thermal conductivity specification and a load specification, using three dimensional (3D) metal printing to form the metal isolator body based upon the metal isolator body design, and positioning the metal isolator body between the heat sensitive component and the heat source.
  • 3D three dimensional
  • Yet another aspect is directed to a device comprising a housing with a heat sensitive component, a thermal isolator coupled to the housing and comprising a metal isolator body including solid regions and lattice regions to meet at least a thermal conductivity specification and a load specification, and a heat source coupled to the thermal isolator.
  • FIG. 1 is a block diagram of a metal assembly with a metal isolator body positioned between a heat sensitive component and a heat source according to the invention.
  • FIG. 2 is a flowchart illustrating a method for making the metal isolator body illustrated in FIG. 1 .
  • FIG. 3 is an upper perspective view of the metal isolator body illustrated in FIG. 1 .
  • FIG. 4 is a lower perspective view of the metal isolator body illustrated in FIG. I.
  • FIG. 5 is a close-up partial view of the lattice regions in the metal isolator body illustrated in FIGS. 4 and 5 .
  • FIG. 6 is a flowchart illustrating a method for isolating the heat sensitive component from the heat source illustrated in FIG. 1 .
  • the metal assembly 40 includes a heat sensitive component 42 and a heat source 46 , and the metal isolator body 50 is to be positioned therebetween.
  • the metal assembly 40 is not limited to any particular system or setup.
  • the metal assembly 40 may be part of a satellite where the heat sensitive component 42 is a processor within a transceiver card carried by a metal housing 41 , and the heat source 46 is the skin of the satellite. As the skin of the satellite is exposed to sunlight, the skin becomes the heat source 46 .
  • the metal housing 41 is in contact with the thermal isolator 50 which is in contact with the skin of the satellite, i.e., the heat source 46 .
  • the method includes, from the start (Block 22 ), obtaining at least a thermal conductivity specification and a load specification for the metal isolator body 50 at Block 24 , and generating a metal isolator body design at Block 26 .
  • the metal isolator body design includes solid regions 52 and lattice regions 54 to meet at least the thermal conductivity specification and the load specification.
  • Three dimensional (3D) metal printing is used at Block 28 to form the metal isolator body 50 based upon the metal isolator body design.
  • the method ends at Block 30 .
  • the 3D metal printing advantageously allows a thermal isolator to be formed out of a thermally conductive metal by being able to print the lattice regions 52 that are used to tailor the thermal properties of the metal isolator body 50 to meet the thermal conductivity specification.
  • the method may further include obtaining a coefficient of thermal expansion (CTE) specification for the metal isolator body 50 .
  • CTE coefficient of thermal expansion
  • the metal isolator body 50 may thus be formed from a same metal as at least one of the heat source 46 and the heat sensitive component 42 .
  • the ability to create a thermal isolator out of the same metal that may be used to form the rest of the metal assembly 40 means that design engineers may no longer have to compromise system parameters, such as stiffness or operating temperature, to isolate heat sensitive components 42 .
  • the illustrated metal isolator body 50 is designed to meet a thermal conductivity specification and a load specification.
  • the solid regions 52 allow the metal isolator body 50 to meet the load specification, while the lattice regions 54 provide strength but also allow the metal isolator body 50 to meet the thermal conductivity specification.
  • the metal isolator body 50 may have other sizes or shapes as will be appreciated by those skilled in the art.
  • the orientation and positioning of the solid and lattice regions 52 , 54 will be based on the predetermined thermal conductivity and load specifications supporting the intended application of the metal isolator body 50 .
  • the metal isolator body 50 includes a cold face 62 to be positioned adjacent the heat sensitive component 42 , and a hot face 66 to be positioned adjacent the heat source 46 .
  • the solid regions 52 correspond to fastener receiving passageways 60 extending between the cold face 62 and the hot face 66 , where a continuous solid region 52 surrounds each fastener receiving passageway 60 .
  • the lattice regions 54 are exposed on an outer surface of the metal isolator body 50 to permit airflow therethrough.
  • the lattice regions 54 include metal lines or sections 70 coupled together with square or diamond-shaped spaces 72 left between, as best illustrated in FIG. 5 .
  • the square or diamond-shaped spaces 72 advantageously may define an overwhelming majority of the volume of the metal isolator body 50 .
  • the conductivity of air is several orders of magnitude lower than that of most metals which allows the metal isolator body 50 to function as a thermal isolator.
  • the metal isolator body 50 may also be used in a vacuum environment, such as in space.
  • the 3D printing allows geometries such as the lattice regions 54 to be obtained.
  • a powder bed fusion (PDF) process may be used for 3D printing.
  • Powder bed fusion includes the following commonly used printing techniques: direct metal laser sintering (DMLS), electron beam melting (EBM), selective heat sintering (SHS), selective laser melting (SLM) and selective laser sintering (SLS).
  • DMLS direct metal laser sintering
  • EBM electron beam melting
  • SHS selective heat sintering
  • SLM selective laser melting
  • SLS selective laser sintering
  • PPF powder bed fusion
  • thermal conductivity is the property of a body to conduct heat. Heat transfer occurs at a lower rate across a body of lower thermal conductivity than across a body of higher thermal conductivity.
  • the illustrated metal isolator body 50 may have a have a thermal conductivity less than one tenth a thermal conductivity of a hypothetical solid metal body having a same outer shape as the metal isolator body.
  • the method includes, from the start (Block 102 ), generating a metal isolator body design including solid regions 54 and lattice regions 52 to meet at least a thermal conductivity specification and a load specification at Block 104 .
  • Three dimensional (3D) metal printing is used at Block 106 to form the metal isolator body 50 based upon the metal isolator body design.
  • the method further includes positioning the metal isolator body 50 between the heat sensitive component 42 and the heat source 46 at Block 108 .
  • the method ends at Block 110 .
  • Yet another aspect is directed to a device 40 comprising a housing 41 with a heat sensitive component 42 , and a thermal isolator coupled to the housing and comprising a metal isolator body 50 including solid regions 52 and lattice regions 54 to meet at least a thermal conductivity specification and a load specification.
  • a heat source 46 is coupled to the thermal isolator.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermal Insulation (AREA)
  • Laminated Bodies (AREA)

Abstract

A method for making a metal isolator body to be positioned between a heat sensitive component and a heat source includes obtaining at least a thermal conductivity specification and a load specification for the metal isolator body, and generating a metal isolator body design including solid regions and lattice regions to meet at least the thermal conductivity specification and the load specification. Three dimensional (3D) metal printing is used to form the metal isolator body based upon the metal isolator body design.

Description

    GOVERNMENT RIGHTS
  • This invention was made with government support under classified government contract. The government has certain rights in the invention.
    • TECHNICAL FIELD
  • The present invention relates to the field of thermal isolators, and more particularly, to a method of making a thermally isolated body out of a thermally conductive metal and corresponding device including the same.
    • BACKGROUND
  • Thermal isolators are used to isolate heat sources from heat sensitive components. For example, space systems in general experience extreme changes in temperature when orbiting the earth. Extreme temperature changes can have adverse effects on heat sensitive components within the space systems. Thermal isolators block or slow the flow of heat from the heat sources to the heat sensitive components.
  • Design engineers take into account the operating temperature of the heat sensitive components when selecting the type of material to be used as a thermal isolator. Low thermal conductivity materials such as thermoplastics and ceramics are typically used as thermal isolators.
  • A problem for design engineers is that thermal isolators are often in contact with metal assemblies that make up the rest of the system. These metal assemblies include the heat sensitive components and the heat sources. Even though thermoplastics and ceramics are good thermal isolators, they have mechanical properties that are different than the metal assemblies.
  • When thermoplastic is introduced into a metal assembly as a thermal isolator, it begins to soften at high temperatures. When the high temperatures approach 200° C. the thermoplastic starts to break down. In contrast, ceramic can withstand a higher temperature limit above 200° C. but is much stiffer and more brittle than the surrounding metal components.
  • Design engineers may have to compromise system parameters of the metal assemblies, such as stiffness or operating temperature, to isolate heat sensitive components. Operating temperatures of the metal assemblies may be curtailed by thermoplastic limitations, whereas reliability of the metal assemblies may be reduced by ceramic durability limitations.
  • As an alternative to thermoplastics and ceramics, a metal such as titanium may be used as a thermal isolator because it has a lower conductivity than other metals typically found in aerospace assemblies. Even though titanium maintains the structural integrity of the metal assembly, there is a coefficient of thermal expansion (CTE) mismatch with the metal assembly. Consequently, there may be a need for a thermal isolator for a metal assembly for isolating a heat sensitive component from a heat source without compromising system parameters.
    • SUMMARY
  • A method for making a metal isolator body to be positioned between a heat sensitive component and a heat source includes obtaining at least a thermal conductivity specification and a load specification for the metal isolator body, generating a metal isolator body design including solid regions and lattice regions to meet at least the thermal conductivity specification and the load specification, and using three dimensional (3D) metal printing to form the metal isolator body based upon the metal isolator body design.
  • The 3D metal printing advantageously allows a thermal isolator to be formed out of a thermally conductive metal by being able to print the lattice regions that are used to tailor the thermal properties of the metal isolator body to meet the thermal conductivity specification. The ability to create a thermal isolator out of metal means that design engineers may no longer have to compromise system parameters, such as stiffness or operating temperature, to isolate heat sensitive components.
  • The method may further comprise obtaining a coefficient of thermal expansion (CTE) specification for the metal isolator body, and generating the metal isolator body design including solid regions and lattice regions to also meet the CTE specification. The metal isolator body may thus comprise a same metal as at least one of the heat source and the heat sensitive component.
  • The metal isolator body may comprise a cold face to be positioned adjacent the heat sensitive component, and a hot face to be positioned adjacent the heat source. The metal isolator body may have at least one fastener receiving passageway extending between the cold face and the hot face.
  • Generating the metal isolator body design may comprise forming a continuous solid region surrounding the at least one fastener receiving passageway. Generating the metal isolator body design may comprise generating the metal isolator body design to include lattice regions exposed on an outer surface of the metal isolator body to permit airflow therethrough.
  • Generating the metal isolator body design may comprise generating the metal isolator body design so that the metal isolator body has a thermal conductivity less than one tenth a thermal conductivity of a hypothetical solid metal body having a same outer shape as the metal isolator body.
  • Another aspect is directed to a method for isolating a heat sensitive component from a heat source comprising generating a metal isolator body design including solid regions and lattice regions to meet at least a thermal conductivity specification and a load specification, using three dimensional (3D) metal printing to form the metal isolator body based upon the metal isolator body design, and positioning the metal isolator body between the heat sensitive component and the heat source.
  • Yet another aspect is directed to a device comprising a housing with a heat sensitive component, a thermal isolator coupled to the housing and comprising a metal isolator body including solid regions and lattice regions to meet at least a thermal conductivity specification and a load specification, and a heat source coupled to the thermal isolator.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a block diagram of a metal assembly with a metal isolator body positioned between a heat sensitive component and a heat source according to the invention.
  • FIG. 2 is a flowchart illustrating a method for making the metal isolator body illustrated in FIG. 1.
  • FIG. 3 is an upper perspective view of the metal isolator body illustrated in FIG. 1.
  • FIG. 4 is a lower perspective view of the metal isolator body illustrated in FIG. I.
  • FIG. 5 is a close-up partial view of the lattice regions in the metal isolator body illustrated in FIGS. 4 and 5.
  • FIG. 6 is a flowchart illustrating a method for isolating the heat sensitive component from the heat source illustrated in FIG. 1.
    •  DETAILED DESCRIPTION
  • The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the disclosure are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
  • Referring initially to FIGS. 1 and 2, a method for making a metal isolator body 50 for a metal assembly 40 will be discussed. The metal assembly 40 includes a heat sensitive component 42 and a heat source 46, and the metal isolator body 50 is to be positioned therebetween.
  • The metal assembly 40 is not limited to any particular system or setup. As an example, the metal assembly 40 may be part of a satellite where the heat sensitive component 42 is a processor within a transceiver card carried by a metal housing 41, and the heat source 46 is the skin of the satellite. As the skin of the satellite is exposed to sunlight, the skin becomes the heat source 46. The metal housing 41 is in contact with the thermal isolator 50 which is in contact with the skin of the satellite, i.e., the heat source 46.
  • In the illustrated flowchart 20, the method includes, from the start (Block 22), obtaining at least a thermal conductivity specification and a load specification for the metal isolator body 50 at Block 24, and generating a metal isolator body design at Block 26. The metal isolator body design includes solid regions 52 and lattice regions 54 to meet at least the thermal conductivity specification and the load specification. Three dimensional (3D) metal printing is used at Block 28 to form the metal isolator body 50 based upon the metal isolator body design. The method ends at Block 30.
  • The 3D metal printing advantageously allows a thermal isolator to be formed out of a thermally conductive metal by being able to print the lattice regions 52 that are used to tailor the thermal properties of the metal isolator body 50 to meet the thermal conductivity specification.
  • In addition to designing the metal isolator body 50 to meet a thermal conductivity specification and a load specification, the method may further include obtaining a coefficient of thermal expansion (CTE) specification for the metal isolator body 50. The metal isolator body design is generated to also meet the CTE specification.
  • The metal isolator body 50 may thus be formed from a same metal as at least one of the heat source 46 and the heat sensitive component 42. The ability to create a thermal isolator out of the same metal that may be used to form the rest of the metal assembly 40 means that design engineers may no longer have to compromise system parameters, such as stiffness or operating temperature, to isolate heat sensitive components 42.
  • An example metal isolator body 50 will now be discussed in reference to FIGS. 3-5. The illustrated metal isolator body 50 is designed to meet a thermal conductivity specification and a load specification. The solid regions 52 allow the metal isolator body 50 to meet the load specification, while the lattice regions 54 provide strength but also allow the metal isolator body 50 to meet the thermal conductivity specification. The metal isolator body 50 may have other sizes or shapes as will be appreciated by those skilled in the art. The orientation and positioning of the solid and lattice regions 52, 54 will be based on the predetermined thermal conductivity and load specifications supporting the intended application of the metal isolator body 50.
  • The metal isolator body 50 includes a cold face 62 to be positioned adjacent the heat sensitive component 42, and a hot face 66 to be positioned adjacent the heat source 46. The solid regions 52 correspond to fastener receiving passageways 60 extending between the cold face 62 and the hot face 66, where a continuous solid region 52 surrounds each fastener receiving passageway 60.
  • The lattice regions 54 are exposed on an outer surface of the metal isolator body 50 to permit airflow therethrough. The lattice regions 54 include metal lines or sections 70 coupled together with square or diamond-shaped spaces 72 left between, as best illustrated in FIG. 5. The square or diamond-shaped spaces 72 advantageously may define an overwhelming majority of the volume of the metal isolator body 50. The conductivity of air is several orders of magnitude lower than that of most metals which allows the metal isolator body 50 to function as a thermal isolator. Of course, the metal isolator body 50 may also be used in a vacuum environment, such as in space. The 3D printing allows geometries such as the lattice regions 54 to be obtained. Without 3D printing, forming lattice regions in a metal isolator body may be extremely difficult. A powder bed fusion (PDF) process may be used for 3D printing. Powder bed fusion includes the following commonly used printing techniques: direct metal laser sintering (DMLS), electron beam melting (EBM), selective heat sintering (SHS), selective laser melting (SLM) and selective laser sintering (SLS). The powder bed fusion (PBF) methods use either a laser or electron beam to melt and fuse material powder together. Of course, other 3D printing techniques may be used, as readily appreciated by those skilled in the art.
  • As readily understood by those skilled in the art, thermal conductivity is the property of a body to conduct heat. Heat transfer occurs at a lower rate across a body of lower thermal conductivity than across a body of higher thermal conductivity. For comparison purposes, the illustrated metal isolator body 50 may have a have a thermal conductivity less than one tenth a thermal conductivity of a hypothetical solid metal body having a same outer shape as the metal isolator body.
  • Another aspect is directed to a method for isolating the heat sensitive component 42 from the heat source 46. Referring now to the flowchart 100 illustrated in FIG. 6, the method includes, from the start (Block 102), generating a metal isolator body design including solid regions 54 and lattice regions 52 to meet at least a thermal conductivity specification and a load specification at Block 104. Three dimensional (3D) metal printing is used at Block 106 to form the metal isolator body 50 based upon the metal isolator body design. The method further includes positioning the metal isolator body 50 between the heat sensitive component 42 and the heat source 46 at Block 108. The method ends at Block 110.
  • Yet another aspect is directed to a device 40 comprising a housing 41 with a heat sensitive component 42, and a thermal isolator coupled to the housing and comprising a metal isolator body 50 including solid regions 52 and lattice regions 54 to meet at least a thermal conductivity specification and a load specification. A heat source 46 is coupled to the thermal isolator.
  • Many modifications and other embodiments of the invention will come to the mind of one skilled in the art having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is understood that the invention is not to be limited to the specific embodiments disclosed, and that modifications and embodiments are intended to be included within the scope of the appended claims.

Claims (24)

That which is claimed is:
1. A method for making a metal isolator body to be positioned between a heat sensitive component and a heat source comprising:
obtaining at least a thermal conductivity specification and a load specification for the metal isolator body;
generating a metal isolator body design including solid regions and lattice regions to meet at least the thermal conductivity specification and the load specification; and
using three dimensional (3D) metal printing to form the metal isolator body based upon the metal isolator body design.
2. The method according to claim 1 further comprising:
obtaining a coefficient of thermal expansion (CTE) specification for the metal isolator body; and
generating the metal isolator body design including solid regions and lattice regions to also meet the CTE specification.
3. The method according to claim 1 wherein the metal isolator body comprises a cold face to be positioned adjacent the heat sensitive component, and a hot face to be positioned adjacent the heat source.
4. The method according to claim 3 wherein the metal isolator body has at least one fastener receiving passageway extending between the cold face and the hot face.
5. The method according to claim 4 wherein generating the metal isolator body design comprises forming a continuous solid region surrounding the at least one fastener receiving passageway.
6. The method according to claim 1 wherein generating the metal isolator body design comprises generating the metal isolator body design to include lattice regions exposed on an outer surface of the metal isolator body to permit airflow therethrough.
7. The method according to claim 1 generating the metal isolator body design comprises generating the metal isolator body design so that the metal isolator body has a thermal conductivity less than one tenth a thermal conductivity of a hypothetical solid metal body having a same outer shape as the metal isolator body.
8. The method according to claim 1 wherein the metal isolator body comprises a same metal as at least one of the heat source and the heat sensitive component.
9. The method according to claim 1 wherein using 3D printing comprises direct laser metal sintering (DMLS).
10. A method for isolating a heat sensitive component from a heat source comprising:
generating a metal isolator body design including solid regions and lattice regions to meet at least a thermal conductivity specification and a load specification;
using three dimensional (3D) metal printing to form the metal isolator body based upon the metal isolator body design; and
positioning the metal isolator body between the heat sensitive component and the heat source.
11. The method according to claim 10 further comprising:
obtaining a coefficient of thermal expansion (CTE) specification for the metal isolator body; and
generating the metal isolator body design including solid regions and lattice regions to also meet the CTE specification.
12. The method according to claim 10 wherein the metal isolator body comprises a cold face to be positioned adjacent the heat sensitive component, and a hot face to be positioned adjacent the heat source.
13. The method according to claim 12 wherein the metal isolator body has at least one fastener receiving passageway extending between the cold face and the hot face.
14. The method according to claim 13 wherein generating the metal isolator body design comprises forming a continuous solid region surrounding the at least one fastener receiving passageway.
15. The method according to claim 10 wherein generating the metal isolator body design comprises generating the metal isolator body design to include lattice regions exposed on an outer surface of the metal isolator body to permit airflow therethrough.
16. The method according to claim 10 generating the metal isolator body design comprises generating the metal isolator body design so that the metal isolator body has a thermal conductivity less than one tenth a thermal conductivity of a hypothetical solid metal body having a same outer shape as the metal isolator body.
17. The method according to claim 10 wherein the metal isolator body comprises a same metal as at least one of the heat source and the heat sensitive component.
18. The method according to claim 10 wherein using 3D printing comprises direct laser metal sintering (DMLS).
19. A device comprising:
a heat sensitive component;
a thermal isolator coupled to said heat sensitive component and comprising a metal isolator body including solid regions and lattice regions meeting at least a thermal conductivity specification and a load specification; and
a heat source coupled to said thermal isolator.
20. The device according to claim 19 wherein said metal isolator body comprises a cold face to be coupled to said heat sensitive component, and a hot face to be coupled to said heat source.
21. The device according to claim 20 wherein said metal isolator body has at least one fastener receiving passageway extending between the cold face and the hot face.
22. The device according to claim 21 wherein said metal isolator body further comprises a continuous solid region surrounding the at least one fastener receiving passageway.
23. The device according to claim 19 wherein said lattice regions are exposed on an outer surface of said metal isolator body to permit airflow therethrough.
24. The device according to claim 19 wherein said metal isolator body comprises a same metal as at least one of said heat source and said heat sensitive component.
US15/687,816 2017-08-28 2017-08-28 Method for making a metal isolator body and associated device including the same Abandoned US20190061234A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US15/687,816 US20190061234A1 (en) 2017-08-28 2017-08-28 Method for making a metal isolator body and associated device including the same
TW107120444A TWI781182B (en) 2017-08-28 2018-06-14 Method for making a metal isolator body and a heat sensitive component
KR1020180072777A KR102469989B1 (en) 2017-08-28 2018-06-25 Method for making a metal isolator body and associated device including the same
US17/656,675 US20220212400A1 (en) 2017-08-28 2022-03-28 Method for making a metal isolator body and associated device including the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/687,816 US20190061234A1 (en) 2017-08-28 2017-08-28 Method for making a metal isolator body and associated device including the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US17/656,675 Division US20220212400A1 (en) 2017-08-28 2022-03-28 Method for making a metal isolator body and associated device including the same

Publications (1)

Publication Number Publication Date
US20190061234A1 true US20190061234A1 (en) 2019-02-28

Family

ID=65436344

Family Applications (2)

Application Number Title Priority Date Filing Date
US15/687,816 Abandoned US20190061234A1 (en) 2017-08-28 2017-08-28 Method for making a metal isolator body and associated device including the same
US17/656,675 Pending US20220212400A1 (en) 2017-08-28 2022-03-28 Method for making a metal isolator body and associated device including the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
US17/656,675 Pending US20220212400A1 (en) 2017-08-28 2022-03-28 Method for making a metal isolator body and associated device including the same

Country Status (3)

Country Link
US (2) US20190061234A1 (en)
KR (1) KR102469989B1 (en)
TW (1) TWI781182B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11554977B2 (en) 2017-08-09 2023-01-17 Harris Corporation Method for making an optical fiber device from a 3D printed preform body and related structures

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6730998B1 (en) 2000-02-10 2004-05-04 Micron Technology, Inc. Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same
DE102006039756A1 (en) * 2006-08-24 2008-02-28 Elringklinger Ag Shielding component, in particular heat shield
SE536670C2 (en) * 2011-08-26 2014-05-13 Digital Metal Ab Layer-based manufacture of free-form micro-components of multimaterial
DE102011115314B4 (en) * 2011-09-29 2019-04-25 Osram Opto Semiconductors Gmbh LED module
US9599274B2 (en) * 2012-12-31 2017-03-21 Raytheon Company Multi-stage thermal isolator for focal plane arrays and other devices
JP6338960B2 (en) * 2014-07-29 2018-06-06 株式会社東芝 Insulating spacer for gas insulated switchgear and method for manufacturing the same
JP6338962B2 (en) 2014-07-31 2018-06-06 株式会社東芝 Three-dimensional modeling apparatus and insulating rod
JP6640505B2 (en) 2015-09-14 2020-02-05 株式会社東芝 Gas insulation equipment, insulation spacers and three-dimensional objects
CN105667837A (en) * 2015-09-15 2016-06-15 大连理工大学 Pyramid micro-truss laminboard type bearing and thermal protection integrated structure containing runners
CN108473302B (en) 2016-01-28 2023-06-02 时立方股份有限公司 Thermal insulation platform system and method
CN106180720B (en) * 2016-07-07 2017-12-05 四川三阳激光增材制造技术有限公司 It is a kind of that there is the metalwork laser gain material preparation method for optimizing netted inner structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11554977B2 (en) 2017-08-09 2023-01-17 Harris Corporation Method for making an optical fiber device from a 3D printed preform body and related structures

Also Published As

Publication number Publication date
KR102469989B1 (en) 2022-11-22
TWI781182B (en) 2022-10-21
TW201912373A (en) 2019-04-01
KR20190024642A (en) 2019-03-08
US20220212400A1 (en) 2022-07-07

Similar Documents

Publication Publication Date Title
US20220212400A1 (en) Method for making a metal isolator body and associated device including the same
EP3086011B1 (en) Double-walled pipe with integrated heating capability for an aircraft or spacecraft
Dai et al. Distortion minimization of laser‐processed components through control of laser scanning patterns
Romano et al. Laser additive melting and solidification of Inconel 718: Finite element simulation and experiment
Chen et al. Two-dimensional implicit thermal response and ablation program for charring materials
US8512430B2 (en) Explosion-proof enclosures with active thermal management using sintered elements
US10883369B2 (en) High temperature compliant metallic elements for low contact stress ceramic support
US20100171241A1 (en) Manufacturing aircraft parts
US20100299907A1 (en) Methods and Systems for Creating Assemblies
US10731565B2 (en) Additive manufactured object with self-breaking support with fluid passage
Bourell Sintering in laser sintering
CN104302021B (en) A kind of for electrically heated heater and preparation technology thereof
CN107662338A (en) Powder chamber platform arrangement
CN107552788B (en) False sintering method for selective laser melting metal additive manufacturing
CN108349169A (en) Fixture construction
GB2508378A (en) Method of making a conductive component
US20030183371A1 (en) Heat sink
Yang et al. Transient coupled thermoelastic analysis of an annular fin
JP2009203441A (en) Composite material, manufacturing method therefor, and composite structure
WO2022061151A3 (en) Systems and methods for nuclear fusion
Dai et al. Finite-element analysis of effects of the laser-processed bimaterial component size on stresses and distortion
Kinefuchi et al. Additive-manufactured single-piece thin multi-layer tungsten heater for an electrothermal thruster
Colasuonno Method for Creating Functionally Graded Materials with Spark Plasma Sintering and a Continuous Machine for Future Scalability
US10197323B1 (en) Emissive composite materials and methods for use thereof
EP2028434A1 (en) System, method and apparatus for improving the performance of ceramic armor materials with shape memory alloys

Legal Events

Date Code Title Description
AS Assignment

Owner name: HARRIS CORPORATION, FLORIDA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:STROM, BRIAN C.;COREY, CHRISTOPHER A.;MCLELLAN, TIMOTHY F.;AND OTHERS;SIGNING DATES FROM 20170718 TO 20170817;REEL/FRAME:043461/0656

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: ADVISORY ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: ADVISORY ACTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION