JP2014195042A5 - - Google Patents

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Publication number
JP2014195042A5
JP2014195042A5 JP2013264875A JP2013264875A JP2014195042A5 JP 2014195042 A5 JP2014195042 A5 JP 2014195042A5 JP 2013264875 A JP2013264875 A JP 2013264875A JP 2013264875 A JP2013264875 A JP 2013264875A JP 2014195042 A5 JP2014195042 A5 JP 2014195042A5
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JP
Japan
Prior art keywords
substrate
supply hole
gas supply
recess
warpage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013264875A
Other languages
English (en)
Japanese (ja)
Other versions
JP6283218B2 (ja
JP2014195042A (ja
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Publication date
Application filed filed Critical
Priority to JP2013264875A priority Critical patent/JP6283218B2/ja
Priority claimed from JP2013264875A external-priority patent/JP6283218B2/ja
Priority to US14/178,664 priority patent/US9362151B2/en
Publication of JP2014195042A publication Critical patent/JP2014195042A/ja
Publication of JP2014195042A5 publication Critical patent/JP2014195042A5/ja
Application granted granted Critical
Publication of JP6283218B2 publication Critical patent/JP6283218B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013264875A 2013-02-27 2013-12-24 基板の反り矯正装置及び基板の反り矯正方法 Active JP6283218B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013264875A JP6283218B2 (ja) 2013-02-27 2013-12-24 基板の反り矯正装置及び基板の反り矯正方法
US14/178,664 US9362151B2 (en) 2013-02-27 2014-02-12 Substrate warp correcting device and substrate warp correcting method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013036842 2013-02-27
JP2013036842 2013-02-27
JP2013264875A JP6283218B2 (ja) 2013-02-27 2013-12-24 基板の反り矯正装置及び基板の反り矯正方法

Publications (3)

Publication Number Publication Date
JP2014195042A JP2014195042A (ja) 2014-10-09
JP2014195042A5 true JP2014195042A5 (enExample) 2016-10-20
JP6283218B2 JP6283218B2 (ja) 2018-02-21

Family

ID=51388547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013264875A Active JP6283218B2 (ja) 2013-02-27 2013-12-24 基板の反り矯正装置及び基板の反り矯正方法

Country Status (2)

Country Link
US (1) US9362151B2 (enExample)
JP (1) JP6283218B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015019035A (ja) * 2013-06-11 2015-01-29 イビデン株式会社 配線板の製造方法、配線板の反り修正方法及び配線板の製造装置
US9633874B1 (en) * 2014-07-17 2017-04-25 Altera Corporation Package substrate warpage reshaping apparatus and method
KR101776449B1 (ko) * 2014-09-27 2017-09-07 인텔 코포레이션 단방향성 가열을 갖는 강화 유리를 이용한 기판 휘어짐 제어
US10325790B2 (en) * 2016-04-29 2019-06-18 Applied Materials, Inc. Methods and apparatus for correcting substrate deformity
US20180177045A1 (en) * 2016-12-21 2018-06-21 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Embedding Component in Component Carrier by Component Fixation Structure
KR101842590B1 (ko) * 2017-11-23 2018-03-29 주식회사 다이나테크 패널 타입 몰드 웨이퍼의 휨 교정장치
KR102393166B1 (ko) * 2020-11-23 2022-05-02 주식회사 알에스이 인쇄회로기판 휨 교정 기구

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553484A (en) * 1978-10-16 1980-04-18 Fujitsu Ltd Method of correcting slet of printed board
JPH02116550A (ja) * 1988-10-26 1990-05-01 Matsushita Electric Works Ltd プリント配線板の反り矯正方法
JPH09148729A (ja) * 1995-11-28 1997-06-06 Nec Kansai Ltd はんだリフロー装置及びプリント基板製造方法
JP2011222578A (ja) * 2010-04-05 2011-11-04 Murata Mfg Co Ltd 電子部品製造装置及び電子部品製造方法
KR20120009713A (ko) * 2010-07-20 2012-02-02 삼성전자주식회사 인쇄회로기판 조립체의 제조장치 및 이의 제조방법

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