JP2014216930A - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
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- JP2014216930A JP2014216930A JP2013094285A JP2013094285A JP2014216930A JP 2014216930 A JP2014216930 A JP 2014216930A JP 2013094285 A JP2013094285 A JP 2013094285A JP 2013094285 A JP2013094285 A JP 2013094285A JP 2014216930 A JP2014216930 A JP 2014216930A
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- 239000004065 semiconductor Substances 0.000 description 7
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- General Physics & Mathematics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
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Abstract
【解決手段】撮像装置1は、撮像部と、比誘電率が酸化シリコンより低い低誘電率材料からなる絶縁層を含む複数の層を有する回路部とが、第1の主面に形成され、貫通配線を介して回路部と接続された接合端子が第2の主面に形成されている平面視矩形の撮像素子チップ30と、撮像素子チップ30の第1の主面に接着され、撮像素子チップ30と平面視寸法が同じカバーガラス10と、撮像素子チップ30が収納された、内壁の角部49が曲線からなるシールドケース40と、撮像素子チップ30の側面とシールドケース40との隙間を充填している、角部49以外の厚さが100μm以下の封止樹脂と、を具備する。
【選択図】図3
Description
図1〜図3に示すように、第1実施形態の撮像装置1は、撮像素子チップ30と、カバーガラス10と、撮像素子チップ30が収納されたシールドケース40と、撮像素子チップ30の側面とシールドケース40の内壁との隙間を充填している封止樹脂50と、を具備する。
次に、第3実施形態の撮像装置1Bについて説明する。撮像装置1Bは撮像装置1、1Aと類似しているので同じ構成要素には同じ符号を付し説明は省略する。
Claims (4)
- 撮像部と、前記撮像部と信号を送受信する、比誘電率が酸化シリコンより低い低誘電率材料からなる絶縁層を含む複数の層を有する回路部とが第1の主面に形成され、前記回路部と貫通配線を介して前記回路部と接続された接合端子が第2の主面に形成されている平面視矩形の撮像素子チップと、
前記撮像素子チップの前記第1の主面に接着された、前記撮像素子チップと平面視寸法が同じカバーガラスと、
前記撮像素子チップが収納された、内壁の角部の断面形状が曲線からなるシールドケースと、
前記撮像素子チップの側面と先記シールドケースとの隙間を充填している、前記角部以外の厚さが100μm以下の封止樹脂と、を具備することを特徴とする撮像装置。 - 前記撮像素子チップの前記シールドケースの前記内壁の角部と対向する角部が、面取り加工されていることを特徴とする請求項1に記載の撮像装置。
- 前記内壁の角部の断面形状の曲率半径が、340μm以下であることを特徴とする請求項1に記載の撮像装置。
- 前記カバーガラスの前方に配設された対物レンズ光学系を具備し、
前記シールドケースが、前記対物レンズ光学系のレンズ枠と一体であることを特徴とする請求項2又は請求項3に記載の撮像装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094285A JP6270336B2 (ja) | 2013-04-26 | 2013-04-26 | 撮像装置 |
PCT/JP2014/059257 WO2014174994A1 (ja) | 2013-04-26 | 2014-03-28 | 撮像装置 |
CN201480023339.1A CN105144385B (zh) | 2013-04-26 | 2014-03-28 | 摄像装置 |
EP14788797.0A EP2991111A4 (en) | 2013-04-26 | 2014-03-28 | Image pickup apparatus |
US14/918,843 US9520428B2 (en) | 2013-04-26 | 2015-10-21 | Image pickup apparatus |
Applications Claiming Priority (1)
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---|---|---|---|
JP2013094285A JP6270336B2 (ja) | 2013-04-26 | 2013-04-26 | 撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014216930A true JP2014216930A (ja) | 2014-11-17 |
JP6270336B2 JP6270336B2 (ja) | 2018-01-31 |
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JP2013094285A Active JP6270336B2 (ja) | 2013-04-26 | 2013-04-26 | 撮像装置 |
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JP (1) | JP6270336B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016084393A (ja) * | 2014-10-24 | 2016-05-19 | 理研香料ホールディングス株式会社 | 燃料用着臭剤 |
CN110137188A (zh) * | 2018-02-08 | 2019-08-16 | 半导体元件工业有限责任公司 | 具有倒角的半导体封装以及相关方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001094843A (ja) * | 1999-09-20 | 2001-04-06 | Olympus Optical Co Ltd | 撮像装置 |
JP2008130738A (ja) * | 2006-11-20 | 2008-06-05 | Fujifilm Corp | 固体撮像素子 |
JP2009290000A (ja) * | 2008-05-29 | 2009-12-10 | Toshiba Corp | 固体撮像装置 |
JP2011060933A (ja) * | 2009-09-09 | 2011-03-24 | Panasonic Corp | 固体撮像装置及びその製造方法 |
JP2012033718A (ja) * | 2010-07-30 | 2012-02-16 | On Semiconductor Trading Ltd | 半導体装置及びその製造方法 |
JP2012033894A (ja) * | 2010-06-30 | 2012-02-16 | Canon Inc | 固体撮像装置 |
-
2013
- 2013-04-26 JP JP2013094285A patent/JP6270336B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001094843A (ja) * | 1999-09-20 | 2001-04-06 | Olympus Optical Co Ltd | 撮像装置 |
JP2008130738A (ja) * | 2006-11-20 | 2008-06-05 | Fujifilm Corp | 固体撮像素子 |
JP2009290000A (ja) * | 2008-05-29 | 2009-12-10 | Toshiba Corp | 固体撮像装置 |
JP2011060933A (ja) * | 2009-09-09 | 2011-03-24 | Panasonic Corp | 固体撮像装置及びその製造方法 |
JP2012033894A (ja) * | 2010-06-30 | 2012-02-16 | Canon Inc | 固体撮像装置 |
JP2012033718A (ja) * | 2010-07-30 | 2012-02-16 | On Semiconductor Trading Ltd | 半導体装置及びその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016084393A (ja) * | 2014-10-24 | 2016-05-19 | 理研香料ホールディングス株式会社 | 燃料用着臭剤 |
CN110137188A (zh) * | 2018-02-08 | 2019-08-16 | 半导体元件工业有限责任公司 | 具有倒角的半导体封装以及相关方法 |
JP2019165205A (ja) * | 2018-02-08 | 2019-09-26 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 面取りされた角部を有する半導体パッケージ及び関連方法 |
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