JP2014512693A5 - - Google Patents

Download PDF

Info

Publication number
JP2014512693A5
JP2014512693A5 JP2014506519A JP2014506519A JP2014512693A5 JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5 JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014506519 A JP2014506519 A JP 2014506519A JP 2014512693 A5 JP2014512693 A5 JP 2014512693A5
Authority
JP
Japan
Prior art keywords
spectrum
spectra
different
instructions
transmission curves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014506519A
Other languages
English (en)
Japanese (ja)
Other versions
JP6017538B2 (ja
JP2014512693A (ja
Filing date
Publication date
Priority claimed from US13/091,965 external-priority patent/US8547538B2/en
Application filed filed Critical
Publication of JP2014512693A publication Critical patent/JP2014512693A/ja
Publication of JP2014512693A5 publication Critical patent/JP2014512693A5/ja
Application granted granted Critical
Publication of JP6017538B2 publication Critical patent/JP6017538B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014506519A 2011-04-21 2012-04-18 環境の影響の変動を伴う基準スペクトルの構築 Active JP6017538B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/091,965 2011-04-21
US13/091,965 US8547538B2 (en) 2011-04-21 2011-04-21 Construction of reference spectra with variations in environmental effects
PCT/US2012/034109 WO2012145418A2 (en) 2011-04-21 2012-04-18 Construction of reference spectra with variations in environmental effects

Publications (3)

Publication Number Publication Date
JP2014512693A JP2014512693A (ja) 2014-05-22
JP2014512693A5 true JP2014512693A5 (OSRAM) 2015-06-11
JP6017538B2 JP6017538B2 (ja) 2016-11-02

Family

ID=47021106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014506519A Active JP6017538B2 (ja) 2011-04-21 2012-04-18 環境の影響の変動を伴う基準スペクトルの構築

Country Status (5)

Country Link
US (1) US8547538B2 (OSRAM)
JP (1) JP6017538B2 (OSRAM)
KR (1) KR101930111B1 (OSRAM)
TW (1) TWI465314B (OSRAM)
WO (1) WO2012145418A2 (OSRAM)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8747189B2 (en) * 2011-04-26 2014-06-10 Applied Materials, Inc. Method of controlling polishing
KR102003326B1 (ko) * 2011-08-01 2019-07-24 노바 메주어링 인스트루먼츠 엘티디. 패턴처리 구조의 측정치 확인용 모니터링 시스템 및 방법
EP2834619A1 (en) * 2012-04-05 2015-02-11 Renishaw Diagnostics Limited A method for calibrating spectroscopy apparatus and equipment for use in the method
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
US9056383B2 (en) 2013-02-26 2015-06-16 Applied Materials, Inc. Path for probe of spectrographic metrology system
US20140242881A1 (en) * 2013-02-27 2014-08-28 Applied Materials, Inc. Feed forward parameter values for use in theoretically generating spectra
TWI487888B (zh) * 2013-09-30 2015-06-11 Ind Tech Res Inst 掃描式光柵光譜儀
KR102497215B1 (ko) 2016-05-16 2023-02-07 삼성전자 주식회사 계측 설비의 스펙트럼 보정방법, 및 그 스펙트럼 보정방법을 기반으로 하는 소자의 계측방법과 제조방법
TWI733915B (zh) * 2016-10-10 2021-07-21 美商應用材料股份有限公司 控制基板的處理的方法，及其研磨系統和電腦程式產品
KR102580487B1 (ko) * 2018-06-18 2023-09-21 주식회사 케이씨텍 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법
WO2020005770A1 (en) 2018-06-28 2020-01-02 Applied Materials, Inc. Training spectrum generation for machine learning system for spectrographic monitoring
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
CN114729835B (zh) * 2019-11-21 2025-09-26 朗姆研究公司 制造室中异常等离子体事件的检测和定位
JP7469032B2 (ja) * 2019-12-10 2024-04-16 株式会社荏原製作所 研磨方法および研磨装置
US11544838B2 (en) * 2020-03-21 2023-01-03 Kla Corporation Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging
JP7503740B2 (ja) * 2020-09-15 2024-06-21 国立大学法人長岡技術科学大学 研磨状態解析予測プログラム、記憶装置、カソードルミネセンス装置、および研磨状態解析予測方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01206236A (ja) * 1988-02-15 1989-08-18 Hitachi Ltd 石英材質判別装置
US6361646B1 (en) * 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
AU4175800A (en) 1999-03-22 2000-10-09 Sensys Instruments Corporation Method and apparatus for wafer metrology
US6334807B1 (en) * 1999-04-30 2002-01-01 International Business Machines Corporation Chemical mechanical polishing in-situ end point system
US6707540B1 (en) 1999-12-23 2004-03-16 Kla-Tencor Corporation In-situ metalization monitoring using eddy current and optical measurements
TW534854B (en) * 2000-08-31 2003-06-01 Motorola Inc Method and apparatus for measuring a polishing condition
JP3804064B2 (ja) * 2001-12-04 2006-08-02 株式会社東京精密 ウェーハ研磨装置の研磨終点検出方法及び装置
TW590850B (en) * 2001-12-28 2004-06-11 Macronix Int Co Ltd Method of determining the endpoint of a chemical mechanical polishing process
JP2004055995A (ja) * 2002-07-23 2004-02-19 Seiko Epson Corp Ｃｍｐ装置、ｃｍｐ研磨方法、半導体装置及びその製造方法
JP4542324B2 (ja) 2002-10-17 2010-09-15 株式会社荏原製作所 研磨状態監視装置及びポリッシング装置
TWI235234B (en) * 2003-07-11 2005-07-01 Air Liquide Method and apparatus for monitoring of slurry consistency
KR100644390B1 (ko) 2005-07-20 2006-11-10 삼성전자주식회사 박막 두께 측정방법 및 이를 수행하기 위한 장치
KR101324644B1 (ko) * 2005-08-22 2013-11-01 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 폴리싱의 스펙트럼 기반 모니터링을 위한 장치 및 방법
US8392012B2 (en) 2008-10-27 2013-03-05 Applied Materials, Inc. Multiple libraries for spectrographic monitoring of zones of a substrate during processing
US7409260B2 (en) 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
US20090182520A1 (en) * 2005-12-12 2009-07-16 Yoav Luxembourg Assessment of diamond color
US7494929B2 (en) 2006-04-27 2009-02-24 Applied Materials, Inc. Automatic gain control
WO2008044786A1 (fr) * 2006-10-06 2008-04-17 Ebara Corporation Procédé de detection de point de fin d'usinage, procédé de rectification, et rectifieuse
KR101504508B1 (ko) * 2007-02-23 2015-03-20 어플라이드 머티어리얼스, 인코포레이티드 연마 엔드포인트들을 결정하기 위한 스펙트럼 사용
TWI446425B (zh) * 2007-08-29 2014-07-21 Applied Materials Inc 高生產量及低表面形貌的銅化學機械研磨製程
JP5367246B2 (ja) * 2007-09-28 2013-12-11 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハの研磨装置及び研磨方法
US20090275265A1 (en) * 2008-05-02 2009-11-05 Applied Materials, Inc. Endpoint detection in chemical mechanical polishing using multiple spectra
JP2010014642A (ja) * 2008-07-07 2010-01-21 Sony Corp 光強度測定方法及び光強度測定装置
US20100103422A1 (en) 2008-10-27 2010-04-29 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
JP5774482B2 (ja) * 2008-10-27 2015-09-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 処理中の基板の分光モニタリングにおける適合度
US20100114532A1 (en) 2008-11-03 2010-05-06 Applied Materials, Inc. Weighted spectrographic monitoring of a substrate during processing
WO2010062910A2 (en) * 2008-11-26 2010-06-03 Applied Materials, Inc. Using optical metrology for feed back and feed forward process control

Similar Documents

Publication Publication Date Title
JP2014512693A5 (OSRAM)
JP2015526135A5 (OSRAM)
JP2010121977A5 (OSRAM)
WO2015178975A3 (en) An optical sensor system and methods of use thereof
WO2013169791A8 (en) Metrology tool with combined x-ray and optical scatterometers
JP2010519771A5 (OSRAM)
JP2013019673A5 (OSRAM)
WO2016092161A8 (fr) Procédé et dispositif de mesure optique
IL247255B (en) Metrology of critical optical dimensions
JP2013514530A5 (OSRAM)
JP2014512704A5 (ja) モデルに基づく、研磨のためのスペクトルライブラリの生成
US20150185155A1 (en) Gem identification method and apparatus
JP2014149266A5 (OSRAM)
MX364007B (es) Arreglo de sensor, dispositivo medidor y metodo de medicion.
JP2011082286A5 (OSRAM)
JP2013083581A5 (OSRAM)
JP2013532912A5 (OSRAM)
JP2017528244A5 (OSRAM)
JP2018043022A5 (OSRAM)
JP2014113466A5 (OSRAM)
JP2015125090A5 (OSRAM)
WO2011103414A3 (en) Reverse interferometric method and apparatus for measuring layer thickness
JP2015219046A5 (OSRAM)
JP5643571B2 (ja) 蛍光推定装置および蛍光推定方法、および蛍光測定装置
JP2011120219A5 (OSRAM)