EA201400272A1 - Производство многослойных микрокомпонентов произвольной формы из нескольких материалов - Google Patents
Производство многослойных микрокомпонентов произвольной формы из нескольких материаловInfo
- Publication number
- EA201400272A1 EA201400272A1 EA201400272A EA201400272A EA201400272A1 EA 201400272 A1 EA201400272 A1 EA 201400272A1 EA 201400272 A EA201400272 A EA 201400272A EA 201400272 A EA201400272 A EA 201400272A EA 201400272 A1 EA201400272 A1 EA 201400272A1
- Authority
- EA
- Eurasian Patent Office
- Prior art keywords
- layers
- optical
- materials
- microcomponents
- manufacture
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 abstract 3
- 230000003287 optical effect Effects 0.000 abstract 2
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000007943 implant Substances 0.000 abstract 1
- 239000012212 insulator Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
- A61C13/00—Dental prostheses; Making same
- A61C13/0003—Making bridge-work, inlays, implants or the like
- A61C13/0006—Production methods
- A61C13/0013—Production methods using stereolithographic techniques
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
- A61C13/00—Dental prostheses; Making same
- A61C13/0003—Making bridge-work, inlays, implants or the like
- A61C13/0006—Production methods
- A61C13/0018—Production methods using laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/005—Loading or unloading powder metal objects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/10—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of articles with cavities or holes, not otherwise provided for in the preceding subgroups
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
- C22C29/12—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides based on oxides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/30—Platforms or substrates
- B22F12/33—Platforms or substrates translatory in the deposition plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
Настоящее изобретение относится к производству слоев, более конкретно, к способу аддитивного производства слоев объектов, содержащих более одного материала, с возможностью придания произвольной формы всем содержащимся материалам. Изобретение, например, может использоваться для изготовления упаковки для микросистем, в которой керамика выступает в качестве изолятора, а вторичный материал используется для формирования электрических или оптических 3-мерных проводящих дорожек либо электрических или оптических 3-мерных перемычек. Мелкий порошок, используемый в данном способе, позволяет использовать его для создания компонентов с элементами малого размера, требующих высокой точности. Способ также может использоваться для создания небольших механических прецизионных деталей, шлифовальных инструментов, стоматологических изделий или медицинских имплантов.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE1100624A SE536670C2 (sv) | 2011-08-26 | 2011-08-26 | Skiktbaserad tillverkning av friformade mikrokomponenter avmultimaterial |
PCT/EP2012/066339 WO2013030064A1 (en) | 2011-08-26 | 2012-08-22 | Layered manufacturing of free-form multi-material micro-components |
Publications (2)
Publication Number | Publication Date |
---|---|
EA201400272A1 true EA201400272A1 (ru) | 2014-06-30 |
EA025234B1 EA025234B1 (ru) | 2016-12-30 |
Family
ID=46750323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EA201400272A EA025234B1 (ru) | 2011-08-26 | 2012-08-22 | Способ послойного производства трехмерного объекта |
Country Status (11)
Country | Link |
---|---|
US (1) | US9545669B2 (ru) |
EP (1) | EP2747986B1 (ru) |
JP (1) | JP5985641B2 (ru) |
KR (1) | KR101995940B1 (ru) |
CN (1) | CN103826830B (ru) |
BR (1) | BR112014004155B1 (ru) |
CA (1) | CA2846461C (ru) |
EA (1) | EA025234B1 (ru) |
ES (1) | ES2567076T3 (ru) |
SE (1) | SE536670C2 (ru) |
WO (1) | WO2013030064A1 (ru) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9156680B2 (en) * | 2012-10-26 | 2015-10-13 | Analog Devices, Inc. | Packages and methods for packaging |
WO2014209994A2 (en) | 2013-06-24 | 2014-12-31 | President And Fellows Of Harvard College | Printed three-dimensional (3d) functional part and method of making |
US9823143B2 (en) * | 2013-10-07 | 2017-11-21 | United Technologies Corporation | Additively grown enhanced impact resistance features for improved structure and joint protection |
CN105939837B (zh) | 2014-01-16 | 2019-05-10 | 惠普发展公司,有限责任合伙企业 | 对用于增材制造系统的切片数据进行处理 |
EP3094669B1 (en) | 2014-01-16 | 2022-11-23 | Hewlett-Packard Development Company, L.P. | Polymeric powder composition for three-dimensional (3d) printing |
JP6298169B2 (ja) | 2014-01-16 | 2018-03-20 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 構築材料プロファイル |
DE112014006179T5 (de) | 2014-01-16 | 2016-11-17 | Hewlett-Packard Development Company, L.P. | Erzeugen dreidimensionaler Objekte |
JP6570542B2 (ja) | 2014-01-16 | 2019-09-04 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | 三次元物体の生成 |
US10583612B2 (en) | 2014-01-16 | 2020-03-10 | Hewlett-Packard Development Company, L.P. | Three-dimensional (3D) printing method |
EP3094472B1 (en) * | 2014-01-16 | 2020-04-01 | Hewlett-Packard Development Company, L.P. | Processing slice data for an additive manufacturing system |
US10220564B2 (en) | 2014-01-16 | 2019-03-05 | Hewlett-Packard Development Company, L.P. | Generating three-dimensional objects |
US20170203513A1 (en) | 2014-01-16 | 2017-07-20 | Hewlett-Packard Development Company, L.P. | Generating a three-dimensional object |
US11273594B2 (en) | 2014-01-16 | 2022-03-15 | Hewlett-Packard Development Company, L.P. | Modifying data representing three-dimensional objects |
CN106061714B (zh) | 2014-01-16 | 2019-07-12 | 惠普发展公司,有限责任合伙企业 | 基于辐射率的温度确定 |
KR101872628B1 (ko) | 2014-01-16 | 2018-06-28 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 입체 물체 생성 |
DE102014201121A1 (de) * | 2014-01-22 | 2015-07-23 | Robert Bosch Gmbh | Elektronisches Funktionsbauteil und Verfahren zur Herstellung eines elektronischen Funktionsbauteils |
US9818665B2 (en) | 2014-02-28 | 2017-11-14 | Infineon Technologies Ag | Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces |
DE102014207510B4 (de) | 2014-04-17 | 2021-12-16 | Kennametal Inc. | Zerspanungswerkzeug sowie Verfahren zum Herstellen eines Zerspanungswerkzeugs |
DE102014207507B4 (de) | 2014-04-17 | 2021-12-16 | Kennametal Inc. | Zerspanungswerkzeug sowie Verfahren zum Herstellen eines Zerspanungswerkzeugs |
US9586371B2 (en) | 2014-09-02 | 2017-03-07 | Empire Technology Development Llc | Method of bonding material layers in an additive manufacturing process |
US20160304210A1 (en) * | 2014-10-15 | 2016-10-20 | Rosemount Aerospace Inc. | One-piece air data probe |
PL3009233T3 (pl) | 2014-10-15 | 2019-05-31 | Vk Invest Gmbh | Narzędzie do obróbki materiału i sposób wytwarzania narzędzia |
JP6458543B2 (ja) * | 2015-02-23 | 2019-01-30 | 株式会社リコー | 造形データ作成装置、プログラム、造形装置 |
US10507638B2 (en) * | 2015-03-17 | 2019-12-17 | Elementum 3D, Inc. | Reactive additive manufacturing |
US11802321B2 (en) | 2015-03-17 | 2023-10-31 | Elementum 3D, Inc. | Additive manufacturing of metal alloys and metal alloy matrix composites |
JP6596861B2 (ja) * | 2015-03-20 | 2019-10-30 | 日本電気株式会社 | 積層造形構造体 |
DE102015006363A1 (de) * | 2015-05-20 | 2016-12-15 | Voxeljet Ag | Phenolharzverfahren |
DE102015108646A1 (de) * | 2015-06-01 | 2016-12-01 | Bundesrepublik Deutschland, Vertreten Durch Den Bundesminister Für Wirtschaft Und Energie, Dieser Vertreten Durch Den Präsidenten Der Bundesanstalt Für Materialforschung Und -Prüfung (Bam) | Verfahren zur Herstellung keramischer Multilagen-Schaltungsträger auf Basis einer schlickerbasierten additiven Fertigung |
WO2017011388A1 (en) * | 2015-07-16 | 2017-01-19 | 3M Innovative Properties Company | A method of making a dental article |
DE102015214997A1 (de) * | 2015-08-06 | 2017-02-09 | ALL-Impex GmbH Import/Export | Verfahren zur Herstellung eines Bauteils aus keramischen Werkstoffen |
JP6751251B2 (ja) * | 2015-10-15 | 2020-09-02 | セイコーエプソン株式会社 | 三次元造形物の製造方法及び三次元造形物の製造装置 |
JP2017133055A (ja) * | 2016-01-26 | 2017-08-03 | セイコーエプソン株式会社 | 機能素子構造体の三次元製造方法及び機能素子構造体 |
EP4353384A2 (en) * | 2016-02-03 | 2024-04-17 | Grid Logic Incorporated | System and method for manufacturing a part |
US11613070B2 (en) * | 2016-02-23 | 2023-03-28 | Xerox Corporation | System and method for building three-dimensional printed objects with materials having different properties |
US11654627B2 (en) | 2016-03-25 | 2023-05-23 | Sprintray, Inc. | System and method for three-dimensional printing |
CN109070467B (zh) | 2016-04-04 | 2021-04-13 | 惠普发展公司,有限责任合伙企业 | 用于增材制造的防护特征的定义 |
US11969795B2 (en) | 2016-04-14 | 2024-04-30 | Desktop Metal, Inc. | Forming an interface layer for removable support |
US20170305141A1 (en) * | 2016-04-26 | 2017-10-26 | Ricoh Company, Ltd. | Apparatus and method for fabricating three-dimensional objects |
EP3448655B1 (en) | 2016-04-28 | 2021-09-01 | Hewlett-Packard Development Company, L.P. | 3-dimensional printing method and 3-dimensional printing material set |
US11465341B2 (en) | 2016-04-28 | 2022-10-11 | Hewlett-Packard Development Company, L.P. | 3-dimensional printed parts |
BR112018015592A2 (pt) | 2016-04-28 | 2018-12-26 | Hewlett Packard Development Co | conjuntos de material fotoluminescente |
GB201610267D0 (en) | 2016-06-13 | 2016-07-27 | Digital Metal Ab | Slot die manufacturing apparatus and manufacturing method |
WO2018017096A1 (en) | 2016-07-21 | 2018-01-25 | Hewlett-Packard Development Company, L.P. | Additively formed 3d object with conductive channel |
US9987682B2 (en) | 2016-08-03 | 2018-06-05 | 3Deo, Inc. | Devices and methods for three-dimensional printing |
US11518087B2 (en) | 2016-09-12 | 2022-12-06 | University Of Washington | Vat photopolymerization additive manufacturing of multi-material parts |
EP3323530A1 (en) * | 2016-11-16 | 2018-05-23 | Montfort Watches SA | 3d printed watch dial |
AU2017366705A1 (en) * | 2016-12-02 | 2019-05-02 | Markforged, Inc. | Sintering additively manufactured parts with a densification linking platform |
US10800108B2 (en) | 2016-12-02 | 2020-10-13 | Markforged, Inc. | Sinterable separation material in additive manufacturing |
US10000011B1 (en) | 2016-12-02 | 2018-06-19 | Markforged, Inc. | Supports for sintering additively manufactured parts |
AU2017372858B2 (en) | 2016-12-06 | 2023-02-02 | Markforged, Inc. | Additive manufacturing with heat-flexed material feeding |
EP3338917A1 (de) * | 2016-12-22 | 2018-06-27 | HILTI Aktiengesellschaft | Verfahren zur schichtweisen fertigung eines grünlings aus pulverförmigem werkstoff mit definiert angeordneten einsatzelementen |
EP3338916A1 (de) * | 2016-12-22 | 2018-06-27 | HILTI Aktiengesellschaft | Verfahren zur schichtweisen fertigung eines bauteils aus pulverförmigem werkstoff |
EP3338915A1 (de) * | 2016-12-22 | 2018-06-27 | HILTI Aktiengesellschaft | Verfahren zur schichtweisen fertigung eines grünlings aus pulver- oder pastenförmigem werkstoff mit definiert angeordneten schneidelementen |
US11685113B2 (en) | 2017-03-06 | 2023-06-27 | Katholieke Universiteit Leuven | 3D printing of porous liquid handling device |
EP3544788A4 (en) | 2017-04-18 | 2020-07-22 | Hewlett-Packard Development Company, L.P. | INCREASED ELECTRICAL CONDUCTIVITY AT SELECTED LOCATIONS OF A 3D OBJECT |
EP3615311A4 (en) * | 2017-04-26 | 2020-12-09 | Hewlett-Packard Development Company, L.P. | PRINTING CONDUCTIVE ELEMENTS |
KR102356699B1 (ko) * | 2017-04-28 | 2022-01-27 | 한국전자통신연구원 | 3d 프린팅을 이용한 센서 제작 방법 및 그 3d 프린터 |
FR3070135B1 (fr) * | 2017-08-18 | 2019-08-16 | S.A.S 3Dceram-Sinto | Procede et machine de fabrication de pieces en materiau ceramique ou metallique par la technique des procedes additifs |
FR3070134B1 (fr) * | 2017-08-18 | 2019-08-16 | S.A.S 3Dceram-Sinto | Procede et machine de fabrication d'au moins une piece en au moins un materiau ceramique et/ou metallique par la technique des procedes additifs |
US20190061234A1 (en) * | 2017-08-28 | 2019-02-28 | Harris Corporation | Method for making a metal isolator body and associated device including the same |
US20190082560A1 (en) * | 2017-09-08 | 2019-03-14 | Toyota Motor Engineering & Manufacturing North America, Inc. | Systems and methods for additive manufacturing of wick structure for vapor chamber |
CN111278627B (zh) * | 2017-10-25 | 2023-02-03 | 惠普发展公司,有限责任合伙企业 | 用于由颗粒形成的3d特征的热支撑物 |
DE102017127315A1 (de) * | 2017-11-20 | 2018-03-08 | Agilent Technologies, Inc. (N.D.Ges.D. Staates Delaware) | Herstellung eines mikrofluidischen Bauteils mittels additiver Fertigung |
WO2019226815A1 (en) * | 2018-05-22 | 2019-11-28 | Markforged, Inc. | Sinterable separation material in additive manufacturing |
WO2020027810A1 (en) * | 2018-07-31 | 2020-02-06 | Hewlett-Packard Development Company, L.P. | Thermal supports for formation of 3d object portions |
US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
WO2020068065A1 (en) * | 2018-09-26 | 2020-04-02 | Hewlett-Packard Development Company, L.P. | Three dimensional (3d) printed molds having breakaway features |
DE102019102913A1 (de) | 2019-02-06 | 2020-08-06 | Hochschule Offenburg | Verfahren zur Herstellung eines Roboterelements, insbesondere eines Greifers, mittels 3D-Druck |
WO2020222743A1 (en) * | 2019-04-29 | 2020-11-05 | Hewlett-Packard Development Company, L.P. | Three-dimensional printing conductive elements |
JP7346917B2 (ja) * | 2019-06-04 | 2023-09-20 | セイコーエプソン株式会社 | 三次元造形物の製造方法 |
US11587839B2 (en) | 2019-06-27 | 2023-02-21 | Analog Devices, Inc. | Device with chemical reaction chamber |
FR3099491B1 (fr) * | 2019-08-02 | 2022-01-14 | Aml Finances | Procédé de dépôt d’un métal conducteur électrique sur au moins une partie de la surface interne d’une cavité interne d’un guide d’ondes |
US20220032585A1 (en) * | 2020-07-28 | 2022-02-03 | Ge Aviation Systems Llc | Insulated ferromagnetic laminates and method of manufacturing |
KR102568142B1 (ko) * | 2021-03-09 | 2023-08-22 | (주)쓰리디머티리얼즈 | 우레아 반응 기반 3d 프린팅용 잉크 조성물 및 이를 이용한 3d 프린팅 방법 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5204055A (en) * | 1989-12-08 | 1993-04-20 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
US5387380A (en) * | 1989-12-08 | 1995-02-07 | Massachusetts Institute Of Technology | Three-dimensional printing techniques |
US6146567A (en) | 1993-02-18 | 2000-11-14 | Massachusetts Institute Of Technology | Three dimensional printing methods |
EP1009614A4 (en) * | 1997-06-13 | 2004-04-21 | Massachusetts Inst Technology | BLAST COATING WITH POWDER-SHAPED MATERIAL AND FINE-POWDER BED PRODUCED BY IT |
US6363606B1 (en) * | 1998-10-16 | 2002-04-02 | Agere Systems Guardian Corp. | Process for forming integrated structures using three dimensional printing techniques |
SE523394C2 (sv) | 2001-12-13 | 2004-04-13 | Fcubic Ab | Anordning och förfarande för upptäckt och kompensering av fel vid skiktvis framställning av en produkt |
US20040169699A1 (en) * | 2003-02-28 | 2004-09-02 | Hunter Shawn D. | Methods and systems for producing an object through solid freeform fabrication using immiscible fluids |
JP2005007572A (ja) * | 2003-04-22 | 2005-01-13 | Fuji Photo Film Co Ltd | 三次元造形物の製造方法 |
US7389154B2 (en) * | 2004-09-29 | 2008-06-17 | Hewlett-Packard Development Company, L.P. | Fabricating a three-dimensional object |
JP4888236B2 (ja) * | 2007-06-08 | 2012-02-29 | セイコーエプソン株式会社 | 三次元造形装置、および三次元造形方法 |
JP2009006538A (ja) | 2007-06-27 | 2009-01-15 | Seiko Epson Corp | 三次元造形装置、および三次元造形方法 |
EP2151214B1 (de) * | 2008-07-30 | 2013-01-23 | Ivoclar Vivadent AG | Lichthärtende Schlicker für die stereolithographische Herstellung von Dentalkeramiken |
JP2010274480A (ja) * | 2009-05-27 | 2010-12-09 | Sony Corp | 三次元構造体の製造方法 |
JP2011245713A (ja) * | 2010-05-26 | 2011-12-08 | Seiko Epson Corp | 造形方法 |
JP5621400B2 (ja) * | 2010-08-17 | 2014-11-12 | セイコーエプソン株式会社 | 造形方法 |
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CA2846461C (en) | 2019-12-03 |
EP2747986B1 (en) | 2016-01-20 |
CN103826830A (zh) | 2014-05-28 |
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EP2747986A1 (en) | 2014-07-02 |
BR112014004155A2 (pt) | 2017-03-21 |
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KR101995940B1 (ko) | 2019-10-17 |
JP5985641B2 (ja) | 2016-09-06 |
BR112014004155B1 (pt) | 2020-07-14 |
US9545669B2 (en) | 2017-01-17 |
CA2846461A1 (en) | 2013-03-07 |
EA025234B1 (ru) | 2016-12-30 |
SE1100624A1 (sv) | 2013-02-27 |
CN103826830B (zh) | 2016-05-18 |
SE536670C2 (sv) | 2014-05-13 |
US20150306664A1 (en) | 2015-10-29 |
WO2013030064A1 (en) | 2013-03-07 |
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