JP2014502429A - トンネル電界効果トランジスタ - Google Patents
トンネル電界効果トランジスタ Download PDFInfo
- Publication number
- JP2014502429A JP2014502429A JP2013543189A JP2013543189A JP2014502429A JP 2014502429 A JP2014502429 A JP 2014502429A JP 2013543189 A JP2013543189 A JP 2013543189A JP 2013543189 A JP2013543189 A JP 2013543189A JP 2014502429 A JP2014502429 A JP 2014502429A
- Authority
- JP
- Japan
- Prior art keywords
- field effect
- effect transistor
- tunnel field
- indium
- gallium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005669 field effect Effects 0.000 title claims abstract description 49
- 230000007704 transition Effects 0.000 claims abstract description 43
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 21
- 229910052738 indium Inorganic materials 0.000 claims description 16
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical group [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 claims description 14
- 229910052733 gallium Inorganic materials 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910000967 As alloy Inorganic materials 0.000 claims description 11
- 229910052787 antimony Inorganic materials 0.000 claims description 10
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 10
- 229910000807 Ga alloy Inorganic materials 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 7
- -1 arsenide Chemical compound 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 239000011574 phosphorus Substances 0.000 claims description 7
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical group [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910001245 Sb alloy Inorganic materials 0.000 claims description 3
- 239000002140 antimony alloy Substances 0.000 claims description 3
- 229910000673 Indium arsenide Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000004377 microelectronic Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 43
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- KXNLCSXBJCPWGL-UHFFFAOYSA-N [Ga].[As].[In] Chemical compound [Ga].[As].[In] KXNLCSXBJCPWGL-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000013341 scale-up Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7391—Gated diode structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Memories (AREA)
Abstract
【選択図】図1a
Description
Claims (20)
- ソース構造と、
前記ソース構造に隣接する遷移層と、
前記遷移層に隣接する真性チャネル層と、
前記真性チャネル層に隣接するドレイン構造と
を備える、トンネル電界効果トランジスタ。 - 前記ソース構造は、アルミ、アンチモン、ヒ化物、ガリウム、インジウム、窒素、またはリンの合金である、請求項1に記載のトンネル電界効果トランジスタ。
- 前記ソース構造はガリウム/ヒ素/アンチモン合金である、請求項2に記載のトンネル電界効果トランジスタ。
- 前記ソース構造はインジウム/ガリウム/ヒ素合金である、請求項2に記載のトンネル電界効果トランジスタ。
- 前記遷移層は、アルミ、アンチモン、ヒ化物、ガリウム、インジウム、窒素、またはリンの合金である、請求項1から4のいずれか1項に記載のトンネル電界効果トランジスタ。
- 前記遷移層はヒ化インジウムである、請求項2から5のいずれか1項に記載のトンネル電界効果トランジスタ。
- 前記遷移層はインジウム/ガリウム/ヒ素合金である、請求項2から5のいずれか1項に記載のトンネル電界効果トランジスタ。
- 前記真性チャネル層は、アルミ、アンチモン、ヒ化物、ガリウム、インジウム、窒素、またはリンの合金である、請求項1から7のいずれか1項に記載のトンネル電界効果トランジスタ。
- 前記真性チャネル層はリン化インジウムである、請求項2から8のいずれか1項に記載のトンネル電界効果トランジスタ。
- 前記真性チャネル層は複数の層である、請求項2から9のいずれか1項に記載のトンネル電界効果トランジスタ。
- プロセッサと、
前記プロセッサとデータ通信を行うメモリデバイスと
を備え、
前記プロセッサおよび前記メモリデバイスのうち少なくとも一方が、1以上のトンネル電界効果トランジスタを有し、
前記1以上のトンネル電界効果トランジスタは、
ソース構造と、
前記ソース構造に隣接する遷移層と、
前記遷移層に隣接する真性チャネル層と、
前記真性チャネル層に隣接するドレイン構造と
を含む、電子システム。 - 前記ソース構造は、アルミ、アンチモン、ヒ化物、ガリウム、インジウム、窒素、またはリンの合金である、請求項11に記載の電子システム。
- 前記ソース構造はガリウム/ヒ素/アンチモン合金である、請求項12に記載の電子システム。
- 前記ソース構造はインジウム/ガリウム/ヒ素合金である、請求項12に記載の電子システム。
- 前記遷移層は、アルミ、アンチモン、ヒ化物、ガリウム、インジウム、窒素、またはリンの合金である、請求項11から14のいずれか1項に記載の電子システム。
- 前記遷移層はヒ化インジウムである、請求項12から15のいずれか1項に記載の電子システム。
- 前記遷移層はインジウム/ガリウム/ヒ素合金である、請求項12から15のいずれか1項に記載の電子システム。
- 前記真性チャネル層は、アルミ、アンチモン、ヒ化物、ガリウム、インジウム、窒素、またはリンの合金である、請求項11から17のいずれか1項に記載の電子システム。
- 前記真性チャネル層はリン化インジウムである、請求項12から18のいずれか1項に記載の電子システム。
- 前記真性チャネル層は複数の層である、請求項12から19のいずれか1項に記載の電子システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/972,057 US8890118B2 (en) | 2010-12-17 | 2010-12-17 | Tunnel field effect transistor |
US12/972,057 | 2010-12-17 | ||
PCT/US2011/061792 WO2012082329A2 (en) | 2010-12-17 | 2011-11-22 | Tunnel field effect transistor |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015108813A Division JP6045636B2 (ja) | 2010-12-17 | 2015-05-28 | トンネル電界効果トランジスタ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014502429A true JP2014502429A (ja) | 2014-01-30 |
JP5757594B2 JP5757594B2 (ja) | 2015-07-29 |
Family
ID=46233196
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013543189A Expired - Fee Related JP5757594B2 (ja) | 2010-12-17 | 2011-11-22 | トンネル電界効果トランジスタ |
JP2015108813A Expired - Fee Related JP6045636B2 (ja) | 2010-12-17 | 2015-05-28 | トンネル電界効果トランジスタ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015108813A Expired - Fee Related JP6045636B2 (ja) | 2010-12-17 | 2015-05-28 | トンネル電界効果トランジスタ |
Country Status (8)
Country | Link |
---|---|
US (1) | US8890118B2 (ja) |
EP (1) | EP2652790A4 (ja) |
JP (2) | JP5757594B2 (ja) |
KR (1) | KR101487634B1 (ja) |
CN (1) | CN103262249B (ja) |
SG (1) | SG191001A1 (ja) |
TW (1) | TWI476920B (ja) |
WO (1) | WO2012082329A2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016171216A (ja) * | 2015-03-12 | 2016-09-23 | 国立研究開発法人物質・材料研究機構 | トンネル電界効果トランジスタ及びその使用方法 |
CN108140673A (zh) * | 2015-11-27 | 2018-06-08 | 华为技术有限公司 | 隧穿场效应晶体管及其制造方法 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8890118B2 (en) | 2010-12-17 | 2014-11-18 | Intel Corporation | Tunnel field effect transistor |
JP2013038336A (ja) * | 2011-08-10 | 2013-02-21 | Toshiba Corp | 半導体装置 |
TWI556430B (zh) | 2013-07-16 | 2016-11-01 | 國立清華大學 | 非對稱閘極的穿隧式電晶體 |
JP6331375B2 (ja) * | 2013-12-17 | 2018-05-30 | 富士通株式会社 | 電界効果型半導体装置 |
WO2015099686A1 (en) * | 2013-12-23 | 2015-07-02 | Intel Corporation | Heterogeneous pocket for tunneling field effect transistors (tfets) |
KR20150085663A (ko) * | 2014-01-16 | 2015-07-24 | 삼성전자주식회사 | 터널링 전계 효과 트랜지스터 |
EP3123522A4 (en) * | 2014-03-27 | 2017-11-22 | Intel Corporation | Multiplexor logic functions implemented with circuits having tunneling field effect transistors (tfets) |
CN106062967B (zh) * | 2014-03-27 | 2019-12-31 | 英特尔公司 | 具有袋状部的p隧穿场效应晶体管器件 |
EP2993696B1 (en) | 2014-09-02 | 2020-08-05 | IMEC vzw | Heterosection tunnel field-effect transistor (TFET) |
EP3010044B1 (en) * | 2014-10-13 | 2019-02-13 | IMEC vzw | Layered structure of a p-TFET |
KR101703657B1 (ko) | 2015-04-17 | 2017-02-08 | 서울시립대학교 산학협력단 | 전계 강화 터널 전계 효과 트랜지스터 |
KR101639260B1 (ko) | 2015-05-07 | 2016-07-13 | 서울시립대학교 산학협력단 | 하이브리드 반도체 소자 및 그 제조 방법 |
CN105047719B (zh) * | 2015-08-11 | 2018-03-06 | 西安电子科技大学 | 基于InAsN‑GaAsSb材料的交错型异质结隧穿场效应晶体管 |
US11264452B2 (en) * | 2015-12-29 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Hetero-tunnel field-effect transistor (TFET) having a tunnel barrier formed directly above channel region, directly below first source/drain region and adjacent gate electrode |
CN106783986B (zh) * | 2016-11-29 | 2020-06-26 | 林伟 | 一种硅基异质结遂穿场效应晶体管 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070178650A1 (en) * | 2006-02-01 | 2007-08-02 | International Business Machines Corporation | Heterojunction tunneling field effect transistors, and methods for fabricating the same |
JP2008021970A (ja) * | 2006-05-22 | 2008-01-31 | Qimonda North America Corp | トンネル電界効果トランジスタを用いたメモリ |
JP2008072104A (ja) * | 2006-09-15 | 2008-03-27 | Interuniv Micro Electronica Centrum Vzw | シリコンナノワイヤに基づくトンネル効果トランジスタ |
US20080073641A1 (en) * | 2006-09-27 | 2008-03-27 | Amberwave Systems Corporation | Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures |
JP2008252086A (ja) * | 2007-03-12 | 2008-10-16 | Interuniv Micro Electronica Centrum Vzw | ゲートトンネル障壁を持つトンネル電界効果トランジスタ |
WO2008146157A2 (en) * | 2007-05-31 | 2008-12-04 | The Regents At The University Of California | Low voltage transistors |
US20090026553A1 (en) * | 2007-07-25 | 2009-01-29 | Krishna Kumar Bhuwalka | Tunnel Field-Effect Transistor with Narrow Band-Gap Channel and Strong Gate Coupling |
US20100163845A1 (en) * | 2008-12-30 | 2010-07-01 | Niti Goel | Tunnel field effect transistor and method of manufacturing same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4962409A (en) * | 1987-01-20 | 1990-10-09 | International Business Machines Corporation | Staggered bandgap gate field effect transistor |
US5552330A (en) * | 1994-03-11 | 1996-09-03 | Motorola | Resonant tunneling fet and methods of fabrication |
DE102004047610B4 (de) * | 2004-09-30 | 2006-08-24 | Infineon Technologies Ag | Integrierte Speicher-Schaltungsanordnung mit Tunnel-Feldeffekttransistor als Ansteuertransistor |
US7446372B2 (en) * | 2005-09-01 | 2008-11-04 | Micron Technology, Inc. | DRAM tunneling access transistor |
US7893476B2 (en) | 2006-09-15 | 2011-02-22 | Imec | Tunnel effect transistors based on silicon nanowires |
EP1900681B1 (en) * | 2006-09-15 | 2017-03-15 | Imec | Tunnel Field-Effect Transistors based on silicon nanowires |
US8124959B2 (en) * | 2007-06-28 | 2012-02-28 | Intel Corporation | High hole mobility semiconductor device |
EP2267782A3 (en) * | 2009-06-24 | 2013-03-13 | Imec | Control of tunneling junction in a hetero tunnel field effect transistor |
US8143113B2 (en) * | 2009-12-04 | 2012-03-27 | International Business Machines Corporation | Omega shaped nanowire tunnel field effect transistors fabrication |
US8436422B2 (en) * | 2010-03-08 | 2013-05-07 | Sematech, Inc. | Tunneling field-effect transistor with direct tunneling for enhanced tunneling current |
US8258031B2 (en) * | 2010-06-15 | 2012-09-04 | International Business Machines Corporation | Fabrication of a vertical heterojunction tunnel-FET |
US8890118B2 (en) | 2010-12-17 | 2014-11-18 | Intel Corporation | Tunnel field effect transistor |
-
2010
- 2010-12-17 US US12/972,057 patent/US8890118B2/en not_active Expired - Fee Related
-
2011
- 2011-11-22 SG SG2013043294A patent/SG191001A1/en unknown
- 2011-11-22 WO PCT/US2011/061792 patent/WO2012082329A2/en unknown
- 2011-11-22 CN CN201180060425.6A patent/CN103262249B/zh not_active Expired - Fee Related
- 2011-11-22 EP EP11849724.7A patent/EP2652790A4/en not_active Withdrawn
- 2011-11-22 JP JP2013543189A patent/JP5757594B2/ja not_active Expired - Fee Related
- 2011-11-22 KR KR1020137015373A patent/KR101487634B1/ko active IP Right Grant
- 2011-11-23 TW TW100142912A patent/TWI476920B/zh active
-
2015
- 2015-05-28 JP JP2015108813A patent/JP6045636B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070178650A1 (en) * | 2006-02-01 | 2007-08-02 | International Business Machines Corporation | Heterojunction tunneling field effect transistors, and methods for fabricating the same |
JP2008021970A (ja) * | 2006-05-22 | 2008-01-31 | Qimonda North America Corp | トンネル電界効果トランジスタを用いたメモリ |
JP2008072104A (ja) * | 2006-09-15 | 2008-03-27 | Interuniv Micro Electronica Centrum Vzw | シリコンナノワイヤに基づくトンネル効果トランジスタ |
US20080073641A1 (en) * | 2006-09-27 | 2008-03-27 | Amberwave Systems Corporation | Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures |
JP2008252086A (ja) * | 2007-03-12 | 2008-10-16 | Interuniv Micro Electronica Centrum Vzw | ゲートトンネル障壁を持つトンネル電界効果トランジスタ |
WO2008146157A2 (en) * | 2007-05-31 | 2008-12-04 | The Regents At The University Of California | Low voltage transistors |
US20090026553A1 (en) * | 2007-07-25 | 2009-01-29 | Krishna Kumar Bhuwalka | Tunnel Field-Effect Transistor with Narrow Band-Gap Channel and Strong Gate Coupling |
US20100163845A1 (en) * | 2008-12-30 | 2010-07-01 | Niti Goel | Tunnel field effect transistor and method of manufacturing same |
Non-Patent Citations (1)
Title |
---|
JPN6014032307; Han Zhao et al.: 'In0.7Ga0.3As Tunneling Field-Effect Transistors With an Ion of 50 muA / mum and a Subthreshold Swing' IEEE Electron Device Letters Volume:31 , Issue: 12, 20101018, pp. 1392 - pp. 1394 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016171216A (ja) * | 2015-03-12 | 2016-09-23 | 国立研究開発法人物質・材料研究機構 | トンネル電界効果トランジスタ及びその使用方法 |
CN108140673A (zh) * | 2015-11-27 | 2018-06-08 | 华为技术有限公司 | 隧穿场效应晶体管及其制造方法 |
CN108140673B (zh) * | 2015-11-27 | 2021-02-09 | 华为技术有限公司 | 隧穿场效应晶体管及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI476920B (zh) | 2015-03-11 |
KR20130086243A (ko) | 2013-07-31 |
JP6045636B2 (ja) | 2016-12-14 |
CN103262249A (zh) | 2013-08-21 |
JP5757594B2 (ja) | 2015-07-29 |
SG191001A1 (en) | 2013-07-31 |
US20120153263A1 (en) | 2012-06-21 |
WO2012082329A3 (en) | 2012-09-07 |
CN103262249B (zh) | 2016-11-23 |
EP2652790A2 (en) | 2013-10-23 |
WO2012082329A2 (en) | 2012-06-21 |
KR101487634B1 (ko) | 2015-01-29 |
TW201244091A (en) | 2012-11-01 |
EP2652790A4 (en) | 2015-10-07 |
JP2015213175A (ja) | 2015-11-26 |
US8890118B2 (en) | 2014-11-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6045636B2 (ja) | トンネル電界効果トランジスタ | |
US9530878B2 (en) | III-N material structure for gate-recessed transistors | |
US8598636B2 (en) | Heat dissipation structure of SOI field effect transistor | |
US10243069B2 (en) | Gallium nitride transistor having a source/drain structure including a single-crystal portion abutting a 2D electron gas | |
US7709311B1 (en) | JFET device with improved off-state leakage current and method of fabrication | |
CN103943674A (zh) | 高电子迁移率晶体管 | |
US11862715B2 (en) | Vertical tunneling field-effect transistors | |
US7525136B2 (en) | JFET device with virtual source and drain link regions and method of fabrication | |
US11756998B2 (en) | Source-channel junction for III-V metal-oxide-semiconductor field effect transistors (MOSFETs) | |
WO2017111929A1 (en) | P-channel oxide semiconductor thin film transistor | |
US11695081B2 (en) | Channel layer formation for III-V metal-oxide-semiconductor field effect transistors (MOSFETs) | |
WO2017111826A1 (en) | Deuterium anneal for non-planar iii-v field effect transistor | |
US20200312973A1 (en) | Dual transistor gate workfunctions and related apparatuses, systems, and methods | |
WO2019168523A1 (en) | Vertical tunneling field-effect transistors | |
WO2019133013A1 (en) | Source to channel junction for iii-v metal-oxide-semiconductor field effect transistors (mosfets) | |
US11515402B2 (en) | Microelectronic transistor source/drain formation using angled etching | |
WO2017111831A1 (en) | Stackable switching device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140731 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140805 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141105 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150407 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20150430 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150528 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5757594 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |