JP2014511146A - 均一な複数のドーパントを有するシリコンインゴット並びにそれを生成するための方法及び装置 - Google Patents

均一な複数のドーパントを有するシリコンインゴット並びにそれを生成するための方法及び装置 Download PDF

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JP2014511146A
JP2014511146A JP2014505353A JP2014505353A JP2014511146A JP 2014511146 A JP2014511146 A JP 2014511146A JP 2014505353 A JP2014505353 A JP 2014505353A JP 2014505353 A JP2014505353 A JP 2014505353A JP 2014511146 A JP2014511146 A JP 2014511146A
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dopant material
silicon
concentration
zone
crucible
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JP2014511146A5 (enExample
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バヤード ケイ． ジョンソン，
ジョン ピー． デルーカ，
ウィリアム エル． リュテル，
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GT Advanced CZ LLC
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GT Advanced CZ LLC
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    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
    • C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/002—Continuous growth
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/10—Crucibles or containers for supporting the melt
    • C30B15/12—Double crucible methods
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/121—The active layers comprising only Group IV materials
    • H10F71/1221—The active layers comprising only Group IV materials comprising polycrystalline silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/546—Polycrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus
    • Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032—Seed pulling
    • Y10T117/1052—Seed pulling including a sectioned crucible [e.g., double crucible, baffle]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus
    • Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032—Seed pulling
    • Y10T117/1056—Seed pulling including details of precursor replenishment

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  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2014505353A 2011-04-14 2012-04-13 均一な複数のドーパントを有するシリコンインゴット並びにそれを生成するための方法及び装置 Pending JP2014511146A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161475351P 2011-04-14 2011-04-14
US61/475,351 2011-04-14
PCT/US2012/033593 WO2012142463A2 (en) 2011-04-14 2012-04-13 Silicon ingot having uniform multiple dopants and method and apparatus for producing same

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JP2014511146A5 JP2014511146A5 (enExample) 2015-05-07

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JP2016099240A Pending JP2016179937A (ja) 2011-04-14 2016-05-18 均一な複数のドーパントを有するシリコンインゴット並びにそれを生成するための方法及び装置

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US (1) US10202705B2 (enExample)
EP (1) EP2697412B1 (enExample)
JP (2) JP2014511146A (enExample)
KR (1) KR20140097971A (enExample)
CN (1) CN103608496B (enExample)
MY (1) MY173316A (enExample)
PH (1) PH12013502137A1 (enExample)
TW (1) TWI618678B (enExample)
WO (1) WO2012142463A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016060667A (ja) * 2014-09-18 2016-04-25 信越半導体株式会社 抵抗率制御方法、追加ドーパント投入装置、並びに、ｎ型シリコン単結晶
JP2018024580A (ja) * 2014-05-28 2018-02-15 インフィネオン テクノロジーズ アーゲーＩｎｆｉｎｅｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ａｇ 半導体素子、シリコンウエハ、及びシリコンインゴット
JPWO2022071014A1 (enExample) * 2020-09-29 2022-04-07

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FR2994982B1 (fr) * 2012-09-04 2016-01-08 Commissariat Energie Atomique Procede de fabrication d'une plaquette en silicium monolithique a multi-jonctions verticales.
WO2014185572A1 (ko) * 2013-05-16 2014-11-20 (주)에스테크 잉곳 원료 공급시스템
US9822466B2 (en) 2013-11-22 2017-11-21 Corner Star Limited Crystal growing systems and crucibles for enhancing heat transfer to a melt
US10724148B2 (en) * 2014-01-21 2020-07-28 Infineon Technologies Ag Silicon ingot and method of manufacturing a silicon ingot
US10337117B2 (en) 2014-11-07 2019-07-02 Infineon Technologies Ag Method of manufacturing a silicon ingot and silicon ingot
CN104499048A (zh) * 2014-12-07 2015-04-08 海安县石油科研仪器有限公司 一种连续加料的单晶硅生长工艺
WO2018012654A1 (ko) * 2016-07-14 2018-01-18 포토멕 주식회사 실리콘 반도체 잉곳 제조용 투입장치 및 도핑방법
US10920337B2 (en) 2016-12-28 2021-02-16 Globalwafers Co., Ltd. Methods for forming single crystal silicon ingots with improved resistivity control
US20190078231A1 (en) * 2017-09-08 2019-03-14 Corner Star Limited Hybrid crucible assembly for czochralski crystal growth
EP3864197B1 (en) * 2018-10-12 2022-08-03 GlobalWafers Co., Ltd. Dopant concentration control in silicon melt to enhance the ingot quality
WO2020210129A1 (en) 2019-04-11 2020-10-15 Globalwafers Co., Ltd. Process for preparing ingot having reduced distortion at late body length
JP2022529451A (ja) 2019-04-18 2022-06-22 グローバルウェーハズ カンパニー リミテッド 連続チョクラルスキー法を用いる単結晶シリコンインゴットの成長方法
US11111597B2 (en) 2019-09-13 2021-09-07 Globalwafers Co., Ltd. Methods for growing a nitrogen doped single crystal silicon ingot using continuous Czochralski method
WO2021050176A1 (en) * 2019-09-13 2021-03-18 Globalwafers Co., Ltd. Methods for growing a nitrogen doped single crystal silicon ingot using continuous czochralski method and a single crystal silicon ingot grown by this method
US11111596B2 (en) 2019-09-13 2021-09-07 Globalwafers Co., Ltd. Single crystal silicon ingot having axial uniformity
US11499245B2 (en) * 2020-12-30 2022-11-15 Globalwafers Co., Ltd. Additive feed systems, ingot puller apparatus and methods for forming a single crystal silicon ingot with use of such additive feed systems

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JPH01294589A (ja) * 1988-02-04 1989-11-28 Mitsubishi Metal Corp 単結晶の引き上げ方法
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JPH03183686A (ja) * 1989-12-13 1991-08-09 Nippon Steel Corp 単結晶引上げにおけるドーピング方法
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JPS6379790A (ja) * 1986-09-22 1988-04-09 Toshiba Corp 結晶引上げ装置
JPH01294589A (ja) * 1988-02-04 1989-11-28 Mitsubishi Metal Corp 単結晶の引き上げ方法
JPH0283292A (ja) * 1988-09-20 1990-03-23 Nkk Corp シリコン単結晶の製造方法及び製造装置
JPH03183686A (ja) * 1989-12-13 1991-08-09 Nippon Steel Corp 単結晶引上げにおけるドーピング方法
JPH05105576A (ja) * 1991-03-01 1993-04-27 Wacker Chemitronic Ges Elektron Grundstoffe Mbh チヨクラルスキーによるるつぼ引上げ操作時液体シリコンを連続的に追加装填する方法
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018024580A (ja) * 2014-05-28 2018-02-15 インフィネオン テクノロジーズ アーゲーＩｎｆｉｎｅｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ａｇ 半導体素子、シリコンウエハ、及びシリコンインゴット
JP2020074381A (ja) * 2014-05-28 2020-05-14 インフィネオン テクノロジーズ アーゲーＩｎｆｉｎｅｏｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ａｇ 半導体素子、シリコンウエハ、及びシリコンインゴット
US10910475B2 (en) 2014-05-28 2021-02-02 Infineon Technologies Ag Method of manufacturing a silicon wafer
JP2016060667A (ja) * 2014-09-18 2016-04-25 信越半導体株式会社 抵抗率制御方法、追加ドーパント投入装置、並びに、ｎ型シリコン単結晶
JPWO2022071014A1 (enExample) * 2020-09-29 2022-04-07
WO2022071014A1 (ja) * 2020-09-29 2022-04-07 株式会社Sumco シリコン単結晶の製造方法
TWI784689B (zh) * 2020-09-29 2022-11-21 日商Ｓｕｍｃｏ股份有限公司 矽單結晶的製造方法
JP7567929B2 (ja) 2020-09-29 2024-10-16 株式会社Sumco シリコン単結晶の製造方法
US12351937B2 (en) 2020-09-29 2025-07-08 Sumco Corporation Production method for silicon monocrystal

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Publication number Publication date
EP2697412A2 (en) 2014-02-19
EP2697412A4 (en) 2014-09-03
US20120301386A1 (en) 2012-11-29
TW201247560A (en) 2012-12-01
JP2016179937A (ja) 2016-10-13
KR20140097971A (ko) 2014-08-07
EP2697412B1 (en) 2018-07-25
WO2012142463A2 (en) 2012-10-18
US10202705B2 (en) 2019-02-12
MY173316A (en) 2020-01-15
WO2012142463A3 (en) 2013-01-17
PH12013502137A1 (en) 2014-01-13
CN103608496B (zh) 2017-12-26
CN103608496A (zh) 2014-02-26
TWI618678B (zh) 2018-03-21

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