JP2020074381A - 半導体素子、シリコンウエハ、及びシリコンインゴット - Google Patents
半導体素子、シリコンウエハ、及びシリコンインゴット Download PDFInfo
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- JP2020074381A JP2020074381A JP2019182772A JP2019182772A JP2020074381A JP 2020074381 A JP2020074381 A JP 2020074381A JP 2019182772 A JP2019182772 A JP 2019182772A JP 2019182772 A JP2019182772 A JP 2019182772A JP 2020074381 A JP2020074381 A JP 2020074381A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 181
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 181
- 239000010703 silicon Substances 0.000 title claims abstract description 181
- 239000004065 semiconductor Substances 0.000 title claims abstract description 78
- 230000036961 partial effect Effects 0.000 claims abstract description 11
- 239000002019 doping agent Substances 0.000 claims description 119
- 229910052796 boron Inorganic materials 0.000 claims description 101
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 100
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 41
- 229910052698 phosphorus Inorganic materials 0.000 claims description 41
- 239000011574 phosphorus Substances 0.000 claims description 41
- 238000005204 segregation Methods 0.000 claims description 37
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 229910052733 gallium Inorganic materials 0.000 claims description 10
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 230000004323 axial length Effects 0.000 claims description 9
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 230000005669 field effect Effects 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 description 87
- 238000000034 method Methods 0.000 description 41
- 239000000155 melt Substances 0.000 description 29
- 230000008569 process Effects 0.000 description 16
- 239000000370 acceptor Substances 0.000 description 13
- 239000010453 quartz Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000013078 crystal Substances 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 210000000746 body region Anatomy 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- 239000012808 vapor phase Substances 0.000 description 5
- 238000011065 in-situ storage Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229910052580 B4C Inorganic materials 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000006187 pill Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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Abstract
Description
101 第2表面
102 第2表面
110 シリコン溶融体
112 シリコンインゴット
128 制御メカニズム
204 シリコン半導体本体
205 ドリフトゾーン
210 第1表面
211 第2表面
220 第1負荷端子構造
225 第2負荷端子構造
240 誘電体
241 ゲート電極
600 CZ成長システム
601 シリコン溶融体
606 るつぼ支持部
607 ヒーター
608 支持シャフト
609 供給装置
610 シリコン溶融体
612 CZシリコンインゴット
614 シード結晶
615 シード支持部
616 引き上げシャフト
625 ドーパント原料物質
626 表面
627 引き上げメカニズム
628 制御メカニズム
2001 縦型半導体素子
2002 横型半導体素子
2003 パワー半導体ダイオード
2201 アノード領域
2202 エミッタ構造
2203 本体領域
2204 ソース領域
2251 カソード領域
2252 後部側エミッタ
Claims (19)
- 半導体素子であって、
正味n型ドーピングのドリフトゾーンを有するシリコン半導体本体を有し、
n型ドーピングは、p型ドーパントにより、20%〜80%だけ、部分的に補償されており、且つ、前記ドリフトゾーン内の正味n型ドーピング濃度は、1×1013cm−3〜1×1015cm−3の範囲である、半導体素子。 - 前記n型ドーピングは、ボロンによって部分的に補償されたリンを有する請求項1に記載の半導体素子。
- 前記ドリフトゾーン内の前記正味n型ドーピングは、リンよりも小さな偏析係数を有するp型ドーパント種によって更に補償されている請求項2に記載の半導体素子。
- 前記p型ドーパント種は、アルミニウム及びガリウムのうちの少なくとも1つに対応している請求項3に記載の半導体素子。
- ボロンとアルミニウム及びガリウムのうちの前記少なくとも1つとの間の濃度比率は、少なくとも2である請求項4に記載の半導体素子。
- 前記ドリフトゾーンの前記正味nドーピングは、前記シリコン半導体本体の未加工材料のドーピングに対応しており、且つ、
前記ドリフトゾーン内の前記正味ドーピング濃度よりも大きな正味ドーピング濃度を有するpドーピング及びnドーピングされた領域を更に有する請求項1に記載の半導体素子。 - 前記半導体素子は、絶縁ゲートバイポーラトランジスタ、ダイオード、及び絶縁ゲート電界効果トランジスタのうちの1つである請求項1に記載の半導体素子。
- 前記半導体素子は、前記半導体本体の第1表面において第1負荷端子を有すると共に前記第1表面の反対側の第2表面において第2負荷端子を有する縦型パワー半導体素子である請求項1に記載の半導体素子。
- ドナー及びアクセプタによってドーピングされており、且つ、前記ドナー及び前記アクセプタのドーピング濃度の軸方向の傾斜を含むCZシリコンインゴットであって、
前記ドナー及びアクセプタの前記ドーピング濃度の間の差に基づいた電気活性正味ドーピング濃度は、前記アクセプタによる前記ドナーの前記ドーピング濃度の少なくとも20%の部分的な補償に起因し、前記CZシリコンインゴットの軸方向の長さの少なくとも40%について、60%未満だけ、変化している、インゴット。 - 前記電気活性正味ドーピング濃度は、前記CZシリコンインゴットの前記軸方向の長さの前記少なくとも40%について、前記電気活性正味ドーピング濃度の20%未満だけ、変化している請求項9に記載のCZシリコンインゴット。
- 前記ドナーは、リン、ヒ素、及びアンチモンのうちの少なくとも1つを含む請求項9に記載のCZシリコンインゴット。
- 前記アクセプタは、ボロンを含む請求項9に記載のCZシリコンインゴット。
- 前記アクセプタは、アルミニウム、ガリウム、及びインジウムのうちの少なくとも1つを更に含む請求項9に記載のCZシリコンインゴット。
- 正味n型ドーピング濃度は、1×1013cm−3〜3×1014cm−3の範囲である請求項9に記載のCZシリコンインゴット。
- シリコンウエハであって、
正味n型ドーピングを有し、
n型ドーピングは、p型ドーパントにより、20%〜80%だけ、部分的に補償されており、且つ、前記正味n型ドーピング濃度は、1×1013cm−3〜1×1015cm−3の範囲である、シリコンウエハ。 - 前記n型ドーピングは、ボロンによって部分的に補償されたリンを有する請求項15に記載のシリコンウエハ。
- 前記正味n型ドーピングは、リンよりも小さな偏析係数を有するp型ドーパント種によって更に補償されている請求項15に記載のシリコンウエハ。
- 前記p型ドーパント種は、アルミニウム及びガリウムのうちの少なくとも1つに対応している請求項17に記載のシリコンウエハ。
- ボロンとアルミニウム及びガリウムのうちの前記少なくとも1つとの間の濃度比率は、少なくとも2である請求項18に記載のシリコンウエハ。
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