JP2014522102A - 半導体チップのハウジングおよびハウジングを有する半導体チップ - Google Patents
半導体チップのハウジングおよびハウジングを有する半導体チップ Download PDFInfo
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Abstract
【選択図】 図1
Description
好ましくは、このハウジングは半導体チップを損傷から保護し、たとえば外部からの機械的または化学的な作用から半導体チップを保護する。
さらに、本発明は、ハウジングを有する半導体チップに関する。
この場合、ハウジングの蓋が回路基板に接するように、ハウジングが回路基板の上に取り付けられる。
代替として、この開口部は、収容空間をたとえばオイル等の媒体で充填するために機能してよい。このオイルはセンサの保護として働く。たとえば、このセンサはオイルによって塵または他の汚染粒子から保護され得る。
たとえば、この膜は、収容空間で過圧が発生しないような透過性を有するように形成されていてよい。
さらにもう1つの実施形態では、半導体チップおよびハウジングは、相対圧の測定のために作製されてよい。たとえば、ハウジングは、流動媒体の導管部(Zuleitung)が通る接続領域を備える。この導管部は、好ましくは半導体チップの圧力に反応する領域を通過するので、この半導体チップを用いて流動媒体の圧力を測定することができる。たとえば、この導管部には、膜またはバルブが設けられる。
2 半導体チップ
3 収容空間
4 射出成形体
5 半導体チップ固定用の接着剤
6 内側のメタライジング部
7 内側のメタライジング部
8 内側の表面
9 接続ワイヤ
10 接続ワイヤ
11 貫通接続部
12 貫通接続部
13 外面
14 外側のメタライジング部
15 外側のメタライジング部
16 内側の表面
17 バルク成形材
18 蓋
19 底部
20 接続パッド
21 接続パッド
22 導管部
23 空隙部
24 メタライジング部
25 メタライジング部
26 表面
27 蓋固定用の接着剤
28 受入部
29 接続ピン
30 接続ピン
31 開口部
Claims (15)
- 半導体チップのハウジングであって、
前記ハウジング(1)は、半導体チップ(2)を収容する収容空間(3)が設けられた射出成形体(4)を備え、
前記射出成形体(4)は、前記半導体チップ(2)と電気的に接続するための、少なくとも1つのメタライジング部(6,7,11,12,14,15,24,25)を備えることを特徴とする半導体チップのハウジング。 - 請求項1に記載のハウジングにおいて、
前記メタライジング部(6,7,11,12,14,15,24,25)は、少なくとも部分的に前記射出成形体の表面(8,16,26)の上に配設されていることを特徴とするハウジング。 - 請求項1または2に記載のハウジングにおいて、
前記メタライジング部(6,7,11,12,14,15,24,25)は、少なくとも部分的に前記収容空間(3)に配設されていることを特徴とするハウジング。 - 請求項1乃至3のいずれか1項に記載のハウジングにおいて、
前記メタライジング部(6,7,11,12,14,15,24,25)は、少なくとも部分的に前記射出成形体(4)を貫通していることを特徴とするハウジング。 - 請求項1乃至4のいずれか1項に記載のハウジングにおいて、
前記メタライジング部(6,7,11,12,14,15,24,25)は、少なくとも部分的に前記収容空間(3)の外側に配設されていることを特徴とするハウジング。 - 請求項1乃至5のいずれか1項に記載のハウジングにおいて、
前記射出成形体(4)は、前記収容空間(3)に配設された少なくとも1つのメタライジング部(6,7)を備え、前記射出成形体(4)を貫通する少なくとも1つの貫通接続部として形成されたメタライジング部(11,12)を備え、前記収容空間(3)の外側に配設された少なくとも1つのメタライジング部(14,15)を備え、
前記貫通接続部(11,12)は、前記収容空間(3)において、前記メタライジング部(6,7)を前記メタライジング部(24,25)と前記収容空間(3)の外側で電気的に接続していることを特徴とするハウジング。 - 請求項1乃至6のいずれか1項に記載のハウジングにおいて、
前記メタライジング部(24,25)は、少なくとも部分的に前記収容空間(3)に設けられ、前記射出成形体の表面(26)に沿って前記収容空間(3)から導出されていることを特徴とするハウジング。 - 請求項1乃至7のいずれか1項に記載のハウジングにおいて、
前記収容空間(3)の封止のための蓋(18)を備えることを特徴とするハウジング。 - 請求項1乃至8のいずれか1項に記載のハウジングにおいて、
前記ハウジングは、前記収容空間(3)をハーメチックシール封止するように形成されていることを特徴とするハウジング。 - 請求項1乃至9のいずれか1項に記載のハウジングにおいて、
前記収容空間に通ずる開口部(31)を備えることを特徴とするハウジング。 - 請求項10に記載のハウジングにおいて、前記開口部(31)は、膜またはバルブにより封止されていることを特徴とするハウジング。
- 請求項1乃至11のいずれか1項に記載のハウジングにおいて、
少なくとも1つの前記メタライジング部(6,7,11,12,14,15,24,25)が、前記収容空間から導出され、前記開口部(31)は、前記収容空間(3)で前記ハウジングの1つの側に延び、少なくとも1つの前記メタライジング部(6,7,11,12,14,15,24,25)は、前記収容空間(3)からもう1つの側に導出されていることを特徴とするハウジング。 - 請求項12に記載のハウジングにおいて、前記開口部(31)は前記蓋(18)に配設され、少なくとも1つの前記メタライジング部(6,7,11,12,14,15,24,25)は、前記ハウジング底部(19)に配設されているか、または、前記開口部は前記ハウジング底部(19)に配設され、少なくとも1つの前記メタライジング部(6,7,11,12,14,15,24,25)は、前記蓋(18)が配設された側に配設されていることを特徴とするハウジング。
- 請求項1乃至13のいずれか1項に記載のハウジングを備えた半導体チップであって、
前記半導体チップ(2)は前記ハウジング(1)の前記収容空間(3)に配設されていることを特徴とする半導体チップ。 - 請求項14に記載の半導体チップにおいて、
前記半導体チップは、圧力測定用に作製されていることを特徴とする半導体チップ。
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DE102011109006A DE102011109006A1 (de) | 2011-07-29 | 2011-07-29 | Gehäuse für einen Halbleiterchip und Halbleiterchip mit einem Gehäuse |
DE102011109006.5 | 2011-07-29 | ||
PCT/EP2012/064724 WO2013017530A1 (de) | 2011-07-29 | 2012-07-26 | Gehäuse für einen halbleiterchip und halbleiterchip mit einem gehäuse |
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US20140377915A1 (en) * | 2013-06-20 | 2014-12-25 | Infineon Technologies Ag | Pre-mold for a magnet semiconductor assembly group and method of producing the same |
US20150342069A1 (en) * | 2014-05-20 | 2015-11-26 | Freescale Semiconductor, Inc. | Housing for electronic devices |
JP6950796B2 (ja) * | 2017-10-05 | 2021-10-13 | カシオ計算機株式会社 | 電池モジュールの製造方法 |
CN112687631B (zh) * | 2020-12-25 | 2024-04-26 | 杭州耀芯科技有限公司 | 一种sip封装的装置及制备方法 |
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Also Published As
Publication number | Publication date |
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WO2013017530A1 (de) | 2013-02-07 |
US20140217523A1 (en) | 2014-08-07 |
DE102011109006A1 (de) | 2013-01-31 |
JP6470250B2 (ja) | 2019-02-13 |
JP2017103464A (ja) | 2017-06-08 |
EP2736836B1 (de) | 2023-01-18 |
US9177880B2 (en) | 2015-11-03 |
EP2736836A1 (de) | 2014-06-04 |
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