CN103826830B - 自由成形的多材料微型元件的分层制造 - Google Patents

自由成形的多材料微型元件的分层制造 Download PDF

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CN103826830B
CN103826830B CN201280041454.2A CN201280041454A CN103826830B CN 103826830 B CN103826830 B CN 103826830B CN 201280041454 A CN201280041454 A CN 201280041454A CN 103826830 B CN103826830 B CN 103826830B
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powder
suspension
adhesive
auxiliary material
manufacture
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CN103826830A (zh
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托尔比约恩·奥克利恩特
伊利斯·卡尔斯特伦
佩尔·约翰德
约翰娜·谢恩斯泰特
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Abstract

本发明涉及一种分层制造方法，尤其涉及一种积层制造方法，用于制造包括一种或多种以上的材料的物体，所有包括的材料具有自由成形的能力。例如，本方法可用于生产微型系统的封装，其中，采用陶瓷作为绝缘体，采用辅助材料产生电学或光学3D导体线或3D导体孔。在本方法中使用细粉末，从而可以用于形成小形体尺寸和高精度需求的部件。本法的其它的预期用途有：形成小型机械精密零件或研磨工具、牙科用具或医疗植入物。

Description

自由成形的多材料微型元件的分层制造
技术领域
本发明涉及分层制造，特别是涉及一种积层制造方法(additivelayeredmanufacturing)，用于制造包括一种以上材料的物体，所有包括的材料具有自由成形的能力。
本发明涉及一种物品的制造方法，首先提供一个虚拟的三维模型(CAD模型)，并利用该信息并以可控的方式添加材料来形成物品。这些类型的方法一般通过术语可称为，如快速成型，自由成形制造，分层制造和加层制造。3D-打印是属于该组方法中的一个。由于可以通过一组平面层来描述具有非常复杂形状的物体，使得通过这些分层制造方法实现在实际精度范围内制造出任何期望形状的物品成为可能。
背景技术
3D-打印是一种将粉末层分布在表面上的方法。采用喷墨打印机将粘合剂分布在表面上以将颗粒临时粘合在一起。干燥粘合剂，并重复该过程直到形成包含与粘合剂粘合在一起的物体的粉末床。通过冲洗或清除将物品上的松散的粉末去除后然后进行烧结。原粉末层之间的界限消失，并且形成一个固体物。
与其他分层制造方法相比，3D打印具有快速、不需要构建支撑体、且最终获取的物品具有均匀无残余应力的优点。快速是因为沉积粉末层是一步完成的，且可以通过多个喷嘴同时沉积粘合剂。而在其他方法中，通过在每个点滴涂形成物品，或使用单一激光或电子束光点进行选择性固化。由于这些方法一次只能在一个点进行成形物品，从而这些方法本质上就是较慢的。通过粉末床支撑着结构，使得不需要构建一个需要在后续步骤中去除的独立的支撑结构就能够形成拱形结构。该粉末可不根据密度梯度来沉积，这保证了在一个单独的烧结阶段可以形成均质物品而不会造成不均匀收缩。
在原始的3D打印发明中(CimaUS6146567)，采用喷涂悬浮液方法将粉末施加在表面上。在后来的Fcubic的发明中，将粉末以干燥形式分散以形成一个层(FcubicWO03055628)。后者的方法的速度是非常快的，但该方法只限于粒径为10-20微米的粗糙粉末的应用，该粉末能以干燥状态均匀分布。而更细的粉末，包括大多数烧结性陶瓷粉末和硬质金属粉末，由于范德华引力抑制干燥的小颗粒的流动，从而不可能在干燥状态分散成均质薄层。
微型系统应用越来越多，使产品更智能，也就是给产品增加新的功能。例如，应用的产品有如太阳能电池，蓄电池，OLED，微波元件，芯片实验室(lab-on-achip)和高温传感器，交通工具和厨房用具。微型系统可以包括感应器以感应(加速度，辐射，压力，湿度，化学环境等)，它们也可以包含基于静电式，磁致伸缩式，压电式等原理的致动器。
迄今为止，还不能通过分层制造法直接制造出具有真正的3D结构的微型系统的封装。在可用的方法中，如LTCC(低温共烧陶瓷)只能提供平面衬底，其中，电子连接(通孔)必须垂直于该层。这往往使得有必要结合LTCC结构与其他的单独制造出的3D结构。使用添加剂直接制造出封装具有竞争性优势。集成电子芯片的发展是通过晶圆铸造车间完成的高效的流水线生产。而封装没有统一的标准化的形式。封装通常是生产微型系统的主要成本。封装的进一步的设计、制造和测试是非常耗时的过程。
微型系统的电气连接是采用绝缘和导电材料制成的。对于一些应用，还需要其它材料来形成电阻器以完善介电性能。对于光连接，需要其他材料组合来形成波导。这就要求在制造过程中能够整合多种材料。这在以前可用的分层制造方法在一直未能实现。
发明内容
基于上述提及的现有技术的缺点，本发明的总的目的是提供一种用于制造包括多种材料的3D物品的加层制造方法。本发明能够有效地生产出由水基粉末材料(如陶瓷，玻璃，混合物，金属间化合物，硬质金属或金属材料)构成的物品，还包括增加的一种或多种辅助材料(如陶瓷，玻璃，混合物，金属间化合物，硬质金属或金属材料)。这些辅助材料具有可以以自由形态结合的能力。
根据本发明的一个方面，本发明涉及一种积层制造方法，用于制造包括一种或多种材料的物品，所有包括的材料具有自由成形的能力。该方法包括：提供平面衬底作为平台用于形成构建所述物体的支撑体；采用疏水溶液对平面衬底的选定部分进行疏水化；分散包括尺寸小于5微米的颗粒的水基粉末悬浮液形成厚度低于50微米的层；施加粘合剂至粉末层需要成型粉末体中的部分；施加一种或多种辅助材料作为粉末悬浮液或粉末浆至位于层中的由水基悬浮液的疏水性斥力产生的间隙；重复添加如上所述的粉末层，疏水区域、粘合剂和辅助材料以构建一个具有所需形状和尺寸的粉末体；冲洗或清除所述物品以去除松散的粉末并将所述物品与所述支撑体分离；及通过热处理除去所述粘合剂，并烧结所述粉末物体以形成固体物。
根据各种示例性实施例，将一个平面支撑体作为一个平台来构建物品。采用刮片、喷枪或挤压法将细粉末以水基悬浮液沉积在支撑体上。采用临时粘合剂将需要包括在最终成形的物品的层的部件粘接在一起。浓缩悬浮液的水分可以迅速干燥以使层固化。多个相互叠在顶部的层与添加的粘合剂一起形成了物品。疏水性材料被选择性地沉积在每一粉末层上以在另一层中形成空隙。疏水性部件排斥水基悬浮液。采用喷墨打印或点胶方式在空隙中填充辅助材料。根据需要的层的数量重复沉积粉末层和辅助材料。当整个物品形成时，松散的粉末，即未与临时粘合剂粘合在一起的粉末，通过冲洗或清除方式去除。在冲洗或清除掉散粉之前或之后，将物品与支撑体分离。随后对物品进行加热以除去临时粘合剂，接着进一步加热烧结物品以形成包含多种材料的固体组件。
以这种方式，该物品可以包括具有任意形状的辅助材料的结构。这些结构例如可用于如在绝缘或折射基体中构建3D通孔(任意形状和方向的电，光或热传导线)。
通常，本发明的其它目的、特征和优点将在下面的详细描述中公开，所附从属权利要求以及从附图中也同样在本发明的范围之内。
附图简要说明
下面结合举例、实验和附图描述本发明的具体实施例，其中：
图1为根据本发明的一实施例的通过粘合剂形成结构的示意图和去除松散粉末的示意图；
图2为根据本发明的一实施例的在层间形成的孔隙中的填充辅助材料的原理示意图；
图3为根据本发明的一实施例的接触图形的示意图；
图4为根据本发明的具体实施例的示意图；及
图5为根据本发明的一实施例的流程示意图。
应当理解，附图并不是按照正确的比例绘制的，正如本领域技术人员所知，未在附图中示出的尺寸也包括在本发明的范围之内。
本发明的具体实施方式
根据各种实施例，本发明可用于制造微型系统的封装，其中以陶瓷作为绝缘体，且辅助材料作为或形成3D导线或3D通孔。在此方法中，采用细粉末使本方法能够用于或使本方法可用于形成具有小的形体尺寸，高精度，和/或高精度的需求的组件。本方法的其它的预期用途可以为构建光电系统，微流体系统，小型机械精密零件，研磨工具，牙科用具或医疗植入物。根据本发明各种实施例形成的微型系统具有使产品更智能的优点，即为产品增加新的功能。
本发明基于3D打印的概念。但是，与分散或喷涂干燥的粉末不同的，本发明将粉末层作为浓缩悬浮液加入至水中。采用喷枪、刮片、挤压法或采用其它技术将所述悬浮液沉积在薄层上以分散悬浮液。这与喷涂是不同的，在喷涂中，需要将陶瓷或金属配置成很稀的悬浮液，以便具有穿过喷嘴的粘性。在采用喷枪的悬浮液的应用中，可以精确地控制高度浓缩悬浮液形成非常薄的粉末层(1-50微米)。术语“高度浓缩”在这里用于描述接近理论随机密堆积浓度的悬浮液。该高度浓缩的悬浮液可以快速凝固，因为它仅需要除去一分钟量水即可转化成固体。然后在应该保留在最终主体的部位上印刷粘结剂。
如图1所示，冲洗或清除以除去松散的粉末，并通过添加粘合剂形成结构。在层间形成的空隙中填充辅助材料的原理示意图如2所示。
添加的作为层的材料可以是陶瓷，但也可以是能散开为层的其他细粉末，如玻璃，混合材料，硬质合金，金属间化合物或金属。所需要满足的要求是，该粉末的颗粒尺寸较小，如小于5微米，以使它们可以分散并同时降低或不产生沉淀，而且能够与薄层共同作用以使得能够形成具有高精度的小形状物品。粉末可以进一步分散在水中，并降低或使得细粉末和水不产生显著反应。此外，根据该方法，可将粉末烧结成致密的最终材料。为此，需要采用可烧结的未凝聚的细粉末，其中颗粒尺寸的要求取决于实际材料的类型。对于高性能陶瓷，小于1微米的颗粒尺寸都可以使用。
3D打印工艺可以用于在组件中形成内部空腔(孔或通道)，只要它们能连接到该组件的表面，并且当组件形成后可以通过冲洗或清洗去除松散的粉末。在形成整个组件后再填充辅助材料至空腔是较困难和不现实的。为了能够在组件内部增加辅助材料是有用的，或者必要时，在层形成过程中也形成一定的空间。
可以使用机械钻孔或激光加工在每个层上形成空腔，但会造成芯片或其他杂物的排放。这将是非常难以去除并可能会破坏目的是获得高精度和高品质的小结构的过程。
代替机械加工的是，采用疏水液体有选择地印刷在层的一部分位置。当添加下一个层时，疏水性区域排斥水性粉末悬浮液，以使在第二层(或添加第三或第四材料)所在的层产生空隙(空腔的孔)。疏水性液体可以包含或包括，例如烃类(链烷烃，油脂)，碳氟化合物或硅氧烷。
由于空腔是逐层产生的，可以通过点胶机(dispensers)、喷墨印刷或其它应用方法逐层添加糊状的辅助材料。采用点胶机(一次完成一个点)填充空腔是比采用喷墨打印粘合剂(采用一组喷嘴阵列完成)较慢的过程，但在大多数应用中，需要填充的区域只是整个组件的截面的一小部分。以这种方式迅速沉积和固化整个层的主要优点能够保留住。
这个过程可以在组件内部形成三维导通孔(3-D导电连接或光学孔)或在该结构中与其他辅助材料的3D结构一体化。所添加的材料可被选择或进行调整以与烧结过程兼容。然而，这个问题已经在是在市售的低温共烧陶瓷技术(低温共烧陶瓷电子应用)的例子中解决了。
根据其中一个实施例，该方法也可以用于以牺牲材料作为辅助材料加入至由疏水性区域产生的空隙中。该牺牲材料被选择为临时填充在空隙中，但在热处理之前的烧结过程中或在烧结过程的早期阶段消失。这可以用于在元件中的通道，封闭的通道和/或空腔中。由于这些辅助材料没有永久填充在空腔中，它们不需要连接到主体的外表面。牺牲材料在物品烧结密封前就已经分解/从气孔中蒸发出来。牺牲材料的一个例子是：物品在空气中加热处理过程中，石墨进行氧化生成二氧化碳。牺牲材料的另一个例子是：蜡在热处理过程中熔化并蒸发。即使通道或空腔是连通到物体的表面，冲洗或清除小通道或小空腔通常是困难和费时的。
另外，按照这种方法，在LTCC技术中，在下一个陶瓷层以类似的方式添加完成之前，可以通过喷墨方法添加具有导电金属油墨的平面导体线。
例如，该方法使陶瓷封装(或陶瓷连接器产品)的制造在微型系统具有较大的应用范围。通过添加功能性材料和通过电导体连接该材料使得可以增加传感器或致动器。为电子芯片添加导线，电阻，电感和电容和连接点将打开智能系统集成。微型系统例如可以用于如太阳能电池，蓄电池，OLED，微波元件，芯片实验室和高温度传感器，交通工具和厨房用具等产品。微型系统可以进一步包含传感器用于感应(加速度，辐射，压力，湿度，化学环境等)，它们也可以包含基于静电式，磁致伸缩式，压电式或其他原理的致动器或传感器。微型系统还可以包含形成光或微波的波导，以及输送流体的腔道。根据该方法形成的微型系统还可能包含光波导。
由于本方法精度高，有能力构建复杂特征和集成辅助材料，从而可用于制作复杂而小型的加工工具、医疗植入物以及牙科产品。该方法还可以用于形成具有内部金属化的通道和空腔。这样的结构可以在微波应用中用作波导。对于高频微波技术(THz或近THz)微带传输带需要更换波导。这些波导(金属化通道)必须是高精度和低表面粗糙度，以避免损失。该高精确度和低表面粗糙度可通过本方法制成。
实施例1
在一个简单的模型实验中，采用刮刀浇铸部代替喷枪作为各层的手动应用。在烧结的氧化铝板上丝网印刷金属图案。如图3所示，该图案包括两端以接触点收尾的不同尺寸的直导线。采用银浆印刷使得图案具有良好的电气导通性能。
将具有导体的板置于浇铸部。将氧化铝悬浮液(体积分数为40％的AKP30，SumitomoChemicals)与分散剂(0.35％DolapixPC21)分散在水中后，通过具有80μm的间隙的刮刀进行浇铸。该浇铸在板上形成细氧化铝粉末膜。
通过滴涂疏水液体形成过孔(via)。疏水性液体为一种碳氟基化合物的液体。在疏水性液体施加区域，氧化铝水基悬浮液没有变湿，因此它回避了这些区域。形成的孔穿透干燥的氧化铝粉末层。
在干燥后的陶瓷层的顶部上通过丝网印刷形成新一层导体。第二层的导电图案被取代，使得第一层可以与接触点连通。银浆贯通所形成的孔并将第一层与第二层相连，从而建立一个连接通道。
如图4所示，通过上层和下层的端点之间的短路测定来检验连接性。目前已经通过6个通孔连通上层和下层。
实施例2
通过分层制造法制造一台机器。它包括一台带有线性致动器(NSK和HIWIN)的桌子，其可沿XYZ方向移动一个平台。通过PLC控制器(Beijer)控制移动台。
移动台配有一个喷枪(PremierDies)，该喷枪通过精密泵的压力提供陶瓷悬浮液(如精密齿轮泵)。该陶瓷悬浮液类似于实施例1，但该固体浓度调整至适合于喷枪的粘度。
将具有电子驱动器(MegatechElectronic)的喷墨头(HP)固定到平台，以便能够打印临时胶乳粘合剂和疏水性液体。
将点胶机装配至移动台并填充有导电胶。
采用电脑编程来控制喷枪以通过PLC和转移印刷的信息来驱动电子打印各层。然后在接下来的沉积下一层之前升起移动台。
这台机器可用于在陶瓷封装结构中构建3D导电通路。
参阅图1，图2和图5，在实施例1中，通过该实施例的方法11来制作物品1。如图所示，该实施例的方法11包括：
提供平面衬底作为一个平台，以形成一个用于构建物品1的支撑体2，如图5中的方框12所示；
施加疏水性溶液，如3a或3b，对平面衬底的选定部分进行疏水化；如水基悬浮液的粉末层4，4a和4b，或者在平台形成的支撑体2，如在图5中的方框13所示；
分散包括尺寸小于5微米的颗粒的水基粉末悬浮液4a或4b形成厚度低于50微米的层；如图5中的方框14所示；
施加粘合剂5至粉末层的需要保留在成型的粉末体中的部分，如图5中的方框15所示；
施加一种或多种辅助材料6a作为粉末悬浮液或粉末浆至位于层中由水基悬浮液的疏水性斥力产生的间隙，如图5中的方框16所示；
重复添加如上所述的粉末层4a、4b、4c，疏水区域3a、3b、粘合剂5a、5b、5c和对应的辅助材料6a，以构建一个具有所需形状和尺寸的粉末体，如图5中的方框17所示；
冲洗或清除物品以去除松散的粉末并将物品与支撑体2分离，如图5中的方框18所示；
通过热处理除去粘合剂，并烧结粉末物体以形成固体物，如图5中的方框19所示。
值得注意的是，图2示出为粉末层4a和4b被选择用于形成平面衬底的一部分，该衬底(一个/多个)经疏水性溶液3a和/或3b疏水化。然而，该疏水性溶液也可以直接施加在平台上以形成支撑体2，其中，平台形成支撑体2以形成平面衬底是疏水化步骤中进行的。
应当指出的是，以上所述实施例仅表达了本发明的几种实施方式。然而，在不脱离本发明构思的前提下，本领域普通技术人员还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。
还应当指出的是，在权利要求中，术语“包括”不排除其他元件或步骤，并且不定冠词“a(一个)”或“an(一个)”也不排除多个。一个单一的装置或其他单元可以实现权利要求中记载的若干项的功能。某些特征或方法步骤记载在不同的从属权利要求中，并不意味着这些特征或步骤不能组合以达到一个优点。

Claims (14)

1.一种积层制造方法(11)，用于制造包括一种以上材料的物体(1)，所有包括的材料具有自由成形的能力，包括步骤：
a)提供(12)平面衬底作为平台以形成用于构建所述物体(1)的支撑体(2)；
b)采用疏水溶液对所述平面衬底的选定部分进行疏水化(13)；
c)分散(14)包括尺寸小于5微米的颗粒的水基粉末悬浮液形成厚度低于50微米的层；
d)施加(15)粘合剂(5)至粉末层需要保留在成型粉末体中的部分；
e)施加(16)一种或多种辅助材料(6a)作为粉末悬浮液或粉末浆至位于层中的由水基悬浮液的疏水性斥力产生的间隙；
f)重复(17)添加粉末层(4a、4b、4c)，疏水区域(3a、3b)、粘合剂(5a、5b、5c)和辅助材料以构建一个具有所需形状和尺寸的粉末体；
g)冲洗(18)或清除所述粉末体以去除松散的粉末并将所述粉末体与所述支撑体(2)分离；及
h)通过热处理(19)除去所述粘合剂并烧结所述粉末体以形成固体物。
2.根据权利要求1所述的方法，其特征在于，在位于所述粉末层中的间隙中选择性地填充牺牲材料(6a)以在所述烧结的物体中形成空腔或通道。
3.根据权利要求1所述的方法，其特征在于，所述粉末悬浮液采用刮片、喷枪或挤压法在多个层沉积，所述疏水溶液和所述粘合剂通过喷墨印刷沉积，及所述辅助材料通过点胶或喷墨印刷沉积。
4.根据权利要求1所述的方法，其特征在于，所述疏水溶液(3a,3b)为碳氟化合物或硅氧烷的溶液或分散液。
5.根据权利要求1所述的方法，其特征在于，所述粉末悬浮液由陶瓷或硬质金属粉末组成。
6.根据权利要求1所述的方法，其特征在于，通过包括用于传感器或致动器的电介质的、电阻式的、半导体的、或磁性的材料以增加附加功能。
7.根据权利要求1至6任意一项所述的方法，其特征在于，所述方法被用来形成具有导电材料和绝缘材料的结构以形成微型系统的封装。
8.根据权利要求1至6任意一项所述的方法，其特征在于，所述方法被用来形成植入物或牙科替代物。
9.根据权利要求1至6任意一项所述的方法，其特征在于，所述方法被用来形成研磨或切割工具。
10.根据权利要求1至6任意一项所述的方法，其特征在于，所述方法被用来形成机械精密零件。
11.根据权利要求1至6任意一项所述的方法，其特征在于，所述方法被用来在具有金属化表面(7)的陶瓷材料中形成通道和空腔以用作微波的波导。
12.根据权利要求1至6任意一项所述的方法，其特征在于，所述方法被用来在具有金属化表面(7)的陶瓷材料中形成通道和空腔以用作传输流体。
13.根据权利要求1至6任意一项所述的方法，其特征在于，所述方法被用来形成光波导。
14.根据权利要求13所述的方法，其特征在于，所述波导形成在陶瓷材料的内部或顶部。
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