|
TWI547454B
(zh)
*
|
2011-05-31 |
2016-09-01 |
康寧公司 |
於玻璃中高速製造微孔洞的方法
|
|
US9938186B2
(en)
|
2012-04-13 |
2018-04-10 |
Corning Incorporated |
Strengthened glass articles having etched features and methods of forming the same
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
WO2014085660A1
(en)
|
2012-11-29 |
2014-06-05 |
Corning Incorporated |
Sacrificial cover layers for laser drilling substrates and methods thereof
|
|
WO2014085663A1
(en)
*
|
2012-11-29 |
2014-06-05 |
Corning Incorporated |
Methods of fabricating glass articles by laser damage and etching
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
CN105592994B
(zh)
*
|
2013-08-07 |
2018-10-12 |
通快激光与系统工程有限公司 |
用于加工板状工件的方法和装置及由这类工件制成的产品
|
|
US9296646B2
(en)
|
2013-08-29 |
2016-03-29 |
Corning Incorporated |
Methods for forming vias in glass substrates
|
|
US10005152B2
(en)
*
|
2013-11-19 |
2018-06-26 |
Rofin-Sinar Technologies Llc |
Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US10288792B2
(en)
*
|
2014-01-29 |
2019-05-14 |
Corning Incorporated |
Laser featured glass for display illumination
|
|
JP6262039B2
(ja)
|
2014-03-17 |
2018-01-17 |
株式会社ディスコ |
板状物の加工方法
|
|
TWI556898B
(zh)
*
|
2014-04-29 |
2016-11-11 |
Nat Inst Chung Shan Science & Technology |
A method and system for preparing vertical micro-guide hole on fly black laser on opaque ceramic sheet
|
|
CN106470953B
(zh)
*
|
2014-04-30 |
2019-03-12 |
康宁股份有限公司 |
用于制造穿通玻璃通孔的接合材料的回蚀工艺
|
|
JP6301203B2
(ja)
*
|
2014-06-02 |
2018-03-28 |
株式会社ディスコ |
チップの製造方法
|
|
KR102445217B1
(ko)
|
2014-07-08 |
2022-09-20 |
코닝 인코포레이티드 |
재료를 레이저 가공하는 방법 및 장치
|
|
WO2016010943A2
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for arresting crack propagation
|
|
WO2016010949A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for forming perforations
|
|
US10526234B2
(en)
|
2014-07-14 |
2020-01-07 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
LT3169477T
(lt)
|
2014-07-14 |
2020-05-25 |
Corning Incorporated |
Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
|
|
JP2017525155A
(ja)
|
2014-07-30 |
2017-08-31 |
コーニング インコーポレイテッド |
超音波槽及び一様ガラス基板エッチングのための方法
|
|
JP2016070900A
(ja)
*
|
2014-10-02 |
2016-05-09 |
セイコーエプソン株式会社 |
磁気計測装置の製造方法、ガスセルの製造方法、磁気計測装置、およびガスセル
|
|
JP2016080613A
(ja)
*
|
2014-10-21 |
2016-05-16 |
セイコーエプソン株式会社 |
磁気計測装置、ガスセル、磁気計測装置の製造方法、およびガスセルの製造方法
|
|
TWI689630B
(zh)
|
2014-11-05 |
2020-04-01 |
美商康寧公司 |
底部向上電解質通孔鍍覆方法
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
JP6104354B2
(ja)
*
|
2014-12-16 |
2017-03-29 |
旭硝子株式会社 |
貫通孔形成方法、貫通孔形成装置、および貫通孔を有するガラス基板の製造方法
|
|
JP2018507154A
(ja)
|
2015-01-12 |
2018-03-15 |
コーニング インコーポレイテッド |
マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
|
|
JP7292006B2
(ja)
|
2015-03-24 |
2023-06-16 |
コーニング インコーポレイテッド |
ディスプレイガラス組成物のレーザ切断及び加工
|
|
CN107666983B
(zh)
*
|
2015-03-27 |
2020-10-02 |
康宁股份有限公司 |
可透气窗及其制造方法
|
|
WO2016176171A1
(en)
|
2015-04-28 |
2016-11-03 |
Corning Incorporated |
Method of laser drilling through holes in substrates using an exit sacrificial cover layer; corresponding workpiece
|
|
EP3297967A1
(en)
*
|
2015-05-18 |
2018-03-28 |
Corning Incorporated |
Glass articles comprising light extraction features and methods for making the same
|
|
US20160347643A1
(en)
*
|
2015-05-29 |
2016-12-01 |
Asahi Glass Company, Limited |
Glass substrate manufacturing method
|
|
TW201704177A
(zh)
*
|
2015-06-10 |
2017-02-01 |
康寧公司 |
蝕刻玻璃基板的方法及玻璃基板
|
|
US11186060B2
(en)
*
|
2015-07-10 |
2021-11-30 |
Corning Incorporated |
Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
|
|
RU2598011C1
(ru)
*
|
2015-07-16 |
2016-09-20 |
федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" (Университет ИТМО) |
Способ изготовления полой трехмерной структуры в объеме пластины фоточувствительного стекла
|
|
KR20180048891A
(ko)
*
|
2015-08-31 |
2018-05-10 |
닛본 이따 가라스 가부시끼가이샤 |
미세 구조를 갖는 유리의 제조 방법
|
|
US20170103249A1
(en)
|
2015-10-09 |
2017-04-13 |
Corning Incorporated |
Glass-based substrate with vias and process of forming the same
|
|
JP2017088467A
(ja)
*
|
2015-11-16 |
2017-05-25 |
旭硝子株式会社 |
ガラス基板に孔を形成する装置および方法
|
|
US10292275B2
(en)
*
|
2016-04-06 |
2019-05-14 |
AGC Inc. |
Method of manufacturing glass substrate that has through hole, method of forming through hole in glass substrate and system for manufacturing glass substrate that has through hole
|
|
JP6885161B2
(ja)
*
|
2016-04-06 |
2021-06-09 |
Ａｇｃ株式会社 |
貫通孔を有するガラス基板の製造方法およびガラス基板に貫通孔を形成する方法
|
|
SG11201809797PA
(en)
|
2016-05-06 |
2018-12-28 |
Corning Inc |
Laser cutting and removal of contoured shapes from transparent substrates
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
JP6911288B2
(ja)
*
|
2016-06-23 |
2021-07-28 |
凸版印刷株式会社 |
ガラスの加工方法
|
|
US10134657B2
(en)
|
2016-06-29 |
2018-11-20 |
Corning Incorporated |
Inorganic wafer having through-holes attached to semiconductor wafer
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
KR20190035805A
(ko)
|
2016-07-29 |
2019-04-03 |
코닝 인코포레이티드 |
레이저 처리를 위한 장치 및 방법
|
|
JP2018024571A
(ja)
*
|
2016-08-05 |
2018-02-15 |
旭硝子株式会社 |
孔を有するガラス基板の製造方法
|
|
US10522963B2
(en)
|
2016-08-30 |
2019-12-31 |
Corning Incorporated |
Laser cutting of materials with intensity mapping optical system
|
|
TW201815710A
(zh)
|
2016-08-31 |
2018-05-01 |
美商康寧公司 |
具有經填充之孔洞的經強化玻璃系物件及製造其之方法
|
|
JP6341245B2
(ja)
|
2016-09-05 |
2018-06-13 |
大日本印刷株式会社 |
貫通電極基板の製造方法、貫通電極基板および半導体装置
|
|
US10366904B2
(en)
|
2016-09-08 |
2019-07-30 |
Corning Incorporated |
Articles having holes with morphology attributes and methods for fabricating the same
|
|
TW201822282A
(zh)
|
2016-09-09 |
2018-06-16 |
美商康寧公司 |
具有通孔的低表面粗糙度基板及其製作方法
|
|
CN109803786B
(zh)
|
2016-09-30 |
2021-05-07 |
康宁股份有限公司 |
使用非轴对称束斑对透明工件进行激光加工的设备和方法
|
|
WO2018074560A1
(ja)
*
|
2016-10-20 |
2018-04-26 |
旭硝子株式会社 |
孔を有するガラス基板の製造方法、インターポーザの製造方法、およびガラス基板に孔を形成する方法
|
|
US11542190B2
(en)
|
2016-10-24 |
2023-01-03 |
Corning Incorporated |
Substrate processing station for laser-based machining of sheet-like glass substrates
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
WO2018085249A1
(en)
|
2016-11-04 |
2018-05-11 |
Corning Incorporated |
Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
EP3592500B1
(de)
*
|
2017-03-06 |
2023-10-11 |
LPKF Laser & Electronics SE |
Verfahren zum einbringen zumindest einer ausnehmung in ein material mittels elektromagnetischer strahlung und anschliessendem ätzprozess
|
|
CN106848832A
(zh)
*
|
2017-04-24 |
2017-06-13 |
西南石油大学 |
一种小型化单巴条端面泵浦脉冲激光器
|
|
US11630076B2
(en)
|
2017-04-28 |
2023-04-18 |
Corning Incorporated |
Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10626040B2
(en)
*
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
US20190024237A1
(en)
|
2017-07-20 |
2019-01-24 |
Corning Incorporated |
Methods for metalizing vias within a substrate
|
|
US20190062196A1
(en)
*
|
2017-08-25 |
2019-02-28 |
Corning Incorporated |
Apparatuses and methods for laser processing transparent workpieces using an afocal beam adjustment assembly
|
|
US11654657B2
(en)
|
2017-10-27 |
2023-05-23 |
Corning Incorporated |
Through glass via fabrication using a protective material
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
WO2019135985A1
(en)
|
2018-01-03 |
2019-07-11 |
Corning Incorporated |
Methods for making electrodes and providing electrical connections in sensors
|
|
US10917966B2
(en)
|
2018-01-29 |
2021-02-09 |
Corning Incorporated |
Articles including metallized vias
|
|
TWI675126B
(zh)
*
|
2018-02-14 |
2019-10-21 |
國立臺灣大學 |
針對矽晶圓之經製絨的表面上孔洞之擴孔方法
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
JP7316999B2
(ja)
*
|
2018-04-05 |
2023-07-28 |
ヌヴォトンテクノロジージャパン株式会社 |
試料分割方法、半導体素子の製造方法及び半導体素子
|
|
US11152294B2
(en)
|
2018-04-09 |
2021-10-19 |
Corning Incorporated |
Hermetic metallized via with improved reliability
|
|
EP3853394A1
(en)
|
2018-09-20 |
2021-07-28 |
Industrial Technology Research Institute |
Copper metallization for through-glass vias on thin glass
|
|
WO2020112710A1
(en)
|
2018-11-27 |
2020-06-04 |
Corning Incorporated |
3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
|
|
KR20210124384A
(ko)
*
|
2019-02-08 |
2021-10-14 |
코닝 인코포레이티드 |
펄스형 레이저 빔 초점 라인 및 증기 에칭을 사용하여 투명 워크피스를 레이저 가공하는 방법
|
|
KR20250083587A
(ko)
|
2019-02-21 |
2025-06-10 |
코닝 인코포레이티드 |
구리-금속화된 쓰루 홀을 갖는 유리 또는 유리 세라믹 물품 및 이를 제조하기 위한 공정
|
|
CN113613825B
(zh)
|
2019-03-21 |
2024-11-19 |
康宁股份有限公司 |
使用环形涡旋激光束在基于玻璃的物体中形成微孔的系统及方法
|
|
TW202103830A
(zh)
*
|
2019-03-25 |
2021-02-01 |
美商康寧公司 |
在玻璃中形成穿孔之方法
|
|
US11952310B2
(en)
|
2019-05-10 |
2024-04-09 |
Corning Incorporated |
Silicate glass compositions useful for the efficient production of through glass vias
|
|
KR102740982B1
(ko)
|
2019-05-10 |
2024-12-11 |
코닝 인코포레이티드 |
창에 마운트 되는 트랜스시버 유닛용 투명 패키지
|
|
WO2021003018A1
(en)
|
2019-07-01 |
2021-01-07 |
Corning Incorporated |
Method of laser processing of transparent workpieces using curved quasi-non-diffracting laser beams
|
|
JP7205413B2
(ja)
*
|
2019-08-07 |
2023-01-17 |
株式会社Sumco |
レーザマーク付きシリコンウェーハの製造方法
|
|
EP4037863A1
(en)
|
2019-10-03 |
2022-08-10 |
Orvinum AG |
Apparatus for creating a hole in a glass container
|
|
WO2021108079A1
(en)
|
2019-11-27 |
2021-06-03 |
Corning Incorporated |
Fabricating laminate glass with blind vias
|
|
CN112894146A
(zh)
*
|
2019-12-04 |
2021-06-04 |
大族激光科技产业集团股份有限公司 |
玻璃基板通孔的激光加工方法和装置
|
|
WO2022055671A1
(en)
*
|
2020-09-09 |
2022-03-17 |
Corning Incorporated |
Glass substrates with blind vias having depth uniformity and methods for forming the same
|
|
US20230295036A1
(en)
*
|
2020-10-06 |
2023-09-21 |
Nippon Electric Glass Co., Ltd. |
Glass substrate having through holes
|
|
US20230402337A1
(en)
|
2020-11-16 |
2023-12-14 |
Corning Incorporated |
3d interposer with through glass vias - method of increasing adhesion between copper and glass surfaces and articles therefrom
|
|
CN113292236A
(zh)
*
|
2021-05-21 |
2021-08-24 |
江西沃格光电股份有限公司 |
一种Mini-LED基板通孔的形成方法及电子设备
|
|
KR102605271B1
(ko)
*
|
2021-07-13 |
2023-11-27 |
주식회사 중우나라 |
유리기판의 관통홀 형성방법
|
|
WO2024118449A1
(en)
*
|
2022-11-30 |
2024-06-06 |
Corning Incorporated |
Systems and methods for laser micromachining substrates using a liquid-assist medium and articles fabricated by the same
|
|
CN117263520A
(zh)
*
|
2023-08-29 |
2023-12-22 |
北方夜视技术股份有限公司 |
一种铅玻璃通孔微通道板、其制作方法与用途
|
|
WO2025164391A1
(ja)
*
|
2024-01-30 |
2025-08-07 |
Ａｇｃ株式会社 |
ガラス基板の製造方法
|