JP2014520172A5 - - Google Patents
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- Publication number
- JP2014520172A5 JP2014520172A5 JP2014511369A JP2014511369A JP2014520172A5 JP 2014520172 A5 JP2014520172 A5 JP 2014520172A5 JP 2014511369 A JP2014511369 A JP 2014511369A JP 2014511369 A JP2014511369 A JP 2014511369A JP 2014520172 A5 JP2014520172 A5 JP 2014520172A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- filler
- product
- electrical
- electrical device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161485841P | 2011-05-13 | 2011-05-13 | |
| US61/485,841 | 2011-05-13 | ||
| PCT/US2012/033417 WO2012158291A1 (en) | 2011-05-13 | 2012-04-13 | Insulation formulations |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014520172A JP2014520172A (ja) | 2014-08-21 |
| JP2014520172A5 true JP2014520172A5 (https=) | 2016-07-21 |
| JP6030125B2 JP6030125B2 (ja) | 2016-11-24 |
Family
ID=46001815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014511369A Active JP6030125B2 (ja) | 2011-05-13 | 2012-04-13 | 絶縁配合物 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20140079953A1 (https=) |
| EP (1) | EP2707411B1 (https=) |
| JP (1) | JP6030125B2 (https=) |
| KR (1) | KR101901473B1 (https=) |
| CN (1) | CN103649158B (https=) |
| BR (1) | BR112013029224B1 (https=) |
| CA (1) | CA2835651A1 (https=) |
| MX (1) | MX349112B (https=) |
| TW (1) | TWI540146B (https=) |
| WO (1) | WO2012158291A1 (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9196412B2 (en) * | 2011-05-13 | 2015-11-24 | Dow Global Technologies Llc | Insulation formulations |
| US9845387B2 (en) * | 2012-10-19 | 2017-12-19 | Blue Cube Ip Llc | Toughened epoxy thermosets containing core shell rubbers and polyols |
| DE102013205117A1 (de) * | 2013-03-22 | 2014-09-25 | Siemens Aktiengesellschaft | Vergussmasse, Verwendung der Vergussmasse, thermisch gehärteter Komposit erhältlich aus der Vergussmasse und elektrische Maschine mit der Vergussmasse |
| JP6321934B2 (ja) * | 2013-09-30 | 2018-05-09 | マツダ株式会社 | エンジン燃焼室に臨む部材表面の断熱層の製造方法 |
| EP3170868B1 (en) * | 2014-07-18 | 2019-04-24 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate and printed wiring board |
| CN104200876A (zh) * | 2014-08-09 | 2014-12-10 | 张传良 | 一种防火电缆用氧化镁填充料的制备方法 |
| KR101808176B1 (ko) * | 2016-04-07 | 2018-01-18 | (주)창성 | 연자성몰딩액을 이용한 코일매립형인덕터의 제조방법 및 이를 이용하여 제조된 코일매립형인덕터 |
| JP6748032B2 (ja) * | 2017-06-06 | 2020-08-26 | 三菱電機株式会社 | 静止誘導器 |
| KR102094296B1 (ko) * | 2018-07-05 | 2020-03-27 | (주)제니스월드 | 정전척용 흑색 세라믹 페이스트 조성물 및 이를 이용한 정전척 |
| EP3843166A4 (en) * | 2018-09-03 | 2021-10-27 | LG Chem, Ltd. | Encapsulation film |
| CN109401200A (zh) * | 2018-10-29 | 2019-03-01 | 江苏宏鹏电气科技有限公司 | 一种用于母线槽内绝缘衬垫材料的制备配方 |
| CN109687360B (zh) * | 2018-11-27 | 2021-05-25 | 广东中讯通讯设备实业有限公司 | 一种绝缘性能好的硅芯管及其制备方法 |
| EP3958305B1 (en) * | 2020-08-17 | 2023-09-27 | Infineon Technologies AG | Power semiconductor module arrangement and method for producing the same |
| KR102876018B1 (ko) * | 2024-04-03 | 2025-10-23 | 김주영 | 고강도 물성을 갖는 저점도의 진공함침 절연용 에폭시 수지조성물 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2924580A (en) | 1957-08-08 | 1960-02-09 | Union Carbide Corp | Divinyl benzene dioxide compositions |
| US2982752A (en) * | 1958-04-25 | 1961-05-02 | Union Carbide Corp | Composition comprising a polyepoxide and divinylbenzene dioxide |
| GB855025A (en) * | 1958-10-11 | 1960-11-30 | Union Carbide Corp | Improvements in and relating to polymerisable epoxide compositions |
| NL259331A (https=) * | 1959-12-24 | |||
| US4925901A (en) | 1988-02-12 | 1990-05-15 | The Dow Chemical Company | Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds |
| US5189080A (en) * | 1989-04-25 | 1993-02-23 | Robert Bosch Gmbh | Epoxy resin composition for encapsulating electric circuit components |
| JP2524011B2 (ja) * | 1991-05-23 | 1996-08-14 | 株式会社日立製作所 | 高圧コイル注型用熱硬化性樹脂組成物、該組成物で注型、硬化してなるモ―ルドコイル、パネル |
| US5340890A (en) * | 1993-01-28 | 1994-08-23 | Shell Oil Company | Cyclobutene anhydride-cured epoxy resin composition |
| US5898991A (en) * | 1997-01-16 | 1999-05-04 | International Business Machines Corporation | Methods of fabrication of coaxial vias and magnetic devices |
| AU711786B2 (en) * | 1997-05-16 | 1999-10-21 | National Starch And Chemical Investment Holding Corporation | Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers |
| DE19828248A1 (de) | 1998-06-25 | 1999-12-30 | Abb Corporate Research Ltd Bad | Bei niedriger Temperatur härtende Epoxidharzsysteme aus Aminoglycidylverbindungen und cyclischen Carbonsäureanhydriden |
| US6617401B2 (en) * | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
| US6500529B1 (en) * | 2001-09-14 | 2002-12-31 | Tonoga, Ltd. | Low signal loss bonding ply for multilayer circuit boards |
| EP1331234B1 (de) | 2002-01-28 | 2004-09-22 | ABB Research Ltd. | Vergussmasse auf der Basis duroplastischer Epoxidharze |
| US7311972B2 (en) * | 2004-10-14 | 2007-12-25 | Yazaki Corporation | Filled epoxy resin compositions |
| US20060275608A1 (en) * | 2005-06-07 | 2006-12-07 | General Electric Company | B-stageable film, electronic device, and associated process |
| US7378455B2 (en) * | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
| EP2044138A1 (en) | 2006-07-20 | 2009-04-08 | ABB Research Ltd | Hardenable epoxy resin composition |
| EP2064268A4 (en) * | 2006-09-12 | 2013-05-01 | Henkel Ag & Co Kgaa | METHOD FOR CHANGING THE RHEOLOGY IN FILLED RESIN SYSTEMS BY MEANS OF CAVITATION |
| KR101440762B1 (ko) * | 2007-02-06 | 2014-09-17 | 칼 짜이스 에스엠테 게엠베하 | 마이크로리소그래피 투영 노광 장치의 조명 시스템 내의 다수의 미러 어레이들을 감시하는 방법 및 장치 |
| WO2009119513A1 (ja) * | 2008-03-27 | 2009-10-01 | 新日鐵化学株式会社 | エポキシ樹脂組成物及び硬化物 |
| BRPI0918349A2 (pt) | 2008-12-30 | 2015-08-11 | Dow Global Technologies Llc | Processo para preparar dióxido de divinilareno |
| JP5478603B2 (ja) * | 2009-03-05 | 2014-04-23 | 新日鉄住金化学株式会社 | エポキシ樹脂組成物 |
| KR101716634B1 (ko) * | 2009-03-31 | 2017-03-14 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | 에폭시수지, 에폭시수지 조성물 및 경화물 |
| JP5698500B2 (ja) * | 2009-11-23 | 2015-04-08 | ダウ グローバル テクノロジーズ エルエルシー | アンダーフィル用途のためのエポキシ樹脂配合物 |
| KR20120114295A (ko) * | 2009-12-09 | 2012-10-16 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 수지 조성물 |
| JP5390444B2 (ja) * | 2010-03-23 | 2014-01-15 | 新日鉄住金化学株式会社 | 耐アンモニア性エポキシ樹脂組成物およびその成形硬化物 |
| WO2011163154A2 (en) * | 2010-06-25 | 2011-12-29 | Dow Global Technologies Llc | Polymer concrete composition |
| EP2585512A2 (en) * | 2010-06-25 | 2013-05-01 | Dow Global Technologies LLC | Curable epoxy resin compositions and composites made therefrom |
| US9196412B2 (en) * | 2011-05-13 | 2015-11-24 | Dow Global Technologies Llc | Insulation formulations |
| US9330955B2 (en) * | 2013-12-31 | 2016-05-03 | Applied Materials, Inc. | Support ring with masked edge |
-
2012
- 2012-04-13 WO PCT/US2012/033417 patent/WO2012158291A1/en not_active Ceased
- 2012-04-13 MX MX2013013272A patent/MX349112B/es active IP Right Grant
- 2012-04-13 CA CA 2835651 patent/CA2835651A1/en not_active Abandoned
- 2012-04-13 CN CN201280034287.9A patent/CN103649158B/zh active Active
- 2012-04-13 US US14/115,649 patent/US20140079953A1/en not_active Abandoned
- 2012-04-13 KR KR1020137032589A patent/KR101901473B1/ko active Active
- 2012-04-13 BR BR112013029224-5A patent/BR112013029224B1/pt active IP Right Grant
- 2012-04-13 JP JP2014511369A patent/JP6030125B2/ja active Active
- 2012-04-13 EP EP12716947.2A patent/EP2707411B1/en active Active
- 2012-05-11 TW TW101116760A patent/TWI540146B/zh active
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