JP2014509455A5 - - Google Patents
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- Publication number
- JP2014509455A5 JP2014509455A5 JP2013555572A JP2013555572A JP2014509455A5 JP 2014509455 A5 JP2014509455 A5 JP 2014509455A5 JP 2013555572 A JP2013555572 A JP 2013555572A JP 2013555572 A JP2013555572 A JP 2013555572A JP 2014509455 A5 JP2014509455 A5 JP 2014509455A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- pad
- metal
- bondable
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 37
- 229910052751 metal Inorganic materials 0.000 claims 25
- 239000002184 metal Substances 0.000 claims 25
- 238000000151 deposition Methods 0.000 claims 7
- 239000002105 nanoparticle Substances 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 6
- 229910052709 silver Inorganic materials 0.000 claims 6
- 239000004332 silver Substances 0.000 claims 6
- 238000005245 sintering Methods 0.000 claims 6
- 229910000679 solder Inorganic materials 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 5
- 229910045601 alloy Inorganic materials 0.000 claims 5
- 239000000956 alloy Substances 0.000 claims 5
- 239000010949 copper Substances 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 4
- 239000007787 solid Substances 0.000 claims 4
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 238000007639 printing Methods 0.000 claims 3
- 238000007650 screen-printing Methods 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000011859 microparticle Substances 0.000 claims 2
- 239000004033 plastic Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims 1
- 239000004809 Teflon Substances 0.000 claims 1
- 229920006362 Teflon® Polymers 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052793 cadmium Inorganic materials 0.000 claims 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002082 metal nanoparticle Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- 239000010948 rhodium Substances 0.000 claims 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161445630P | 2011-02-23 | 2011-02-23 | |
| US61/445,630 | 2011-02-23 | ||
| US13/351,579 | 2012-01-17 | ||
| US13/351,579 US8643165B2 (en) | 2011-02-23 | 2012-01-17 | Semiconductor device having agglomerate terminals |
| PCT/US2012/026378 WO2012116218A2 (en) | 2011-02-23 | 2012-02-23 | Semiconductor packages with agglomerate terminals |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014509455A JP2014509455A (ja) | 2014-04-17 |
| JP2014509455A5 true JP2014509455A5 (https=) | 2015-04-16 |
| JP6116488B2 JP6116488B2 (ja) | 2017-04-19 |
Family
ID=46652081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013555572A Active JP6116488B2 (ja) | 2011-02-23 | 2012-02-23 | 塊状端子を備える半導体パッケージ |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8643165B2 (https=) |
| JP (1) | JP6116488B2 (https=) |
| CN (1) | CN103403864B (https=) |
| WO (1) | WO2012116218A2 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103907185B (zh) * | 2011-08-11 | 2016-10-19 | 联达科技控股有限公司 | 具有多材料印刷形成的包装部件的引线载体 |
| US8586480B1 (en) * | 2012-07-31 | 2013-11-19 | Ixys Corporation | Power MOSFET having selectively silvered pads for clip and bond wire attach |
| KR101988890B1 (ko) * | 2012-10-30 | 2019-10-01 | 한국전자통신연구원 | 솔더 온 패드의 제조방법 및 그를 이용한 플립 칩 본딩 방법 |
| JP6146642B2 (ja) * | 2012-11-30 | 2017-06-14 | 大日本印刷株式会社 | 半導体装置用基板の製造方法および樹脂封止型半導体装置の製造方法 |
| US8815648B1 (en) | 2013-04-01 | 2014-08-26 | Texas Instruments Incorporated | Multi-step sintering of metal paste for semiconductor device wire bonding |
| US9978667B2 (en) * | 2013-08-07 | 2018-05-22 | Texas Instruments Incorporated | Semiconductor package with lead frame and recessed solder terminals |
| US11217515B2 (en) * | 2014-09-11 | 2022-01-04 | Semiconductor Components Industries, Llc | Semiconductor package structures and methods of manufacture |
| US10847691B2 (en) * | 2014-12-11 | 2020-11-24 | Luminus, Inc. | LED flip chip structures with extended contact pads formed by sintering silver |
| US9640468B2 (en) * | 2014-12-24 | 2017-05-02 | Stmicroelectronics S.R.L. | Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device |
| US20180047589A1 (en) * | 2015-05-04 | 2018-02-15 | Eoplex Limited | Lead carrier with print formed package components and conductive path redistribution structures |
| CN107912069A (zh) * | 2015-05-04 | 2018-04-13 | 由普莱克斯有限公司 | 不具有裸片附接垫的引线载体结构和由此形成的封装 |
| US10727085B2 (en) * | 2015-12-30 | 2020-07-28 | Texas Instruments Incorporated | Printed adhesion deposition to mitigate integrated circuit package delamination |
| US9896330B2 (en) * | 2016-01-13 | 2018-02-20 | Texas Instruments Incorporated | Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
| KR102442262B1 (ko) * | 2017-04-21 | 2022-09-08 | 미쓰이 가가쿠 가부시키가이샤 | 반도체 기판의 제조 방법, 반도체 장치 및 그의 제조 방법 |
| US10405417B2 (en) * | 2017-05-01 | 2019-09-03 | Nxp Usa, Inc. | Packaged microelectronic component mounting using sinter attachment |
| FR3083920B1 (fr) * | 2018-07-13 | 2024-12-13 | Linxens Holding | Procede de fabrication de boitiers de composant electronique et boitier de composant electronique obtenu par ce procede |
| CN110391143A (zh) * | 2019-07-02 | 2019-10-29 | 东莞链芯半导体科技有限公司 | 半导体封装结构及其封装方法 |
| US11495557B2 (en) * | 2020-03-20 | 2022-11-08 | Advanced Semiconductor Engineering, Inc. | Semiconductor device and method of manufacturing the same |
| US11562947B2 (en) * | 2020-07-06 | 2023-01-24 | Panjit International Inc. | Semiconductor package having a conductive pad with an anchor flange |
| CN113814597A (zh) * | 2021-10-28 | 2021-12-21 | 株洲中车时代半导体有限公司 | 电子器件的焊接方法 |
| CN114883284A (zh) * | 2022-03-25 | 2022-08-09 | 清华大学 | 碳化硅芯片的耐高温封装结构及其制备方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5318651A (en) * | 1991-11-27 | 1994-06-07 | Nec Corporation | Method of bonding circuit boards |
| JP2001250884A (ja) * | 2000-03-08 | 2001-09-14 | Sanyo Electric Co Ltd | 回路装置の製造方法 |
| WO2002035554A1 (en) | 2000-10-25 | 2002-05-02 | Harima Chemicals, Inc. | Electroconductive metal paste and method for production thereof |
| DE10206818A1 (de) | 2002-02-18 | 2003-08-28 | Infineon Technologies Ag | Elektronisches Bauteil mit Klebstoffschicht und Verfahren zur Herstellung derselben |
| US20040245648A1 (en) | 2002-09-18 | 2004-12-09 | Hiroshi Nagasawa | Bonding material and bonding method |
| DE10245451B4 (de) * | 2002-09-27 | 2005-07-28 | Infineon Technologies Ag | Elektronisches Bauteil mit einem Halbleiterchip, der flexible Chipkontakte aufweist, und Verfahren zur Herstellung desselben, sowie Halbleiterwafer |
| EP1615263A4 (en) * | 2003-02-05 | 2006-10-18 | Senju Metal Industry Co | METHOD FOR CONNECTING CONNECTIONS AND METHOD FOR ATTACHING A SEMICONDUCTOR CONSTRUCTION ELEMENT |
| WO2004103043A1 (ja) | 2003-05-16 | 2004-11-25 | Harima Chemicals, Inc. | 銅微粒子焼結体型の微細形状導電体の形成方法、該方法を応用した銅微細配線ならびに銅薄膜の形成方法 |
| KR100740634B1 (ko) | 2003-09-12 | 2007-07-18 | 내셔날 인스티튜트 오브 어드밴스드 인더스트리얼 사이언스 앤드 테크놀로지 | 미세한 액적(液滴)의 형상으로 분사해, 적층 도포 가능한금속 나노 입자 분산액 |
| US8053171B2 (en) * | 2004-01-16 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and EL television |
| EP1780732B1 (en) | 2004-06-23 | 2009-04-01 | Harima Chemicals, Inc. | Conductive metal paste |
| KR101091896B1 (ko) * | 2004-09-04 | 2011-12-08 | 삼성테크윈 주식회사 | 플립칩 반도체 패키지 및 그 제조방법 |
| US7550319B2 (en) * | 2005-09-01 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof |
| US7982307B2 (en) * | 2006-11-22 | 2011-07-19 | Agere Systems Inc. | Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate |
| JP2008153470A (ja) | 2006-12-18 | 2008-07-03 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
| US7955901B2 (en) * | 2007-10-04 | 2011-06-07 | Infineon Technologies Ag | Method for producing a power semiconductor module comprising surface-mountable flat external contacts |
| US7836586B2 (en) | 2008-08-21 | 2010-11-23 | National Semiconductor Corporation | Thin foil semiconductor package |
| US7754533B2 (en) | 2008-08-28 | 2010-07-13 | Infineon Technologies Ag | Method of manufacturing a semiconductor device |
| US9041228B2 (en) * | 2008-12-23 | 2015-05-26 | Micron Technology, Inc. | Molding compound including a carbon nano-tube dispersion |
| JP5617210B2 (ja) * | 2009-09-14 | 2014-11-05 | デクセリアルズ株式会社 | 光反射性異方性導電接着剤及び発光装置 |
| JP5532419B2 (ja) * | 2010-06-17 | 2014-06-25 | 富士電機株式会社 | 絶縁材、金属ベース基板および半導体モジュール並びにこれらの製造方法 |
-
2012
- 2012-01-17 US US13/351,579 patent/US8643165B2/en active Active
- 2012-02-23 CN CN201280010020.6A patent/CN103403864B/zh active Active
- 2012-02-23 JP JP2013555572A patent/JP6116488B2/ja active Active
- 2012-02-23 WO PCT/US2012/026378 patent/WO2012116218A2/en not_active Ceased
-
2013
- 2013-09-27 US US14/040,089 patent/US8716068B2/en active Active
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